|GmbH & Co. KG|
|Gunter Kuerbis, CEO|
|Products||Advanced rework and micro assembly equipment|
Finetech GmbH & Co. KG makes equipment for various kinds of rework and micro assembly operations.
Finetech GmbH (Berlin, Germany) is a manufacturer of high-accuracy equipment for leading-edge bonding, micro assembly and rework of semiconductor components and other leading-edge devices.
Founded in 1992 in East Berlin, the company’s first product was a system with only one moving part and a fixed optical prism, keeping the system simple yet accurate. By combining highly accurate optical alignment and a unique method of heating and cooling air/nitrogen for solder reflow, Finetech began providing systems for the Surface Mount Technology industry for reworking Ball Grid Arrays (BGAs) and other very precise components.
In 1996, Finetech introduced its first tabletop system with a placement accuracy of one micron. This system is widely used in many areas of the electronics industry including flip chip, photonics, sensors, vertical-cavity surface-emitting lasers, bio-medical devices, micro-electro-mechanical systems (MEMS), chip-to-wafer, light-emitting diodes, and many others.
In 2009, Finetech acquired Martin GmbH, a manufacturer of rework and dispensing equipment located in Wessling, Germany. This allowed Finetech to offer a more complete range of rework systems; from simple hand soldering technology and basic entry-level rework systems, to advanced rework and integrated dispense for its bonding equipment applications. Finetech systems are commonly used for academic and R&D purposes and can be found in many university and government research labs including; Harvard, MIT, Stanford, Sandia Labs, NASA, and The Fraunhofer Institute. The company services customers in a broad range of industries including universities and research, aerospace, medical technology, consumer electronics, semiconductor, optoelectronics and photonics, and military.
The company holds an ISO 9001 certification.
Operating worldwide, Finetech offers equipment and application solutions for both, advanced rework challenges and micro assembly.
Major application solutions are provided for rework of small passives, ball grid arrays and column grid arrays, quad-flat no-lead packages and micro lead frame packages or single solder balls.
Furthermore, FINEPLACER systems are capable of applying different bonding and adhesive technologies for and all kinds of device assembly and advanced packaging.
- http://www.finetech.de (official website)