|Predecessor||Ivy Bridge (tick)
Broadwell will adopt the Multi-Chip Package (MCP) design. The new layout might also move the integrated voltage regulator (IVR) off-die and back onto the motherboards, in an attempt to reduce the CPU's heat production.
Broadwell will be used in conjunction with Intel 9 Series chipsets.
Broadwell is expected to be launched in four major variants:
- LGA 1150 socket:
- Broadwell-D: desktop version
- BGA package:
- Broadwell-H: 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats. It may come in two different variants, as single and dual chips; the dual chips (4 cores, 8 threads) will have GT3e and GT2 GPU, while a single chip (SoC; 2 cores, 4 threads) will have GT3e GPU. Maximum supported memory is 32 GB of DDR3L-1600.
- Broadwell-U: 15 W and 28 W TDP classes (SoC), for motherboards with PCH-LP chipset for Intel's ultrabook and NUC platforms. GT3, GT2 and GT1 GPU will be used, while maximum supported memory is either 16 GB of DDR3L-1600, or 8 GB of LPDDR3-1600.
- Broadwell-Y: 4.5 W and 3.5 W TDP class (SoC), for tablets and certain ultrabook-class implementations. GT2 GPU will be used, while maximum supported memory is 8 GB of LPDDR3-1600.
- rPGA 947 socket:
- Broadwell-M: mobile/laptop version
- LGA 2011-3 socket:
- Broadwell-EP: To be marked as Xeon E5-2600 v4 etc., while using the C610 Wellsburg chipset platform. Up to 18 cores and 36 threads, up to 45 MB of total cache and 40 PCI Express 3.0 lanes, with 70–160 W TDP classes. Maximum supported memory speed is quad-channel DDR4-2400.
- Broadwell-EX: Brickland platform, for mission-critical servers. Intel QuickPath Interconnect (QPI) is expected to be updated to version 1.1, enabling seamless scaling beyond eight-socket systems. Maximum supported memory speeds are expected to be DDR3-1600 and DDR4-3200.
Instruction set extensions
- Intel ADX:
MULXfor improving performance of arbitrary-precision integer operations
RDSEEDfor generating 16-, 32- or 64-bit random numbers according to NIST SP 800-90B and 800-90C
On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013.
On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This will coincide with the release of Intel's 9-series chipset, which may be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket.
On 12 February 2014, digitimes.com quoted "upstream supply chain" sources saying that Broadwell production had been postponed from the first quarter of 2014 to the fourth quarter of 2014, with mass shipments in the first quarter of 2015.
No new mobile roadmaps have yet leaked to clarify if mobile Broadwell will be available in 2014. A leaked slide shows Broadwell-E/EP/EX in 2015.
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