List of AMD mobile microprocessors

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Contents

Initial platform (2003)[edit]

Launched in 2003, the initial platform for mobile AMD processors consists of:

AMD mobile Initial platform
Mobile processor Processors - Socket 754
Mobile chipset D-sub and HyperTransport 1.0

Mobile Sempron[edit]

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.95 - 1.4 V 13 - 62 W July 28, 2004 SMN2600BIX2AY
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.95 - 1.4 V 13 - 62 W July 28, 2004 SMN2800BIX3AY
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 - 1.4 V 13 - 62 W July 28, 2004 SMN3000BIX2AY

"Dublin" (Socket 754, CG, 130 nm, Low power)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.975 - 1.25 V 9 - 25 W July 28, 2004 SMS2600BOX2LA
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.975 - 1.25 V 9 - 25 W July 28, 2004 SMS2800BOX3LA

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 08x 0.95 - 1.4 V 62 W July 2004 SMN2600BIX2BA
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 08x 0.95 - 1.4 V 62 W July 2004 SMN2800BIX3BA
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 09x 0.95 - 1.4 V 62 W July 2004 SMN3000BIX2BA
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 09x 0.95 - 1.4 V 62 W May 3, 2005 SMN3100BIX3BA
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 - 1.4 V 62 W August 19, 2005 SMN3300BIX2BA

"Sonora" (Socket 754, D0, 90 nm, Low power)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.975 - 1.25 V 25 W July 2004 SMS2600BOX2LB
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.975 - 1.25 V 25 W July 2004 SMS2800BOX3LB
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.975 - 1.25 V 25 W November 23, 2004 SMS3000BOX2LB
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.975 - 1.25 V 25 W January 2005 SMS3100BOX3LB

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 - 1.4 V 62 W July 15, 2005 SMN3000BIX2BX
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.95 - 1.4 V 62 W July 15, 2005 SMN3100BIX3BX
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 - 1.4 V 62 W July 15, 2005 SMN3300BIX2BX
Mobile Sempron 3400+ 2000 MHz 256 kB 800 MHz 10x 0.95 - 1.4 V 62 W January 23, 2006 SMN3400BIX3BX
Mobile Sempron 3600+ 2200 MHz 128 kB 800 MHz 11x 0.95 - 1.4 V 62 W May 17, 2006 SMN3600BIX2BX

"Roma" (Socket 754, E6, 90 nm, Low power)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 08x 0.95 - 1.2 V 25 W July 15, 2005 SMS2800BQX3LF
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 09x 0.95 - 1.2 V 25 W July 15, 2005 SMS3000BQX2LE
SMS3000BQX2LF
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 09x 0.95 - 1.2 V 25 W July 15, 2005 SMS3100BQX3LE
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 - 1.2 V 25 W July 2005 SMS3300BQX2LE
Mobile Sempron 3400+ 2000 MHz 256 kB 800 MHz 10x 0.95 - 1.2 V 25 W May 17, 2006 SMS3400BQX3LE

Mobile Athlon 64[edit]

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8x 1.50 V 19 - 81.5 W Socket 754 May 2004 AMA2700BEY4AP (C0)
Mobile Athlon 64 2800+ 1600 MHz 1024 kB 800 MHz 8x 1.50 V 19 - 81.5 W Socket 754 February 2004 AMA2800BEX5AP (C0)
AMA2800BEX5AR (CG)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9x 1.50 V 19 - 81.5 W Socket 754 September 2003 AMA3000BEX5AP (C0)
AMA3000BEX5AR (CG)
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10x 1.50 V 19 - 81.5 W Socket 754 September 2003 AMA3200BEX5AP (C0)
AMA3200BEX5AR (CG)
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11x 1.50 V 19 - 81.5 W Socket 754 September 2003 AMA3400BEX5AP (C0)
AMA3400BEX5AR (CG)
Mobile Athlon 64 3700+ 2400 MHz 1024 kB 800 MHz 12x 1.50 V 19 - 81.5 W Socket 754 September 2003 AMA3700BEX5AP (C0)
AMA3700BEX5AR (CG)

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2800+ 1600 MHz 1024 kB 800 MHz 8x 1.40 V 62 W Socket 754 September 2003 AMN2800BIX5AP (C0)
AMN2800BIX5AR (CG)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9x 1.40 V 62 W Socket 754 September 2003 AMN3000BIX5AP (C0)
AMN3000BIX5AR (CG)
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10x 1.40 V 62 W Socket 754 September 2003 AMN3200BIX5AP (C0)
AMN3200BIX5AR (CG)
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11x 1.40 V 62 W Socket 754 February 2004 AMN3400BIX5AR (CG)

"ClawHammer" (CG, 130 nm, 35 W TDP)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8x 1.20 V 35 W Socket 754 May 2004 AMD2700BQX4AR

"Odessa" (CG, 130 nm, Desktop replacement)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 8x 1.50 V 19 - 81.5 W Socket 754 April 2004 AMA2800BEX4AX

"Odessa" (CG, 130 nm, 35 W TDP)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 1.20 V 35 W Socket 754 May 2004 AMD2700BQX4AX
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 1.20 V 35 W Socket 754 May 2004 AMD2800BQX4AX
Mobile Athlon 64 3000+ 2000 MHz 512 kB 800 MHz 10× 1.20 V 35 W Socket 754 May 2004 AMD3000BQX4AX

"Oakville" (D0, 90 nm, 35 W TDP Low Power)[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 1.35 V 35 W Socket 754 August 17, 2004 AMD2700BKX4LB
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 1.35 V 35 W Socket 754 August 17, 2004 AMD2800BKX4LB
Mobile Athlon 64 3000+ 2000 MHz 512 kB 800 MHz 10× 1.35 V 35 W Socket 754 August 17, 2004 AMD3000BKX4LB

"Newark" (E5, 90 nm, 62 W TDP)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 0 1.35 V 62 W Socket 754 April 14, 2005 AMN3000BKX5BU
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10× 1.35 V 62 W Socket 754 April 14, 2005 AMN3200BKX5BU
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11× 1.35 V 62 W Socket 754 April 14, 2005 AMN3400BKX5BU
Mobile Athlon 64 3700+ 2400 MHz 1024 kB 800 MHz 12× 1.35 V 62 W Socket 754 April 14, 2005 AMN3700BKX5BU
Mobile Athlon 64 4000+ 2600 MHz 1024 kB 800 MHz 13× 1.35 V 62 W Socket 754 August 16, 2005 AMN4000BKX5BU

