LPKF Laser & Electronics
|Traded as||FWB: LPK|
|Products||PCB Prototyping Equipment, Laser Plastic Welding, Laser Direct Structuring for 3D circuits, SMT Stencil Laser, Laser Systems for Thin-film Solar Panels, Laser Cutting of Flex Circuits, Laser Depaneling of PCB.|
|Revenue||€ 115.1 million (2012)|
|€ 20.4 million (2012)|
Number of employees
|690 Worldwide (2012)|
LPKF Laser & Electronics AG (LPKF) is a German-based equipment manufacturer supplying the electronics industry. Although LPKF focuses mainly on PCB prototyping and micromachining solutions for SMT stencils, the company also offers laser plastic welding systems and precision drives, as well as laser structuring systems for thin-film solar cells. The company has operations in the United States, Slovenia, Hong Kong, China and Japan. LPKF is publicly traded at the Frankfurt Stock Exchange (Xetra: LPKF.DE).
Established in 1976 in Garbsen, Germany, LPKF made a name for itself with its unorthodox procedures for the in-house manufacturing of prototype Printed Circuit Boards (PCBs). The company’s CAD-steered milling technology was established as an efficient and pollution free alternative to chemical etching.
LPKF stands for "Leiterplatten Kopier Fräsen" translated "circuit board copy milling". This was created from the original LPKF machines. These simple manual machines used a pointer to follow a sketch, the milling head would move in the same direction and a footswitch was responsible for the up and down movement of the milling head.
Since its inception, LPKF has grown into an internationally operated company and is considered one of the world market leaders for in-house prototyping and stencil laser services.
1975 - Juergen Seebach, one of the founders of LPKF, develops and patents a method for accurate mechanical milling of printed circuit board artwork.
1976 - LPKF System Seebach GmbH is incorporated in Hanover, Germany. The company’s first prototyping system, LPKF 39, is introduced.
1983 - LPKF introduces ColorCAM, its first IBM PC-based software for the computer-aided manufacturing of printed circuit boards with milling and drilling machines.
1984 – LPKF establishes its first international branch in the United States
1989 - LPKF develops a procedure for laser-based structuring of printed circuit boards. The company name is changed to LPKF CAD/CAM System GmbH to reflect the increase activity in the CAD software.
1991 - LPKF forms a joint venture with 5 engineers from the Technical University Illmenau. The new company is named LPKF Motion & Control GmbH and focuses on developing precision x/y motion systems.
1994 - LPKF opens a new production facility in Slovenia.
1998 - The company name is changed to LPKF Lasers & Electronics AG to reflect greater involvement in laser technology. LPKF goes public in November 1998 and is listed on the Frankfurt Stock Exchange “Neuer Markt” segment.
2000 - LPKF Tianjin CO. Ltd. is established as a new subsidiary in China. LPKF purchases a stake in LaserQuipment AG, which produces and distributes systems for Laser plastic welding.
2001 - LPKF introduces the MicroLine laser systems for drilling and structuring printed circuit boards.
2007 - LPKF SolarQuipment GmbH develops and produces laser systems for the structuring of thin film solar cells. LaserQuipment AG becomes fully consolidated and is now operating as a division of LPKF.
2009 - LDS technology for 3-dimensional circuits 6 is becoming most widely used for manufacturing smart phone antennas.
2010 - LPKF wins the prestigious Hermes Award at the Hannover Messe for its Fusion 3D laser system for 3D circuit manufacturing.
2012 - LPKF is admitted to TecDAX, the index comprising the 30 leading German technology stocks.
Board of Directors
The company’s board of managing directors consists of Dr. Ingo Bretthauer (Chairman and CEO), Bernd Lange (CTO), Kai Bentz (CFO) and Dr. Christian Bieniek (COO).
LPKF offers a broad range of products that cover the complete operational sequence for in-house prototyping. Products include:
Rapid PCB Prototyping Technology: Systems for the production of PCBs and multilayer boards.
SMT Stencil Technology : Enables laser production of SMT Stencils and quality check with inspection systems.
PCB Processing Technology: Enables cutting and drilling of printed circuit boards (PCBs) for highest requirements.
PCB Depaneling Technology: Enables depaneling of printed circuit boards (PCBs) for highest requirements
Laser Direct Structuring (LDS): Enables laser structuring of circuit layouts on 3D injection molded parts.
Solar Cell Technology: Laser systems featuring fast and precise structuring of thin film solar cells.
Laser Plastic Welding: Innovative laser systems for plastic parts welding.
- Laser plastic welding resource center – www.laserplasticwelding.com
Measuring Machines: Measuring machines for the inspection of microstructures and stencil quality control.
Precision Drives: Portal systems, measuring systems and precision drives.
- LPKFUSA.com - official page LPKF USA
- LPKF.com - official page (English)
- LPKF.de - official page (German)
- www.laserplasticwelding.com - Laser welding resource center (moderated by LPKF USA)
- www.lpkf-laserwelding.com - Laser Welding divions
- www.lpkf-solarquipment.com - Solar Cell Technology division
- "Annual Report 2012". LPKF.
- LPKF Laser & Electronics AG . CorporateInformation.com
- LPKF Laser & Electronics, North America. PCBCafe.com
- "LPKF Laser& Electronics Kursverlauf (short report)". Dr. Kalliwoda:Research. 10 December 2007.
- Friedrichkeit, Hans (October 1, 2006). "Hidden Champion: LPKF Laser & Electronics AG". CircuiTree Magazine.
- Grande, Joseph A. (June 2005). "MIDs Make a Comeback". Plastics Technology.
- Deligio, Tony (November 1, 2007). "The Perfect Weld". Modern Plastics Worldwide.
- "Research Association Molded Interconnect Devices 3-D MID e.V". 3-D MID.de.
- "Deutsche Messe stages HERMES AWARD again". HannoverMesse.de. 8 February 2011.
- "LPKF Laser & Electronics Stock Information". Bloomberg BusinessWeek.