Mobile-ITX is the smallest (by 2009) x86 compliant motherboard form factor presented by VIA Technologies in December, 2009. The motherboard size (CPU module) is 60 × 60 mm (2.4 × 2.4 in). There are no computer ports on the CPU module and it is necessary to use an I/O carrier board. The design is intended for medical, transportation and military embedded markets. The first commercial Mobile-ITX CPU module is expected in Q1 of 2010.
The Mobile-ITX form factor was announced by VIA Technologies at Computex in June, 2007. The motherboard size of first prototypes was 75 × 45 mm (3.0 × 1.8 in). The design was intended for ultra-mobile computing such as a smartphone or UMPC.
The prototype boards shown to date include a x86-compliant 1 GHz VIA C7-M processor, 256 or 512 megabytes of RAM, a modified version of the VIA CX700 chipset (called the CX700S), an interface for a cellular radio module (demonstration boards contain a CDMA radio), a DC-DC electrical converter, and various connecting interfaces.
Notes and references
|Wikimedia Commons has media related to Mobile-ITX.|
- "VIA Mobile-ITX Brings Further Miniaturization and Greater Flexibility to Embedded Devices". VIA Technologies, Inc. 2009-12-01.
- "VTF2007: VIA Mobile-ITX Mainboard Will Expedite PC2.0 Transition". Taipei, Taiwan: VIA Technologies, Inc. 2007-06-06. Retrieved 2008-10-08.
- Mini-ITX, Nano-ITX and Pico-ITX related news - VTF 2007 - Next Stop: Mobile-ITX
- YouTube - Computex 2007 - Mobile-ITX Demo
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