|This article is outdated. (October 2014)|
|Predecessor||Ivy Bridge (tick)
Broadwell is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. Expected to be released in late 2014, Broadwell is a "tick" in Intel's tick-tock principle as the next step in semiconductor fabrication. Unlike the previous tick-tock iterations, Broadwell will not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there will be no low-end desktop CPUs based on Broadwell.
Broadwell is expected to be launched in three major variants:
- BGA package:
- Broadwell-Y: System-on-chip (SoC); 4.5 W and 3.5 W thermal design power (TDP) classes, for tablets and certain ultrabook-class implementations. GT2 GPU will be used, while maximum supported memory is 8 GB of LPDDR3-1600. These will be the first chips to roll out, and are expected for Q3/Q4 2014. At Computex 2014, Intel announced that these chips will be branded as Core M.
- Broadwell-U: SoC; two TDP classes – 15 W for 2+2 and 2+3 configurations (two cores with a GT2 or GT3 GPU) as well as 28 W for 2+3 configurations. Designed to be used on motherboards with the PCH-LP chipset for Intel's ultrabook and NUC platforms. Maximum supported memory is either 16 GB of DDR3L-1600, or 8 GB of LPDDR3-1600. The 2+2 configuration is scheduled for Q4 2014, while the 2+3 is estimated for Q1 2015.
- Broadwell-H: 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats. It may come in two different variants, as single and dual chips; the dual chips (4 cores, 8 threads) will have GT3e and GT2 GPU, while a single chip (SoC; 2 cores, 4 threads) will have GT3e GPU. Maximum supported memory is 32 GB of DDR3L-1600. These are scheduled for Q2 2015.
- LGA 1150 socket:
- LGA 2011-v3 socket:
- Broadwell-EP: To be marketed as Xeon E5-2600 v4 etc., while using the C610 Wellsburg chipset platform. Up to 18 cores and 36 threads, up to 45 MB of total cache and 40 PCI Express 3.0 lanes, with 70–160 W TDP classes. Maximum supported memory speed is quad-channel DDR4-2400.
- Broadwell-EX: Brickland platform, for mission-critical servers. Intel QuickPath Interconnect (QPI) is expected to be updated to version 1.1, enabling seamless scaling beyond eight-socket systems. Maximum supported memory speeds are expected to be DDR3-1600 and DDR4-3200.
Instruction set extensions
- Intel ADX:
MULXfor improving performance of arbitrary-precision integer operations
RDSEEDfor generating 16-, 32- or 64-bit random numbers according to NIST SP 800-90B and 800-90C
Broadwell's Intel Quick Sync Video hardware video decoder adds VP8 hardware decoding support. Also, it will have two independent bit stream decoder (BSD) rings to process video commands on GT3 GPUs; this will allow one BSD ring to process decoding and the other BSD ring to process encoding at the same time.
List of Broadwell processors
List of announced mobile processors is as follows:
Branding & Model
|GPU Model||Programmable TDP:69–72||CPU Turbo||Graphics Clock rate||L3
|SDP:71||cTDP down[a]||Nominal TDP[b]||cTDP up[c]||1-core||Normal||Turbo|
|Mainstream||2 (4)||Core M (vPro)||5Y70||HD 5300
|N/A||N/A||4.5 W / 1.1 GHz||N/A||2.6 GHz||100 MHz||850 MHz||4 MB||N/A||September 5, 2014||$281|
|Core M||5Y10a||4.5 W / 800 MHz||2.0 GHz||800 MHz|
|5Y10||4 W / ? MHz|
- When a cooler or quieter mode of operation is desired, this mode specifies a lower TDP and lower guaranteed frequency versus the nominal mode.:71–72
- This is the processor's rated frequency and TDP.:71–72
- When extra cooling is available, this mode specifies a higher TDP and higher guaranteed frequency versus the nominal mode.:71–72
On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013. Krzanich also claimed that the chips would ship by the end of 2013; however, the shipment was delayed due to low yields from Intel's 14 nm process.
