IAg
From Wikipedia, the free encyclopedia
 |
This article may require cleanup to meet Wikipedia's quality standards. (Consider using more specific cleanup instructions.) Please help improve this article if you can. The talk page may contain suggestions. (November 2009) |
IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.
Contents |
[edit] Description
It consists of a thin immersion silver plating over the copper traces.
[edit] Advantages of IAg
- Excellent surface planarity (compared to e.g. HASL)
- Low High Frequency Signal loss due to skin effect
[edit] Disadvantages of IAg
- Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
[edit] Specifications
IPC Standard: IPC-4553
