CoreExpress modules are complete computer-on-module (COM) highly integrated, small and compact PCs that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces. The interfaces are legacy-free, using only digital buses such as PCI Express, SATA, Ethernet, USB, and HD audio (Intel High Definition Audio). All signals are accessible on a high-density, high-speed, 220-pin connector. Although currently available implementations use Intel processors, the specification is open for different CPU CoM solutions.
CoreExpress modules are mounted on a custom carrier board, containing the peripherals required for the specific application. In this way, small but highly specialized computer systems can be built.
 Size & mechanics
The specification defines a board size of 58 mm × 65 mm, slightly less than a credit card.
The module can be embedded into a heat spreader, which distributes the component-generated heat onto a larger surface area. In low power applications, this distribution may be enough for complete thermal dissipation.
In higher power applications, the heat spreader presents a thermal interface for mating to additional heat dissipating components such as finned heatsinks. Heat spreaders are simpler and more rugged to connect to than the heat generating components underneath. This simplifies mechanical design for the system builder, but can be less efficient than a complete purpose-built thermal solution.
In a complete system, heat spreaders can be part of the EMI containment design.
 See also
- "SFF-SIG Adopts CoreExpress Specification to Strengthen PCIe 2.0-Ready COM Portfolio". Retrieved 2010-07-21.
- "CoreExpress Specification". Retrieved 2010-07-21.