On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This will coincide with the release of Intel's 9-series chipset, which may be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket.
On 18 May 2014, Reuters quoted Intel's CEO promising that Broadwell-based PCs will be on shelves for the holiday season, but probably not for the back-to-school shopping.
On 18 June 2014, Intel told CNET that while some specialized Broadwell-based products would be out in Q4 2014, "broader availability" (including mobile CPUs) would only happen in 2015.
On 11 August 2014 Intel unveiled formally its 14 nm manufacturing process, which is used for Broadwell, and indicated that mobile variants of the process will be known as Core M products. Additionally, Core M products were announced to be shipping during the end of 2014, with desktop variants shipping shortly after.
- "22nm Details" (PDF) (presentation). Intel. Retrieved 2012-01-04.
- Demerjian, Charlie. "After Intel's Haswell comes Broadwell". SemiAccurate. Retrieved 2012-01-04.
- Broekhuijsen, Niels (2014-05-22). "Intel Broadwell CPUs to Arrive Later This Year". Tom's Hardware. Retrieved 2014-05-31.
- Lower-end desktop CPUs won’t get Broadwell, will need to wait for Skylake
- Reynolds, Sam (2013-08-26). "Intel's 9-series chipsets will support Broadwell". vr-zone.com. Archived from the original on 2013-11-20. Retrieved 2013-11-20.
- Mark Hachman (2014-07-15). "Intel shipping Broadwell, but next-gen Skylake chip could slip". PCWorld. Retrieved 2014-07-19.
- "Intel Broadwell Production Plan Leaked – BDW-H Delayed To May 2015". WCCFTech. Retrieved May 21, 2014.
- "Intel’s 14nm Process ‘Broadwell’ Lineup Details Leaked". WCCFTech. Retrieved December 12, 2013.
- Ian Cutress (2014-06-03). "Intel Keynote at Computex 2014: 14nm Core-M, SoFIA, Devil’s Canyon, DC P3700 and RealSENSE". AnandTech. Retrieved 2014-06-05.
- "Intel Broadwell GPUs to use HD 5x00, Iris 6100 and Iris Pro 6200 branding". cpu-world.com.
- "Desktop Broadwell LGA is Socket 1150". Fudzilla. 2014-07-31. Retrieved 2014-10-05.
- "Broadwell 14nm desktop comes late in Q2 2015". Fudzilla. 2014-07-07. Retrieved 2014-10-05.
- Anton Shilov (2013-12-19). "Intel Readies 18-Core Xeon "Broadwell-EP" Microprocessors for Launch in 2015". xbitlabs.com. Retrieved 2013-12-24.
- Valich, Theo (2014-01-10). "Intel Brickland & Grantley Platforms Revealed: Ivy Bridge-EX, Haswell-EX, Broadwell-EX". Vr-zone.com. Retrieved 2014-01-19.
- Novakovic, Nebojsa (2014-01-10). "Socket 2011 to become the dominant Intel high end physical format even on Xeon EX – but different pin-outs, of course". Vr-zone.com. Retrieved 2014-01-19.
- "Intel® Software Development Emulator | Intel® Developer Zone". Software.intel.com. July 23, 2013. Retrieved 2013-10-16.
- Intel® Architecture Instruction Set Extensions Programming Reference (Document number 319433-013B) // Intel, July 2012, Chapter 9 "ADDITIONAL NEW INSTRUCTIONS"
- New Instructions Supporting Large Integer Arithmetic on Intel® Architecture Processors (Document number 327831 -001) // Intel, August 2012
- Intel® C++ Composer XE 2013 for Windows* Installation Guide and Release Notes (Document number: 321414-004US) // Intel, 4 October 2012; section "3.2.4 Inline assembly and intrinsic support for Intel architecture code named Broadwell added to Composer XE 2013 Update 1", page 13
- "VA-API 1.3 Readies Broadwell Support, Adds VP8 Decoding". Phoronix.com. 2014-03-18. Retrieved 2014-04-17.