Turion 64[edit]

"Lancaster" (90 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 ML-28 1600 MHz 0512 kB 800 MHz 08x 1.35 V 35 W Socket 754 June 22, 2005 TMDML28BKX4LD
Turion 64 ML-30 1600 MHz 1024 kB 800 MHz 08x 1.35 V 35 W Socket 754 March 10, 2005 TMDML30BKX5LD
Turion 64 ML-32 1800 MHz 0512 kB 800 MHz 09x 1.35 V 35 W Socket 754 March 10, 2005 TMDML32BKX4LD
Turion 64 ML-34 1800 MHz 1024 kB 800 MHz 09x 1.35 V 35 W Socket 754 March 10, 2005 TMDML34BKX5LD
Turion 64 ML-37 2000 MHz 1024 kB 800 MHz 10x 1.35 V 35 W Socket 754 March 10, 2005 TMDML37BKX5LD
Turion 64 ML-40 2200 MHz 1024 kB 800 MHz 11x 1.35 V 35 W Socket 754 June 22, 2005 TMDML40BKX5LD
Turion 64 ML-42 2400 MHz 0512 kB 800 MHz 12x 1.35 V 35 W Socket 754 October 4, 2005 TMDML42BKX4LD
Turion 64 ML-44 2400 MHz 1024 kB 800 MHz 12x 1.35 V 35 W Socket 754 January 4, 2006 TMDML44BKX5LD
Turion 64 MT-28 1600 MHz 0512 kB 800 MHz 08x 1.20 V 25 W Socket 754 June 22, 2005 TMSMT28BQX4LD
Turion 64 MT-30 1600 MHz 1024 kB 800 MHz 08x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT30BQX5LD
Turion 64 MT-32 1800 MHz 0512 kB 800 MHz 09x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT32BQX4LD
Turion 64 MT-34 1800 MHz 1024 kB 800 MHz 09x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT34BQX5LD
Turion 64 MT-37 2000 MHz 1024 kB 800 MHz 10x 1.20 V 25 W Socket 754 August 8, 2005 TMSMT37BQX5LD
Turion 64 MT-40 2200 MHz 1024 kB 800 MHz 11x 1.20 V 25 W Socket 754 August 8, 2005 TMSMT40BQX5LD

Kite platform (2006)[edit]

Introduced in 2006, the Kite platform consists of:

AMD mobile Kite platform
Mobile processor Processors - Socket S1
  • Mobile Sempron single-core 64-bit processor (codenamed Keene), or
  • Turion 64 single-core 64-bit processor (codenamed Richmond), or
  • Turion 64 X2 dual-core 64-bit processor (codenamed Taylor, Trinidad)
Mobile chipset
Mobile support

Mobile Sempron[edit]

"Keene" (Socket S1, F2, 90 nm, Low power)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 3200+ 1600 MHz 512 kB 800 MHz 08x 0.950 - 1.125 V 25 W May 17, 2006 SMS3200HAX4CM
Mobile Sempron 3400+ 1800 MHz 256 kB 800 MHz 09x 0.950 - 1.125 V 25 W May 17, 2006 SMS3400HAX3CM
Mobile Sempron 3500+ 1800 MHz 512 kB 800 MHz 09x 0.950 - 1.125 V 25 W May 17, 2006 SMS3500HAX4CM
Mobile Sempron 3600+ 2000 MHz 256 kB 800 MHz 10x 0.950 - 1.125 V 25 W Oct 23, 2006 SMS3600HAX3CM

Turion 64[edit]

"Richmond" (90 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 MK-36 2000 MHz 512 kB 800 MHz 10x 1.15 V 31 W Socket S1 September 1, 2006 TMDMK36HAX4CM
Turion 64 MK-38 2200 MHz 512 kB 800 MHz 11x 1.15 V 31 W Socket S1 Q1 2007 TMDMK38HAX4CM

Turion 64 X2[edit]

"Taylor" (90 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-50 1600 MHz 2 × 256 kB 800 MHz 8x 0.8 - 1.10 V 31 W Socket S1 May 17, 2006 TMDTL50HAX4CT

"Trinidad" (90 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-52 1600 MHz 2 × 512 kB 800 MHz 08x 0.8 - 1.125 V 31 W Socket S1 May 17, 2006 TMDTL52HAX5CT
Turion 64 X2 TL-56 1800 MHz 2 × 512 kB 800 MHz 09x 0.8 - 1.125 V 33 W Socket S1 May 17, 2006 TMDTL56HAX5CT
Turion 64 X2 TL-60 2000 MHz 2 × 512 kB 800 MHz 10x 0.8 - 1.125 V 35 W Socket S1 May 17, 2006 TMDTL60HAX5CT
Turion 64 X2 TL-64 2200 MHz 2 × 512 kB 800 MHz 11x 0.8 - 1.125 V 35 W Socket S1 January 30, 2007 TMDTL64HAX5CT

Kite Refresh platform (2007)[edit]

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

AMD mobile Kite Refresh platform
Mobile processor Processors - Socket S1
  • Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or
  • Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman)
Mobile chipset
  • HDMI, HyperTransport 1.0 and PCI Express 1.0
  • DDR2-800 SO-DIMM
Mobile support

Mobile Sempron[edit]

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Sempron 2100+ fanless[1] 1000 MHz 256 kB 800 MHz 5x 0.950 - 1.125 V 09 W May 30, 2007 SMF2100HAX3DQE (G1)
Mobile Sempron 3600+ 2000 MHz 256 kB 800 MHz 10x 25 W SMS3600HAX3DN (G2)
Mobile Sempron 3700+ 2000 MHz 512 kB 800 MHz 10x 25 W SMS3700HAX4DQE (G1)
Mobile Sempron 3800+ 2200 MHz 256 kB 800 MHz 11x 31 W SMD3800HAX3DN (G2)
Mobile Sempron 4000+ 2200 MHz 512 kB 800 MHz 11x 31 W SMD4000HAX4DN (G2)

Athlon 64 X2[edit]

"Tyler" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon 64 X2 TK-42 1600 MHz 2 × 512 kB 800 MHz 8.0x 1.075/1.10/1.125 V 20 W Socket S1 AMETK42HAX5DM
Athlon 64 X2 TK-53 1700 MHz 2 × 256 kB 800 MHz 8.5x 1.075/1.10/1.125 V 31 W Socket S1 August 20, 2007 AMDTK53HAX4DC
Athlon 64 X2 TK-55 1800 MHz 2 × 256 kB 800 MHz 9.0x 1.075/1.10/1.125 V 31 W Socket S1 Aug 20 2007 AMDTK55HAX4DC
Athlon 64 X2 TK-57 1900 MHz 2 × 256 kB 800 MHz 9.5x 1.075/1.10/1.125 V 31 W Socket S1 2008 AMDTK57HAX4DM

