IEEE Components, Packaging, and Manufacturing Technologies Award

From Wikipedia, the free encyclopedia
Jump to: navigation, search

The IEEE Components, Packaging, and Manufacturing Technologies Award is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.

The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium.

Recipients[edit]

Recipients of the award for each year include:

  • 2004: John W. Balde
  • 2005: Yutaka Tsukada
  • 2006: C. P. Wong[1]
  • 2007: Dimitry Grabbe
  • 2008: Karl Puttlitz
  • 2008: Paul A. Totta
  • 2009: George G. Harman[2]
  • 2010: Herbert Reichl[3][4]
  • 2011: Rao R. Tummala[5][6]
  • 2012: Mauro Walker [7]
  • 2013: John Lau
  • 2014: Avram Bar-Cohen

References[edit]

External links[edit]