|L1 cache||64 KB per core|
|L2 cache||256 KB per core|
|L3 cache||2–4 MB (shared)|
|L4 cache||64 MB of eDRAM (Iris Pro models only)|
|Transistors||14 nm transistors|
|Last level cache||35 MB|
|Instructions||MMX, AES-NI, CLMUL, FMA3|
Broadwell (formerly known as Rockwell) is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick-tock principle as the next step in semiconductor fabrication. Unlike the previous tick-tock iterations, Broadwell will not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there will be no low-end desktop CPUs based on Broadwell.
Broadwell is expected to be launched in three major variants:
- BGA package:
- Broadwell-Y: system on a chip (SoC); 4.5 W and 3.5 W thermal design power (TDP) classes, for tablets and certain ultrabook-class implementations. GT2 GPU will be used, while maximum supported memory is 8 GB of LPDDR3-1600. These will be the first chips to roll out, and are expected for Q3/Q4 2014. At Computex 2014, Intel announced that these chips will be branded as Core M.
- Broadwell-U: SoC; two TDP classes – 15 W for 2+2 and 2+3 configurations (two cores with a GT2 or GT3 GPU) as well as 28 W for 2+3 configurations. Designed to be used on motherboards with the PCH-LP chipset for Intel's ultrabook and NUC platforms. Maximum supported is up to 16 GB of DDR3 or LPDDR3 memory, with DDR3-1600 and LPDDR3-1867 as the maximum memory speeds. The 2+2 configuration is scheduled for Q4 2014, while the 2+3 is estimated for Q1 2015. For Broadwell-U models with integrated 5x00 GPUs, die size is 82 mm2 with a total of 1.3 billion transistors, while for the models with 6100 and 6200 GPUs the die size is 133 mm2 with a total of 1.9 billion transistors.
- Broadwell-H: 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats. It may come in two different variants, as single and dual chips; the dual chips (4 cores, 8 threads) will have GT3e and GT2 GPU, while a single chip (SoC; two cores, four threads) will have GT3e GPU. Maximum supported memory is 32 GB of DDR3-1600. These are scheduled for Q2 2015.
- LGA 1150 socket:
- LGA 2011-v3 socket:
- Broadwell-EP: to be marketed as Xeon E5-2600 v4 etc., while using the C610 Wellsburg chipset platform. Up to 18 cores and 36 threads, up to 45 MB of total cache and 40 PCI Express 3.0 lanes, with 70–160 W TDP classes. Maximum supported memory speed is quad-channel DDR4-2400.
- Broadwell-EX: Brickland platform, for mission-critical servers. Intel QuickPath Interconnect (QPI) is expected to be updated to version 1.1, enabling seamless scaling beyond eight-socket systems. Maximum supported memory speeds are expected to be DDR3-1600 and DDR4-3200.
Instruction set extensions
- Intel ADX:
ADCXfor improving performance of arbitrary-precision integer operations
RDSEEDfor generating 16-, 32- or 64-bit random numbers from a thermal noise entropy stream, according to NIST SP 800-90B and 800-90C
SMAP(Supervisor Mode Access Prevention) – optionally disallows access from kernel-space memory to user-space memory, a feature aimed at making it harder to exploit software bugs.
Broadwell's Intel Quick Sync Video hardware video decoder adds VP8 hardware decoding support. Also, it will have two independent bit stream decoder (BSD) rings to process video commands on GT3 GPUs; this will allow one BSD ring to process decoding and the other BSD ring to process encoding at the same time.
List of Broadwell processors
List of announced mobile processors is as follows:
|Target segment||Cores (threads)||Processor branding and model||GPU model||Base frequency||Turbo frequency||TDP||cTDP down||Graphics clock rate||L3 cache||Release date||Price (USD)|
|Single Core||Dual Core||Base||Max|
|Mainstream||2(4)||Core i7||5650U||HD 6000||2.2 GHz||3.2 GHz||3.1 GHz||15 W||600 MHz / 9.5 W||300 MHz||1 GHz||4 MB||$426|
|5600U||HD 5500||2.6 GHz||3.2 GHz||3.1 GHz||15 W||600 MHz / 7.5 W||300 MHz||950 MHz||4 MB||$393|
|5557U||Iris 6100||3.1 GHz||3.4 GHz||3.4 GHz||28 W||N/A / 23 W||300 MHz||1.1 GHz||4 MB||$426|
|5550U||HD 6000||2.0 GHz||3.0 GHz||2.9 GHz||15 W||600 MHz / 9.5 W||300 MHz||1 GHz||4 MB||$426|
|5500U||HD 5500||2.4 GHz||3.0 GHz||2.9 GHz||15 W||600 MHz / 7.5 W||300 MHz||950 MHz||4 MB||$393|
|Core i5||5350U||HD 6000||1.8 GHz||2.9 GHz||2.7 GHz||15 W||600 MHz / 9.5 W||300 MHz||1 GHz||3 MB||$315|
|5300U||HD 5500||2.3 GHz||2.9 GHz||2.7 GHz||15 W||600 MHz / 7.5 W||300 MHz||900 MHz||3 MB||$281|
|5287U||Iris 6100||2.9 GHz||3.3 GHz||3.3 GHz||28 W||600 MHz / 23 W||300 MHz||1.1 GHz||3 MB||$315|
|5257U||Iris 6100||2.7 GHz||3.1 GHz||3.1 GHz||28 W||600 MHz / 23 W||300 MHz||1.05 GHz||3 MB||$315|