Turion 64 X2[edit]

"Tyler" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-56 1800 MHz 2 × 512 kB 800 MHz 09.0x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL56HAX5DC
Turion 64 X2 TL-58 1900 MHz 2 × 512 kB 800 MHz 09.5x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL58HAX5DC
Turion 64 X2 TL-60 2000 MHz 2 × 512 kB 800 MHz 10.0x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL60HAX5DC
Turion 64 X2 TL-62 2100 MHz 2 × 512 kB 800 MHz 10.5x 1.075/1.10/1.125 V 35 W Socket S1 Jan 21 2008 TMDTL62HAX5DM
Turion 64 X2 TL-64 2200 MHz 2 × 512 kB 800 MHz 11.0x 1.075/1.10/1.125 V 35 W Socket S1 May 7, 2007 TMDTL64HAX5DC
Turion 64 X2 TL-66 2300 MHz 2 × 512 kB 800 MHz 11.5x 1.075/1.10/1.125 V 35 W Socket S1 May 7, 2007
Jul 10 2007
TMDTL66HAX5DC
TMDTL66HAX5DM
Turion 64 X2 TL-68 2400 MHz 2 × 512 kB 800 MHz 12.0x 1.075/1.10/1.125 V 35 W Socket S1 December 19, 2007 TMDTL68HAX5DM

Puma platform (2008)[edit]

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit codenamed Griffin of processors, named "Turion X2 Ultra", or
  • Mobile Sempron single-core 64-bit processor (codenamed Sable), with the followings:
    • Split-power planes and linked power management support
    • Support for possible low voltage processors
Mobile chipset AMD M780 series chipset
Mobile support
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter
  • Hybrid hard drives
  • Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (DASH page)
  • Trusted Platform Module (TPM) support

Mobile Sempron[edit]

"Sable" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Sempron SI-40 2000 MHz 512 kB 1800 MHz 10.0x 1.075 - 1.125 V 25 W Socket S1G2 June 4, 2008 SMSI40SAM12GG
Sempron SI-42 2100 MHz 512 kB 1800 MHz 10.5x 1.075 - 1.125 V 25 W Socket S1G2 Q3 2008 SMSI42SAM12GG

Athlon X2[edit]

"Lion" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon X2 QL-60 1900 MHz 2 × 512 kB 1800 MHz 09.5x 0.95 - 1.1 V 35 W Socket S1G2 June 4, 2008 AMQL60DAM22GG
Athlon X2 QL-62 2000 MHz 2 × 512 kB 1800 MHz 10.0x 0.95 - 1.1 V 35 W Socket S1G2 Q3 2008 AMQL62DAM22GG
Athlon X2 QL-64 2100 MHz 2 × 512 kB 1800 MHz 10.5x 0.95 - 1.1 V 35 W Socket S1G2 Q4 2008 AMQL64DAM22GG
Athlon X2 QL-65 2100 MHz 2 × 512 kB 2000 MHz 10.5x 0.95 - 1.1 V 35 W Socket S1G2 Q4 2008 AMQL65DAM22GG
Athlon X2 QL-66 2200 MHz 2 × 512 kB 1800 MHz 11.0x 0.95 - 1.1 V 35 W Socket S1G2 Q4 2008 AMQL66DAM22GG
Athlon X2 QL-67 2200 MHz 2 × 512 kB 2000 MHz 11.0x 0.95 - 1.1 V 35 W Socket S1G2 Q4 2008 AMQL67DAM22GG

Turion X2[edit]

"Lion" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion X2 RM-70[2] 2000 MHz 2 × 512 kB 1800 MHz 10x 0.75 - 1.2 V 31 W Socket S1G2 June 4, 2008 TMRM70DAM22GG
Turion X2 RM-72[2] 2100 MHz 2 × 512 kB 1800 MHz 10.5x 0.75 - 1.2 V 35 W Socket S1G2 Q3 2008 TMRM72DAM22GG
Turion X2 RM-74[2] 2200 MHz 2 × 512 kB 1800 MHz 11.0x 0.75 - 1.2 V 35 W Socket S1G2 Q4 2008 TMRM74DAM22GG
Turion X2 RM-75[2] 2200 MHz 2 × 512 kB 2000 MHz 11.0x 0.75 - 1.2 V 35 W Socket S1G2 Q4 2008 TMRM75DAM22GG
Turion X2 RM-76[2] 2300 MHz 2 × 512 kB 1800 MHz 11.5x 0.75 - 1.2 V 35 W Socket S1G2 Q4 2008 TMRM76DAM22GG
Turion X2 RM-77[2] 2300 MHz 2 × 512 kB 2000 MHz 11.5x 0.75 - 1.2 V 35 W Socket S1G2 Q4 2008 TMRM77DAM22GG

Turion X2 Ultra[edit]

"Lion" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion X2 Ultra ZM-80[2] 2100 MHz 2 × 1 MB 1800 MHz 10.5x 0.75 - 1.2 V 32 W Socket S1G2 June 4, 2008 TMZM80DAM23GG
Turion X2 Ultra ZM-82[2] 2200 MHz 2 × 1 MB 1800 MHz 11.0x 0.75 - 1.2 V 35 W Socket S1G2 June 4, 2008 TMZM82DAM23GG
Turion X2 Ultra ZM-84[2] 2300 MHz 2 × 1 MB 1800 MHz 11.5x 0.75 - 1.2 V 35 W Socket S1G2 Q3 2008 TMZM84DAM23GG
Turion X2 Ultra ZM-85[2] 2300 MHz 2 × 1 MB 2200 MHz 11.5x 0.75 - 1.2 V 35 W Socket S1G2 Q3 2008 TMZM85DAM23GG
Turion X2 Ultra ZM-86[2] 2400 MHz 2 × 1 MB 1800 MHz 12.0x 0.75 - 1.2 V 35 W Socket S1G2 June 4, 2008 TMZM86DAM23GG
Turion X2 Ultra ZM-87[2] 2400 MHz 2 × 1 MB 2200 MHz 12.0x 0.75 - 1.2 V 35 W Socket S1G2 Q3 2008 TMZM87DAM23GG
Turion X2 Ultra ZM-88[2] 2500 MHz 2 × 1 MB 1800 MHz 12.5x 0.75 - 1.2 V 35 W Socket S1G2 Q3 2008 TMZM88DAM23GG

