Contact pad

From Wikipedia, the free encyclopedia
Jump to: navigation, search
Gold wire ball-bonded to a gold contact pad

Contact pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, Flip chip mounting, or probe needles.

Further reading[edit]

  • Jing Li, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-free Environment, ProQuest, 2007 ISBN 0549321101.
  • Kraig Mitzner, Complete PCB Design Using OrCAD Capture and PCB Editor, Newnes, 2009 ISBN 0080943543.
  • Deborah Lea, Fredirikus Jonck, Christopher Hunt, Solderability Measurements of PCB Pad Finishes and Geometries, National Physical Laboratory, 2001 OCLC 59500348.