Ball grid array
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A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.
The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern. These pins conduct electrical signals from the integrated circuit to the printed circuit board (PCB) on which it is placed. In a BGA, the pins are replaced by balls of solder stuck to the bottom of the package. These solder spheres can be placed manually or with automated equipment. The solder spheres are held in place with a tacky flux until soldering occurs. The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, causing the solder balls to melt. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies.
High density 
The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew. BGAs do not have this problem when the solder is factory-applied to the package.
Heat conduction 
A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.
Low-inductance leads 
The shorter an electrical conductor, the lower its inductance, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low inductances and therefore have far superior electrical performance to leaded devices.
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Noncompliant leads 
A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically compliant[disambiguation needed]. As with all surface mount devices, bending due to a difference in coefficient of thermal expansion between PCB substrate and BGA (thermal stress) or flexing and vibration (mechanical stress) can cause the solder joints to fracture.
Thermal expansion issues can be overcome by matching the mechanical and thermal characteristics of the PCB to those of the package. Typically, plastic BGA devices more closely match PCB thermal characteristics than ceramic devices.
The predominant use of RoHS compatible lead-free solder alloy assemblies have presented some further challenges to BGAs including "head in pillow" soldering phenomenon, "pad cratering" problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions such as high temperature, high thermal shock and high gravitational force environments, in part due to lower ductility of RoHS-compliant solders.
Mechanical stress issues can be overcome by bonding the devices to the board through a process called "under filling", which injects an epoxy mixture under the device after it is soldered to the PCB, effectively gluing the BGA device to the PCB. There are several types of under fill materials in use with differing properties relative to workability and thermal transfer. An additional advantage of under fill is that it limits tin whisker growth.
Another solution to non-compliant leads is to put a "compliant layer" in the package that allows the balls to physically move in relation to the package. This technique has become standard for packaging DRAMs in BGA packages.
Difficulty of inspection 
Once the package is soldered down, it may be difficult to look for soldering faults. X-ray machines, Industrial CT Scanning machines, special microscopes as well as endoscopes to look underneath the soldered package have been developed to overcome this problem. If a BGA is found to be badly soldered, it can be removed in a rework station, which is a jig fitted with infrared lamp (or hot air), a thermocouple and a vacuum device for lifting the package. The BGA can be replaced with a new one, or the BGA can be refurbished (or reballed) and re-installed on the circuit board. Pre-configured solder balls matching the array pattern (preforms) can be used to reballing the BGA's when only one or a few need to be reworked.
Difficulties with BGAs during circuit development 
During development it is not practical to solder BGAs into place, and sockets are used instead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short.
Cost of equipment 
Expensive equipment is required to reliably solder BGA packages; hand-soldering BGA packages is very difficult and unreliable, usable only for the smallest packages in the smallest quantities.
- CABGA: Chip Array Ball Grid Array
- CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached.
- CTBGA: Thin Chip Array Ball Grid Array
- CVBGA: Very Thin Chip Array Ball Grid Array
- DSBGA: Die-Size Ball Grid Array
- FBGA or Fine Ball Grid Array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs.
- Known as FineLine BGA by Altera.
- FCmBGA: Flip Chip Molded Ball Grid Array
- LBGA: Low-profile Ball Grid Array
- LFBGA: Low-profile Fine-pitch Ball Grid Array
- MBGA: Micro Ball Grid Array
- MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array
- PBGA: Plastic Ball Grid Array
- SuperBGA (SBGA): Super Ball Grid Array
- TABGA: Tape Array BGA
- TBGA: Thin BGA
- TEPBGA: Thermally Enhanced Plastic Ball Grid Array
- TFBGA or Thin and Fine Ball Grid Array
- UFBGA and UBGA and Ultra Fine Ball Grid Array based on pitch ball grid array.
To make it easier to use ball grid array devices, most BGA packages only have balls in the outer rings of the package, leaving the innermost square empty.
Intel used a package designated BGA1 for their Pentium II and early Celeron mobile processors. BGA2 is Intel's package for their Pentium III and some later Celeron mobile processors. BGA2 is also known as FCBGA-479. It replaced its predecessor, BGA1.
For example, The "Micro-FCBGA" (Flip Chip Ball Grid Array) is Intel's current[when?] BGA mounting method for mobile processors that use a flip chip binding technology. It was introduced with the Coppermine Mobile Celeron. Micro-FCBGA has 479 balls that are 0.78 mm in diameter. The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable.
The 479 balls of the Micro-FCBGA Package (a package almost identical to the 478-pin Socketable Micro-FCPGA Package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.
Primary end-users of BGA's are original equipment manufacturers (OEMs). However there is also a market among electronic hobbyist and do it yourself (DIY) such as the increasingly popular maker movement. While OEMs generally source their components from the manufacturer, or the manufacturer's distributor, the hobbyist is left to find BGA's on the after market through electronic component brokers or distributors.
See also 
|The Wikibook Practical Electronics has a page on the topic of: using ball grid arrays|
- Dual in-line package (DIP)
- Pin grid array (PGA)
- Land grid array (LGA)
- TQFP (thin quad flat pack)
- Small-outline integrated circuit (SOIC)
- Chip carrier Chip packaging and package types list
- Embedded Wafer Level Ball Grid Array
- "Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array", White Paper
- "Amkor & Nokia Japan: 0.3mm Pitch CSP / BGA Development for Mobile Terminals”, White Paper
- Soldering 101 - A Basic Overview
- "CT Services - Overview." Jesse Garant & Associates. August 17, 2010. http://www.jgarantmc.com/ct-services.html
- Intel. "Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages". Datasheet. 2002.
- FCBGA-479 (Micro-FCBGA)
- "More than just digital quilting: The "maker" movement could change how science is taught and boost innovation. It may even herald a new industrial revolution". The Economist. Dec 3 2011.