Yukon platform (2009)[edit]

The Yukon platform was introduced on January 8, 2009 with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single-core 64-bit codenamed Huron of processors, named "Athlon Neo", or
  • Mobile Sempron single-core 64-bit processor (codenamed Huron), with the following:
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
Mobile chipset AMD RS690E series chipset + SB600 southbridge
Mobile support
  • Wireless connectivity with 3G (as option)
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter

Sempron[edit]

"Huron" (65 nm, Low power)[edit]

  • Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
  • Sempron 210U supports extra AMD-V
Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Package/Socket Release date Order Part Number
Sempron 200U[3] 1000 MHz 256 kB 1600 MHz 5x 0.925 V 8 W Socket ASB1 January 8, 2009 SMF200UOAX3DV
Sempron 210U 1500 MHz 256 kB 1600 MHz 7.5x 0.925 V 15 W Socket ASB1 January 8, 2009 SMG210UOAX3DX

Athlon Neo[edit]

"Huron" (65 nm, 15 W TDP)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Neo MV-40 1600 MHz 512 kB 800 MHz 8x 1.1 V 15 W Socket ASB1 January 8, 2009 AMGMV40OAX4DX

"Sherman" (65 nm, 15 W TDP)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Neo TF-20 1600 MHz 512 kB 800 MHz 8x 1.0 V 15 W Socket S1 January 8, 2009 AMGTF20HAX4DN

"Congo" (65 nm, 13 W TDP)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Mobile X2 L310 1200 MHz 2 × 512 kB 800 MHz 6x 0.925 V 13 W Socket S1 January 8, 2009 AMML310HAX5DM

Turion[edit]

"Congo" (65 nm, 20 W TDP)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Turion Mobile X2 L510 1600 MHz 2 × 512 kB 800 MHz 8x 0.925 V 20 W Socket S1 January 8, 2009 TMEL510HAX5DM

Congo platform (2009)[edit]

The Congo platform [5] was introduced on September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Conesus, with the followings:
    • made on 65 nm process
    • 15 W (single-core) or 18 W (dual-core) TDP
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
    • DDR2 SO-DIMM
Mobile chipset AMD M780G(RS780M) series chipset + SB710 southbridge

Athlon Neo X2[edit]

"Conesus" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon Neo X2 L325 1500 MHz 2 × 512 kB 800 MHz 7.5x 0.925 V 18 W Socket ASB1 August 10, 2009 AMZL325OAX5DY
Athlon Neo X2 L335 1600 MHz 2 × 512 kB 800 MHz 8.0x 0.925 V 18 W Socket ASB1 February 2010 AMZL335OAX5DY

Turion Neo X2[edit]

"Conesus" (65 nm)[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion Neo X2 L625 1600 MHz 2 × 512 kB 800 MHz 8x 0.925 V 18 W Socket ASB1 August 10, 2009 TMZL625OAX5DY

Tigris platform (2009)[edit]

The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Caspian, with the followings:
    • made on 45 nm process
    • 25 W (single-core) or 35 W (dual-core) TDP
Mobile chipset AMD M785(RS880M) series chipset + SB710 southbridge

Sempron[edit]

"Caspian" (45 nm)[edit]

MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache FPU width[6] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Sempron M100 2000 MHz 512 kB 64-bit 1600 MHz 10.0x 25 W Socket S1G3 September 10, 2009 SMM100SBO12GQ
Sempron M120 2100 MHz 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G3 September 10, 2009 SMM120SBO12GQ
Sempron M140 2200 MHz 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G3 April 2010 SMM140SBO12GQ

Athlon II[edit]

"Caspian" (45 nm)[edit]

MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache FPU width[6] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon II M300 2000 MHz 2 × 512 kB 64-bit 1600 MHz 10.0x 35 W Socket S1G3 September 10, 2009 AMM300DBO22GQ
Athlon II M320 2100 MHz 2 × 512 kB 64-bit 1600 MHz 10.5x 35 W Socket S1G3 September 10, 2009 AMM320DBO22GQ
Athlon II M340 2200 MHz 2 × 512 kB 64-bit 1600 MHz 11.0x 35 W Socket S1G3 September 10, 2009 AMM340DBO22GQ
Athlon II M360 2300 MHz 2 × 512 kB 64-bit 1600 MHz 11.0x 35 W Socket S1G3 May 2010 AMM360DBO22GQ

Turion II[edit]

"Caspian" (45 nm)[edit]

MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache FPU width[6] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion II M500 2200 MHz 2 × 512 kB 128-bit 1800 MHz 11.0x 35 W Socket S1G3 September 10, 2009 TMM500DBO22GQ
Turion II M520 2300 MHz 2 × 512 kB 128-bit 1800 MHz 11.5x 35 W Socket S1G3 September 10, 2009 TMM520DBO22GQ
Turion II M540 2400 MHz 2 × 512 kB 128-bit 1800 MHz 12.0x 35 W Socket S1G3 September 10, 2009 TMM540DBO22GQ
Turion II M560 2500 MHz 2 × 512 kB 128-bit 1800 MHz 12.0x 35 W Socket S1G3 April 2010 TMM560DBO22GQ

Turion II[edit]

"Caspian" (45 nm)[edit]

MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache FPU width[6] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion II Ultra M600 2400 MHz 2 × 1 MB 128-bit 1800 MHz 12.0x 35 W Socket S1G3 September 10, 2009 TMM600DBO23GQ
Turion II Ultra M620 2500 MHz 2 × 1 MB 128-bit 1800 MHz 12.5x 35 W Socket S1G3 September 10, 2009 TMM620DBO23GQ
Turion II Ultra M640 2600 MHz 2 × 1 MB 128-bit 1800 MHz 13.0x 35 W Socket S1G3 September 10, 2009 TMM640DBO23GQ
Turion II Ultra M660 2700 MHz 2 × 1 MB 128-bit 1800 MHz 13.5x 35 W Socket S1G3 September 10, 2009 TMM660DBO23GQ

Nile platform (2010)[edit]

The Nile platform [7][8] introduced on May 12, 2010 for the third AMD Ultrathin Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Geneva, with the followings:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 9 W, 12 W or 15 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

Single-core mobile processor

V series processors[edit]

