HiSilicon

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Ingenic Semiconductor Co., Ltd.
Type Subsidiary
Traded as HiSilicon
Industry Fabless semiconductors, Semiconductors, Integrated circuit design
Headquarters Shenzhen, PRC
Products SoCs
Parent Huawei
Website www.hisilicon.com

HiSilicon (Simplified Chinese: 海思半导体有限公司, pinyin: Hǎisī bàndǎotǐ yǒuxiàn gōngsī) is a fabless semiconductor company based in Shenzhen, PRC and fully owned by Huawei. They design SoCs using licensed SIP cores from other companies.

HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[1][2] ARM Cortex-A53, and ARM Cortex-A57 and also for the Mali-T628 MP4.[3][4]

HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core,

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[5]

Products[edit]

K3V1[edit]

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (MHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V1 (Hi3611) 130 nm ARMv5 ARM9E 1 800 2009 Babiken Vefone V1, Ciphone 5 (C5), T5355, IHTC HD-2, 5-inch Huawei UMPC

K3V2[edit]

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[6] and Huawei MediaPad 10 FHD7 tablets.[7] This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[8] The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 480 MHz, 30.7 GFLOPS LPDDR2 64-bit dual-channel 7.2 (up to 8.5) N/A N/A N/A N/A 2012 Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S)

K3V2E[edit]

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2E 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 480 MHz, 30.7 GFLOPS LPDDR2 64-bit dual-channel 7.2 (up to 8.5) N/A N/A N/A N/A 2013 Huawei Honor 3

KIRIN 910[edit]

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
KIRIN 910 28 nm HPM ARMv7 Cortex-A9 4 1.6 ARM Mali-450 MP4 533 MHz LPDDR3 32-bit single-channel 6.4 N/A LTE Cat.4 N/A N/A H1 2014 Huawei MediaPad X1,[9] Huawei P6 S,[10] Huawei MediaPad M1[11]
KIRIN 910T 1.8 LPDDR3 32-bit single-channel 6.4 N/A LTE Cat.4 N/A N/A H1 2014 Huawei Ascend P7

KIRIN 920[edit]

• The KIRIN 920 SoC also contains an image processor what supports up to 32 Megapixel

Model Number Fab CPU GPU Memory Technology Nav wireless Sampling Availability Utilizing Devices
Instruction set Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
KIRIN 920 28 nm HPM ARMv7


Cortex-A15
Cortex-A7
big.LITTLE
4+4 1.7-2 GHz (A15)
1.3-1.6 GHz (A7)
Mali-T628 MP4 600 MHz LPDDR3 64-bit dual-channel 12.8 N/A LTE Cat.6 N/A N/A H2 2014 Huawei Honor 6[12]

Similar platforms[edit]

References[edit]

External links[edit]