Broadwell is Intel's codename for the second processor in its Haswell microarchitecture. In keeping with Intel's tick-tock principle, Broadwell is the next step in semiconductor fabrication, with feature size reduced to 14 nanometers.
Broadwell will adopt the Multi-Chip Package (MCP) design. The new layout might also move the integrated voltage regulator (IVR) off-die and back onto the motherboards, in an attempt to reduce CPU's heat production.
Broadwell will be used in conjunction with Intel 9 Series chipsets.
Broadwell is expected to launch in three major forms:
- Broadwell-D: desktop version (LGA 1150 socket)
- BGA version:
- Broadwell-H: 35 W and 55 W TDP classes, for "all-in-one" systems, Mini-ITX form factor motherboards, and other small footprint formats
- Broadwell-U: less than 15 W TDP class (SoC), for Intel's ultrabook and NUC platforms
- Broadwell-Y: less than 10 W TDP class (SoC), for tablets and certain ultrabook-class implementations
- Broadwell-M: mobile/laptop version (PGA socket).
Instruction set extensions
- ADOX/ADCX/MULX for improving performance of arbitrary-precision integer operations
- RDSEED to generate 16-, 32- or 64-bit random numbers according to NIST SP 800-90B and 800-90C
- PREFETCHW instruction
On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013.
On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This will coincide with the release of Intel's 9-series chipset, which may be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket.
No new mobile roadmaps have yet leaked to clarify if mobile Broadwell will be available in 2014. A leaked slide shows Broadwell-E/EP/EX in 2015.
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