|5250U||HD 6000||1.6 GHz||2.7 GHz||2.5 GHz||15 W||600 MHz / 9.5 W||300 MHz||950 MHz||3 MB||$315|
|5200U||HD 5500||2.2 GHz||2.7 GHz||2.5 GHz||15 W||600 MHz / 7.5 W||300 MHz||900 MHz||3 MB||February 2015||$281|
|Core i3||5157U||Iris 6100||2.5 GHz||N/A||N/A||28 W||600 MHz / 23 W||300 MHz||1 GHz||3 MB||January 2015||$315|
|5020U||HD 5500||2.2 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||900 MHz||3 MB||March 2015||$281|
|5015U||HD 5500||2.1 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||850 MHz||3 MB||March 2015||$275|
|5010U||HD 5500||2.1 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||900 MHz||3 MB||January 2015||$281|
|5005U||HD 5500||2.0 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||850 MHz||3 MB||January 2015||$275|
|Pentium||3825U||HD Graphics||1.9 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||850 MHz||2 MB||March 2015|
|2(2)||3805U||HD Graphics||1.9 GHz||N/A||N/A||15 W||600 MHz / 10 W||100 MHz||800 MHz||2 MB||$161|
|Celeron||3755U||HD Graphics||1.7 GHz||N/A||N/A||15 W||600 MHz / 10 W||100 MHz||800 MHz||2 MB||$107|
|3205U||HD Graphics||1.5 GHz||N/A||N/A||15 W||600 MHz / 10 W||100 MHz||800 MHz||2 MB||$107|
Branding & Model
|GPU Model||Programmable TDP:69–72||CPU Turbo||Graphics Clock rate||L3
|SDP:71||cTDP down[a]||Nominal TDP[b]||cTDP up[c]||1-core||Normal||Turbo|
|Mainstream||2 (4)||Core M (vPro)||5Y71||HD 5300
|3.5 W||3.5 W / 600 MHz||4.5 W / 1.2 GHz||6 W / 1.4 GHz||2.9 GHz||300 MHz||900 MHz||4 MB||N/A||October 27, 2014||$281|
|5Y70||N/A||N/A||4.5 W / 1.1 GHz||N/A||2.6 GHz||100 MHz||850 MHz||September 5, 2014||$281|
|Core M||5Y51||3.5 W||3.5 W / 600 MHz||6 W / 1.3 GHz||300 MHz||900 MHz||October 27, 2014||$281|
|5Y31||4.5 W / 900 MHz||6 W / 1.1 GHz||2.4 GHz||850 MHz|
|5Y10c||4.5 W / 800 MHz||6 W / 1 GHz||2.0 GHz||800 MHz|
|5Y10a||N/A||N/A||N/A||100 MHz||September 5, 2014||$281|
|5Y10||4 W / ? MHz|
- When a cooler or quieter mode of operation is desired, this mode specifies a lower TDP and lower guaranteed frequency versus the nominal mode.:71–72
- This is the processor's rated frequency and TDP.:71–72
- When extra cooling is available, this mode specifies a higher TDP and higher guaranteed frequency versus the nominal mode.:71–72
XEON Server processors Broadwell core D-Type
|Target segment||Cores (threads)||Processor branding and model||GPU model||Base frequency||Turbo frequency||TDP||socket||Memory||L3 cache||Release date||Price (USD)|
|Single Core||All Cores||Type||Channel|
|SoC Server||8(16)||Xeon D||D-1540||N/A||2 GHz||N/A||2.6 GHz||45 W||FCBGA 1667||DDR4||dual||12 MB||Q1 2015||$581|
|4(8)||D-1520||N/A||2.2 GHz||N/A||2.6 GHz||6 MB||Q1 2015||$199|
Roadmap and history
On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013. Krzanich also claimed that the chips would ship by the end of 2013; however, the shipment was delayed due to low yields from Intel's 14 nm process.
On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This will coincide with the release of Intel's 9-series chipset, which may be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket.
On May 18, 2014, Reuters quoted Intel's CEO promising that Broadwell-based PCs will be on shelves for the holiday season, but probably not for the back-to-school shopping.
On June 18, 2014, Intel told CNET that while some specialized Broadwell-based products would be out in Q4 2014, "broader availability" (including mobile CPUs) would only happen in 2015.
As of July 2014[update], Broadwell CPUs are available to Intel's hardware partners in sample quantities. Intel is expected to release 17 Broadwell U series family microprocessors at CES 2015. Also, according to a leak posted on vr-zone, Broadwell-E chips will be available in 2016.
On August 11, 2014, Intel unveiled formally its 14 nm manufacturing process, which is used for Broadwell, and indicated that mobile variants of the process will be known as Core M products. Additionally, Core M products were announced to be shipping during the end of 2014, with desktop variants shipping shortly after.
On September 5, 2014, Intel launched the first three Broadwell-based processors that belong to the low-TDP Core M family, Core M 5Y10, Core M 5Y10a and Core M 5Y70.
On October 9, 2014, the first laptop with Broadwell Intel Core M 5Y70 CPU, Lenovo Yoga 3 Pro, was launched.
On October 31, 2014, four more Broadwell based CPUs were launched belonging to Core M Family, increasing the number of launched Broadwell CPUs to seven.
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