"Geneva" (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[8] HT Mult.1 Voltage TDP Socket Release date Order Part Number
V 105 1200 MHz 512 kB 64-bit 1000 MHz 6x 9 W Socket ASB2 May 12, 2010 VMV105FDV12GM

Athlon II Neo[edit]

"Geneva" (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[8] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon II K125 1700 MHz 1 MB 64-bit 1000 MHz 8.5x 1,075 V 12 W Socket ASB2 May 12, 2010 AMK125LAV13GM
Athlon II K145 1800 MHz 1 MB 64-bit 1000 MHz 9.0x 12 W Socket ASB2 January 4, 2011 AMK145LAV13GM

Dual-core mobile processor

Athlon II Neo[edit]

"Geneva" (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[8] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon II K325 1300 MHz 2 × 1 MB 64-bit 1000 MHz 6.5x 12 W Socket ASB2 May 12, 2010 AMK325LAV23GM
Athlon II K345 1400 MHz 2 × 1 MB 64-bit 1000 MHz 7.0x 12 W Socket ASB2 January 4, 2011 AMK345LAV23GM

Turion II Neo[edit]

"Geneva" (45 nm)[edit]

Socket ASB2

Model Number Frequency L2 Cache FPU width[8] HT Mult.1 Voltage TDP Release date Order Part Number
Turion II K625 1500 MHz 2 × 1 MB 128-bit 1600 MHz 7.5x 15 W May 12, 2010 TMK625GAV23GM
Turion II K645 1600 MHz 2 × 1 MB 128-bit 1600 MHz 8.0x 15 W January 4, 2011 TMK645GAV23GM
Turion II K665 1700 MHz 2 × 1 MB 128-bit 1600 MHz 8.5x 15 W May 12, 2010 TMK665GAV23GM
Turion II K685 1800 MHz 2 × 1 MB 128-bit 1600 MHz 9.0x 15 W January 4, 2011 TMK685GAV23GM

Danube platform (2010)[edit]

The Danube platform[7][10] introduced on May 12, 2010 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single, Dual, Triple or Quad-core 64-bit processors codenamed Champlain, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 25, 35 or 45 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

Single-core mobile processor

V series[edit]

Champlain (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[10] HT Mult.1 Voltage TDP Socket Release date Order Part Number
V 120 2200 MHz 512 kB 64-bit 1600 MHz 11.0x 25 W Socket S1G4 May 12, 2010 VMV120SGR12GM
V 140 2300 MHz 512 kB 64-bit 1600 MHz 11.5x 25 W Socket S1G4 October 4, 2010 VMV140SGR12GM
V 160 2400 MHz 512 kB 64-bit 1600 MHz 12.0x 25 W Socket S1G4 January 4, 2011 VMV160SGR12GM

Dual-core mobile processor

Athlon II[edit]

Champlain (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[10] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon II P320 2100 MHz 2 × 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G4 May 12, 2010 AMP320SGR22GM
Athlon II P340 2200 MHz 2 × 512 kB 64-bit 1600 MHz 11.0x 25 W Socket S1G4 October 4, 2010 AMP340SGR22GM
Athlon II P360 2300 MHz 2 × 512 kB 64-bit 1600 MHz 11.5x 25 W Socket S1G4 January 4, 2011 AMP360SGR22GM
Athlon II N330 2300 MHz 2 × 512 kB 64-bit 1600 MHz 11.5x 35 W Socket S1G4 May 12, 2010 AMN330DCR22GM
Athlon II N350 2400 MHz 2 × 512 kB 64-bit 1600 MHz 12.0x 35 W Socket S1G4 October 4, 2010 AMN350DCR22GM
Athlon II N370 2500 MHz 2 × 512 kB 64-bit 1600 MHz 12.5x 35 W Socket S1G4 January 4, 2011 AMN370DCR22GM

Turion II[edit]

Champlain (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[10] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion II P520 2300 MHz 2 × 1 MB 128-bit 1800 MHz 11.5x 25 W Socket S1G4 May 12, 2010 TMP520SGR23GM
Turion II P540 2400 MHz 2 × 1 MB 128-bit 1800 MHz 12.0x 25 W Socket S1G4 October 4, 2010 TMP540SGR23GM
Turion II P560 2500 MHz 2 × 1 MB 128-bit 1800 MHz 12.5x 25 W Socket S1G4 October 19, 2010 TMP560SGR23GM
Turion II N530 2500 MHz 2 × 1 MB 128-bit 1800 MHz 12.5x 35 W Socket S1G4 May 12, 2010 TMN530DCR23GM
Turion II N550 2600 MHz 2 × 1 MB 128-bit 1800 MHz 13.0x 35 W Socket S1G4 October 4, 2010 TMN550DCR23GM
Turion II N570 2700 MHz 2 × 1 MB 128-bit 1800 MHz 13.5x 35 W Socket S1G4 January 4, 2011 TMN570DCR23GM

Phenom II[edit]

  • MMX, SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Unlike desktop models, mobile Phenom II-based models do not have L3 cache
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)[edit]

Model Number Frequency L2 Cache FPU width[10] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Phenom II P650 2600 MHz 2 × 1 MB 128-bit 1800 MHz 13.0x 25 W Socket S1G4 October 19, 2010 HMP650SGR23GM
Phenom II N620 2800 MHz 2 × 1 MB 128-bit 1800 MHz 14.0x 35 W Socket S1G4 May 12, 2010 HMN620DCR23GM
Phenom II N640 2900 MHz 2 × 1 MB 128-bit 1800 MHz 14.5x 35 W Socket S1G4 October 4, 2010 HMN640DCR23GM
Phenom II N660 3000 MHz 2 × 1 MB 128-bit 1800 MHz 15.0x 35 W Socket S1G4 January 4, 2011 HMN660DCR23GM
Phenom II X620 BE 3100 MHz 2 × 1 MB 128-bit 1800 MHz 15.5x 45 W Socket S1G4 May 12, 2010 HMX620HIR23GM

Triple-core mobile processors

Model Number Frequency L2 Cache FPU width[10] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Phenom II P820 1800 MHz 3 × 512 kB 128-bit 1800 MHz 09.0x 25 W Socket S1G4 May 12, 2010 HMP820SGR32GM
Phenom II P840 1900 MHz 3 × 512 kB 128-bit 1800 MHz 09.5x 25 W Socket S1G4 October 4, 2010 HMP840SGR32GM
Phenom II P860 2000 MHz 3 × 512 kB 128-bit 1800 MHz 10.0x 25 W Socket S1G4 October 4, 2010 HMP860SGR32GM
Phenom II N830 2100 MHz 3 × 512 kB 128-bit 1800 MHz 10.5x 35 W Socket S1G4 May 12, 2010 HMN830DCR32GM
Phenom II N850 2200 MHz 3 × 512 kB 128-bit 1800 MHz 11.0x 35 W Socket S1G4 October 4, 2010 HMN850DCR32GM
Phenom II N870 2300 MHz 3 × 512 kB 128-bit 1800 MHz 11.5x 35 W Socket S1G4 January 4, 2011 HMN870DCR32GM