- "Intel Broadwell GT3 Graphics Have Dual BSD Rings". Phoronix.com. Retrieved 2014-04-17.
- Intel Iris and HD Graphics Driver for Windows 7/8/8.1 64bit
- Release notes for driver version 188.8.131.5260 and 184.108.40.206.3960
- The Compute Architecture of Intel Processor Graphics Gen8
- "4th Generation Intel Core processor based on Mobile M-Processor and H-Processor Lines Datasheet, Volume 1 of 2" (PDF). intel.com. December 2013. Retrieved 2013-12-22. "Configurable TDP (cTDP) and Low-Power Mode (LPM) form a design vector where the processor behavior and package TDP are dynamically adjusted to a desired system performance and power envelope. [...] With cTDP, the processor is now capable of altering the maximum sustained power with an alternate guaranteed frequency. Configurable TDP allows operation in situations where extra cooling is available or situations where a cooler and quieter mode of operation is desired."
- "The technical details behind Intel's 7 Watt Ivy Bridge CPUs". arstechnica.com. 2013-01-14. Retrieved 2013-12-22. "If the CPU needs to work hard for an extended period of time and the laptop gets warmer, it will slowly ramp down its speed until it's operating at its stated TDP. [...] There are two OEM-configurable "power level" states that define how quick the CPU can be in these situations: PL2 tells the processor how much power it's allowed to use when it needs a short burst of speed, and PL1 defines how quickly the processor can run under sustained load. [...] This is at the heart of what Intel is doing with the Y-series processors: their maximum TDP has been lowered four watts, from 17 to 13. Intel is also validating them for use at two lower PL1 values: 10 watts and 7 watts. This is where the marketing we discussed earlier comes in—rather than keeping these values under the covers as it has so far been content to do, Intel has taken that lowest value, put it on its product pages, and called it SDP."
- "4th Generation Intel Core processor based on Mobile U-Processor and Y-Processor Lines Datasheet, Volume 1 of 2" (PDF). intel.com. December 2013. Retrieved 2013-12-22.
- Intel’s Core M Strategy: CPU Specifications for 9mm Fanless Tablets and 2-in-1 Devices
- Intel launches three Core M CPUs, promises more Broadwell “early 2015”
- "Details of first Broadwell "Y" mobile processors". cpu-world.com. July 2014.
- "Intel reveals 14nm PC, declares Moore's Law 'alive and well'". The Register. 2013-09-10. Retrieved 2014-09-28.
- "Intel delays Broadwell PC chip production to early next year". CNET. 2013-10-15. Retrieved 2014-09-28.
- "Intel's Broadwell-K launching at end of 2014 according to new roadmap". vr-zone.com. 2013-10-21. Retrieved 2013-10-24.
- Shilov, Anton (2013-08-29). "Intel Changes Plans: Core i "Broadwell" Processors Will Be Available in LGA Packaging, But There Is a Catch". Xbit Labs. Retrieved 2013-10-24.
- "Exclusive: Intel CEO promises Broadwell PCs on shelves for holidays". reuters.com. 2014-05-18. Retrieved 2014-05-17.
- "Computex 2014: Intels Broadwell kommt rechtzeitig zum Weihnachtsgeschäft". Heise.de. 2014-05-22. Retrieved 2014-05-31.
- Chris.L (2014-05-19). "2014 年底前絕對見到，14nm Broadwell 處理器最快在 37 周出貨". chinese.vr-zone.com. Retrieved 2014-07-19.
- Crothers, Brooke. "Intel's next-gen processor, Broadwell, is (mostly) a 2015 thing". CNET. Retrieved 2014-07-19.
- Hachman, Mark (2014-08-11). "Intel aims next-gen 14nm 'Broadwell' technology at fanless tablets, Ultrabooks". PCWorld. Retrieved 2014-08-15.