Laser beam machining

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Laser beam machining (LBM) is an unconventional machining process in which a laser is directed towards the work piece for machining. Since the rays of a laser beam are monochromatic and parallel it can be focused to a very small diameter and can produce energy as high as 100 MW of energy for a square millimeter of area. It is especially suited to making accurately placed holes. It can be used to perform precision micro-machining on all microelectronic substrates such as ceramic, silicon, diamond, and graphite. Examples of microelectronic micro-machining include cutting, scribing & drilling all substrates, trimming hybrid resistors, patterning displays of glass or plastic and trace cutting on semiconductor wafers and chips. A pulsed ruby laser is normally used for developing a high power.

Overview[edit]

The cost of cutting hard-to-machine materials by conventional mechanical machining processes is high due to the low material removal rate and short tool life, and some materials are not possible to be cut by the conventional machining process at all. Laser beam machining is the machining processes involving a laser beam as a heat source.It is a thermal process used to remove materials without mechanical engagement with workpiece material where the workpiece is heated to melting or boiling point and removed by melt ejection,vaporization,or ablation mechanisms. In contrast with a conventional machine tool,the laser radiation does not experience wear, and material removal is not dependent on its hardness but on the optical properties of the laser and the optical and thermo physical properties of the material.

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References[edit]

  • Amitabh Ghosh and Asok Kumar Mallik (2010). "Unconventional Machining Processes". Manufacturing Science (2nd edition ed.). East-west press. pp. 396–403. ISBN 978-81-7671-063-3.