Quad-core mobile processors

Model Number Frequency L2 Cache FPU width[10] HT Mult.1 Voltage TDP Socket Release date Order Part Number
Phenom II P920 1600 MHz 4 × 512 kB 128-bit 1800 MHz 08.0x 25 W Socket S1G4 May 12, 2010 HMP920SGR42GM
Phenom II P940 1700 MHz 4 × 512 kB 128-bit 1800 MHz 08.5x 25 W Socket S1G4 October 4, 2010 HMP940SGR42GM
Phenom II P960 1800 MHz 4 × 512 kB 128-bit 1800 MHz 09.0x 25 W Socket S1G4 October 19, 2010 HMP960SGR42GM
Phenom II N930 2000 MHz 4 × 512 kB 128-bit 1800 MHz 10.0x 35 W Socket S1G4 May 12, 2010 HMN930DCR42GM
Phenom II N950 2100 MHz 4 × 512 kB 128-bit 1800 MHz 10.5x 35 W Socket S1G4 October 4, 2010 HMN950DCR42GM
Phenom II N970 2200 MHz 4 × 512 kB 128-bit 1800 MHz 11.0x 35 W Socket S1G4 January 4, 2011 HMN970DCR42GM
Phenom II X920 BE 2300 MHz 4 × 512 kB 128-bit 1800 MHz 11.5x 45 W Socket S1G4 May 12, 2010 HMX920HIR42GM
Phenom II X940 BE 2400 MHz 4 × 512 kB 128-bit 1800 MHz 12.0x 45 W Socket S1G4 January 4, 2011 HMX940HIR42GM

Brazos platform (2011)[edit]

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit AMD Accelerated Processing Unit APU codenamed Ontario, Zacate and with the followings:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1066 or 1333  MHz (E-450) memory
    • 9 W or 18 W TDP
  • Radeon HD 6xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario" (40 nm)[edit]

Model Number Step. CPU GPU Memory
Support
TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult. Voltage Model Config Freq.
C-30 B0 1 1.2 GHz N/A 512 kB 12× 1.25 - 1.35 HD 6250 80:8:4 276 MHz DDR3-1066 9 W January 4, 2011 CMC30AFPB12GT
C-50 2 1.0 GHz 2 × 512 kB 10× 1.05 - 1.35 277 MHz CMC50AFPB22GT
C-60 C0 1.33 GHz HD 6290 276 - 400 MHz August 22, 2011 CMC60AFPB22GV

"Zacate" (40 nm)[edit]

  • SSE, SSE2, SSE3, SSSE3, SSE4a, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model Number Step. CPU GPU Memory
Support
TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult. Voltage Model Config Freq.
E-240 B0 1 1.5 GHz N/A 512 kB 15× 1.175 - 1.35 HD 6310 80:8:4 500 MHz DDR3-1066 18 W January 4, 2011 EME240GBB12GT
E-300 B0 2 1.3 GHz 2 × 512 kB 13× 488 MHz August 22, 2011 EME300GBB22GV
E-350 B0 1.6 GHz 16× 1.25 - 1.35 492 MHz January 4, 2011 EME350GBB22GT
E-450 B0 1.65 GHz 16.5× HD 6320 508 – 600 MHz DDR3-1333 August 22, 2011 EME450GBB22GV

Sabine (Fusion) platform (2011)[edit]

The Sabine platform[15] introduced on June 30, 2011 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Llano, and with the followings:
    • made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 35 W or 45 W TDP
  • Radeon HD 6xxxG GPU on 32 nm process
    • Sumo graphics core with up to 400 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Llano" (32 nm)[edit]

  • SSE, SSE2, SSE3, SSE4a, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
  • Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.148 billion
  • Die size: 228 mm²
Model Number Step. CPU GPU Memory
Support
TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config1 Freq.
E2-3000M B0 2 1.8 GHz 2.4 GHz 2 × 512 kB 18x 0.9125 - 1.4125 HD 6380G 160:8:4 400 MHz DDR3-1333 35 W FS1 June 14, 2011 EM3000DDX22GX
A4-3300M B0 2 1.9 GHz 2.5 GHz 2 × 1 MB 19x 0.9125 - 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3300DDX23GX
A4-3305M B0 2 1.9 GHz 2.5 GHz 2 × 512 kB 19x 0.8750 - 1.4125 HD 6480G 160:8:4 593 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3305DDX22GX
A4-3310MX B0 2 2.1 GHz 2.5 GHz 2 × 1 MB 21x 0.9125 - 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3310HLX23GX
A4-3320M B0 2 2.0 GHz 2.6 GHz 2 × 1 MB 20x 0.9125 - 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3320DDX23GX
A4-3330MX B0 2 2.2 GHz 2.6 GHz 2 × 1 MB 22x 0.9125 - 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3330HLX23GX
A6-3400M B0 4 1.4 GHz 2.3 GHz 4 × 1 MB 14x 0.9125 - 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3400DDX43GX
A6-3410MX B0 4 1.6 GHz 2.3 GHz 4 × 1 MB 16x 0.9125 - 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3410HLX43GX
A6-3420M B0 4 1.5 GHz 2.4 GHz 4 × 1 MB 15x 0.9125 - 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3420DDX43GX
A6-3430MX B0 4 1.7 GHz 2.4 GHz 4 × 1 MB 17x 0.9125 - 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3430HLX43GX
A8-3500M B0 4 1.5 GHz 2.4 GHz 4 × 1 MB 15x 0.9125 - 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3500DDX43GX
A8-3510MX B0 4 1.8 GHz 2.5 GHz 4 × 1 MB 18x 0.9125 - 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3510HLX43GX
A8-3520M B0 4 1.6 GHz 2.5 GHz 4 × 1 MB 16x 0.9125 - 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3520DDX43GX
A8-3530MX B0 4 1.9 GHz 2.6 GHz 4 × 1 MB 19x 0.9125 - 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3530HLX43GX
A8-3550MX B0 4 2.0 GHz 2.7 GHz 4 × 1 MB 20x 0.9125 - 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3550HLX43GX

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)[edit]

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit AMD Accelerated Processing Unit APU codenamed Zacate and with the followings:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1333 MHz memory
    • 18 W TDP
  • Radeon HD 7xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario", "Zacate" (40 nm)[edit]

  • SSE, SSE2, SSE3, SSSE3, SSE4a, NX bit, AMD64, PowerNow!, AMD-V
  • Single-channel DDR3 SDRAM, DDR3L SDRAM
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model Number Step. CPU GPU Memory
Support
TDP Release Date Part Number
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config Freq. Turbo
C-70 C0 2 1.0 GHz 1.33 GHz 2 × 512 kB 10× HD 7290 80:8:4 276 MHz 400 MHz DDR3-1066 09 W September 27, 2012 CMC70AFPB22GV
E1-1200 B0 1.4 GHz N/A 14× HD 7310 500 MHz N/A 18 W June 6, 2012 EM1200GBB22GV
E2-1500 1.48 GHz 529 MHz N/A January 7, 2013
E2-1800 1.7 GHz 17× HD 7340 523 MHz 680 MHz DDR3-1333 June 6, 2012 EM1800GBB22GV
E2-2000 1.75 GHz 538 MHz 700 MHz January 7, 2013

Comal (Fusion) platform (2012)[edit]

The Comal platform introduced on May 15, 2012 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD Accelerated Processing Unit APU codenamed Trinity, and with the followings:
    • Piledriver cores made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 17 W, 25 W or 35 W TDP
  • Radeon HD 7xxxG GPU on 32 nm process
    • Devastator graphics core with up to 384 SP
    • DirectX 11
    • UVD 3.2
Mobile chipset

"Trinity" (2012, 32 nm)[edit]

Model Number Step. CPU GPU Memory
Support
TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config1 Freq. Turbo
standard power
A4-4300M B0 2 2.5 GHz 3.0 GHz 1 MB 25× 0.8125 - 1.3 HD 7420G 128:8:4 480 MHz 655 MHz DDR3-1600 35 W FS1r2 May 2012 AM4300DEC23HJ
A6-4400M B0 2 2.7 GHz 3.2 GHz 1 MB 27× 0.8125 - 1.3 HD 7520G 192:12:4 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4400DEC23HJ
A8-4500M B0 4 1.9 GHz 2.8 GHz 2 × 2 MB 19× 0.8125 - 1.3 HD 7640G 256:16:8 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4500DEC44HJ
A10-4600M B0 4 2.3 GHz 3.2 GHz 2 × 2 MB 23× 0.8125 - 1.3 HD 7660G 384:24:8 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4600DEC44HJ
low power
A4-4355M B0 2 1.9 GHz 2.4 GHz 1 MB 21× HD 7400G 192:12:4 327 MHz 424 MHz DDR3-1333 17 W FP2 September 27, 2012 AM4355SHE23HJ
A6-4455M B0 2 2.1 GHz 2.6 GHz 2 MB 21× 0.775 - 1.15 HD 7500G 256:16:8 327 MHz 424 MHz DDR3-1333 17 W FP2 May 15, 2012 AM4455SHE24HJ
A8-4555M B0 4 1.6 GHz 2.4 GHz 2 × 2 MB 16× HD 7600G 384:24:8 320 MHz 424 MHz DDR3-1333 19 W FP2 September 27, 2012 AM4555SHE44HJ
A10-4655M B0 4 2.0 GHz 2.8 GHz 2 × 2 MB 20× 0.85 - 1.2 HD 7620G 384:24:8 360 MHz 496 MHz DDR3-1333 25 W FP2 May 15, 2012 AM4655SIE44HJ

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)[edit]

  • Elite Performance APU.[16][17]
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.303 billion
  • Die size: 246 mm²
Model Number Step. CPU GPU Memory
Support
TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config Freq. Turbo
standard power
A4-5150M 2 2.7 GHz 3.3 GHz 1 MB HD 8350G 128:8:4 533 MHz 720 MHz DDR3-1600 35 W FS1r2 Q1 2013 AM5150DEC23HL
A6-5350M 2.9 GHz 3.5 GHz HD 8450G 192:12:4 533 MHz 720 MHz DDR3-1600 FS1r2 Q1 2013 AM5350DEC23HL
A6-5357M 2.9 GHz 3.5 GHz HD 8450G 192 533 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5357DFE23HL
A8-5550M 4 2.1 GHz 3.1 GHz 2 × 2 MB HD 8550G 256:16:8 515 MHz 720 MHz DDR3-1600 FS1r2 Q1 2013 AM5550DEC44HL
A8-5557M 2.1 GHz 3.1 GHz HD 8550G 256 554 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5557DFE44HL
A10-5750M 2.5 GHz 3.5 GHz HD 8650G 384:24:8 533 MHz 720 MHz DDR3-1866 FS1r2 Q1 2013 AM5750DEC44HL
A10-5757M 2.5 GHz 3.5 GHz HD 8650G 384 600 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5757DFE44HL
low power
A4-5145M 2 2.0 GHz 2.6 GHz 1 MB HD 8310G 128 424 MHz 554 MHz DDR3L-1333 17 W FP2 (BGA) May 2013 AM5145SIE44HL?
A6-5345M 2.2 GHz 2.8 GHz HD 8410G 192 450 MHz 600 MHz DDR3L-1333 May 2013 AM5345SIE44HL?
A8-5545M 4 1.7 GHz 2.7 GHz 2 × 2 MB HD 8510G 384 450 MHz 554 MHz DDR3L-1333 19 W May 2013 AM5545SIE44HL
A10-5745M 2.1 GHz 2.9 GHz HD 8610G 384 533 MHz 626 MHz DDR3L-1333 25 W May 2013 AM5745SIE44HL

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)[edit]

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core or quad-core 64-bit AMD Accelerated Processing Unit APU codenamed Kabini, Temash and with the followings:
    • Jaguar cores made on 28 nm CMOS process
    • support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory
    • 3.9 - 25 W TDP
  • Radeon HD 8xxx GPU on 28 nm process
  • Integrated FCH
  • SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, CLMUL, AES, F16C, BMI1, NX bit, AMD64, PowerNow!, AMD-V
  • Socket FT3 (BGA)
  • Turbo Dock Technology, C6 and CC6 low power states

"Temash" (2013, 28 nm)[edit]

Elite Mobility APU:

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult.1 Vcore Model Config1 Freq. Turbo
A4-1200 B0[citation needed] 2 1.0 GHz N/A 1 MB HD 8180 128:8:4 225 MHz N/A DDR3L-1066 3.9 W May 2013 AT1200IFJ23HM
A4-1250 HD 8210 300 MHz DDR3L-1333 8 W May 2013 AT1250IDJ23HM
A6-1450 4 1.4 GHz 2 MB HD 8250 300 MHz 400 MHz DDR3L-1066 8 W May 2013 AT1450IDJ44HM

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)[edit]

Mainstream APU:

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult.1 Vcore Model Config1 Freq. Turbo
E1-2100 B0 2 1.00 GHz N/A 1 MB HD 8210 128:8:4 300 MHz N/A DDR3L-1333 09 W May 2013 EM2100ICJ23HM
E1-2500 1.40 GHz HD 8240 400 MHz DDR3L-1333 15 W May 2013 EM2500IBJ23HM
E2-3000 1.65 GHz HD 8280 450 MHz DDR3L-1600 15 W May 2013 EM3000IBJ23HM
A4-5000 4 1.50 GHz 2 MB HD 8330 500 MHz DDR3L-1600 15 W May 2013 AM5000IBJ44HM
A6-5200 2.00 GHz HD 8400 600 MHz DDR3L-1600 25 W May 2013 AM5200IAJ44HM

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)[edit]

Mullins, Tablet/2-in-1 APU[edit]

Model Stepping CPU GPU Memory
support
TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1 Micro-6200T 2 1.0 GHz 1.4 GHz 1 MB 0.50 - 1.40 V R2 128:8:4 300 MHz DDR3L-1066 3.95 W Q2 2014 EM620TIWJ23JB
A4 Micro-6400T 4 1.0 GHz 1.6 GHz 2 MB R3 350 MHz DDR3L-1333 4.5 W Q2 2014 AM640TIVJ44JB
A10 Micro-6700T 1.2 GHz 2.2 GHz 2 MB R6 500 MHz DDR3L-1333 4.5 W Q2 2014 AM670TIVJ44JB

Beema, Notebook APU[edit]

Model Stepping CPU GPU Memory
support
TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1-6010 2 1.35 GHz N/A 1 MB 0.50 - 1.40 V R2 128:8:4 350 MHz DDR3L-1333 10 W Q2 2014 EM6010IUJ23JB
E2-6110 4 1.5 GHz 2 MB R2 500 MHz DDR3L-1600 15 W Q2 2014 EM6110ITJ44JB
A4-6210 1.8 GHz 2 MB R3 600 MHz DDR3L-1600 15 W Q2 2014 AM6210ITJ44JB
A6-6310 2 GHz 2.4 GHz 2 MB R4 800 MHz DDR3L-1866 15 W Q2 2014 AM6310ITJ44JB

Kaveri (2014)[edit]

Model number CPU GPU Memory
support
TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
A6-7000 2 2.2 GHz 3.0 GHz 1 MB 22× R4 192:12:4 494 MHz 533 MHz DDR3-1333 17W FP3 June 2014 AM7000ECH23JA
A6 Pro-7050B 553 MHz N/A
A8-7100 4 1.8 GHz 3.0 GHz 2× 2 MB 18× R5 256:16:4 450 MHz 514 MHz DDR3-1600 19W FP3 June 2014 AM7100ECH44JA
A8 Pro-7150B 1.9 GHz 3.2 GHz 19× 553 MHz N/A
A10-7300 1.9 GHz 3.2 GHz 19× R6 384:24:8 464 MHz 533 MHz AM7300ECH44JA
A10 Pro-7350B 2.1 GHz 3.3 GHz 21× 553 MHz N/A
FX-7500 2.1 GHz 3.3 GHz 21× R7 384:24:8 498 MHz 533 MHz FM7500ECH44JA
A8-7200P 4 2.4 GHz 3.3 GHz 2× 2 MB 24× R5 256:16:4 553 MHz 626 MHz DDR3-1866 35W FP3 June 2014 AM740PDGH44JA
A10-7400P 2.5 GHz 3.4 GHz 25× R6 384:24:8 576 MHz 654 MHz AM740PDGH44JA
FX-7600P 2.7 GHz 3.6 GHz 27× R7 512:32:8 600 MHz 686 MHz DDR3-2133 FM760PDGH44JA

See also[edit]

References[edit]

  1. ^ "The AMD Sempron Processor Model 2100+ Enabling Fanless Designs for Embedded Systems", www.amd.com, May 30, 2007.
  2. ^ a b c d e f g h i j k l m "AMD Turion X2/Turion X2 Ultra". Amd.com. 2014-03-12. Retrieved 2014-04-30. 
  3. ^ AMD Notebook CPU comparison page, retrieved January 15, 2009
  4. ^ "AMD Processors for Notebooks: AMD Turion 64 X2 Mobile Technology, AMD Athlon 64 X2 Dual-Core, Mobile AMD Sempron Processor". Retrieved 2009-11-05. 
  5. ^ "2nd Gen AMD Ultrathin Platform". Amd.com. Retrieved 2014-04-30. 
  6. ^ a b c d e "The 2009 AMD Mainstream Platform". Amd.com. Retrieved 2014-04-30. 
  7. ^ a b "AMD M880G Chipset". Amd.com. Retrieved 2014-04-30. 
  8. ^ a b c d e "The 2010 AMD Ultrathin Platform". Amd.com. Retrieved 2014-04-30. 
  9. ^ a b "Mehr Leistung: Triple- und Quadcores für Notebooks - AMD Vision - neue Notebook-Plattformen Danube und Nile". Chip.de. 2010-05-12. Retrieved 2014-04-30. 
  10. ^ a b c d e f g "The 2010 AMD Mainstream Platform". Amd.com. Retrieved 2014-04-30. 
  11. ^ Welcome | AMD Blogs
  12. ^ "A closer look at AMD's Brazos platform". Techreport.com. 2010-11-08. Retrieved 2014-04-30. 
  13. ^ The AMD Fusion Family of APUs[dead link]
  14. ^ "AMD Fusion APU Era Begins". Amd.com. Retrieved 2014-04-30. 
  15. ^ "2011 AMD Notebook Platform". Amd.com. Retrieved 2014-04-30. 
  16. ^ "AMD intros 35W Richland mobile APUs". The Tech Report. 2013-03-12. Retrieved 2014-04-30. 
  17. ^ Poeter, Damon (2013-03-12). "AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion". PCMag.com. Retrieved 2014-04-30. 

External links[edit]