Paul K. Chu

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Paul K. Chu
Paul Chu Picture Sep 2012.jpg

Paul K. Chu (朱劍豪) is a specialist in plasma surface modification and materials science. He is Chair Professor of Materials Engineering at City University of Hong Kong.

Biography[edit]

He received his BS in mathematics (cum laude) from The Ohio State University in 1977 and his MS and PhD in chemistry from Cornell University in 1979 and 1982, respectively.

He is a Fellow of the American Physical Society (APS), American Vacuum Society (AVS), IEEE,[1] Materials Research Society (MRS), and Hong Kong Institution of Engineers. He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences, 2008 MRS (Taiwan) JW Mayer Lectureship, and 2011 Shanghai Natural Science First Class Award.

He is chairman of the International Plasma-Based Ion Implantation Executive Committee which organizes the biennial International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D) and a member of the Ion Implantation Technology (IIT) International Committee that organizes the biennial International Conference on Ion Implantation Technology as well as the IEEE Nuclear and Plasma Science Society Fellow Evaluation Committee.

He holds or has held advisory or visiting professorship in thirteen universities and research institutes in China, including the Institute of Microelectronics in Peking University, Department of Physics in Nanjing University, and Shanghai Institute of Ceramics of the Chinese Academy of Sciences. He has established a joint PhD program with the University of Sydney in Australia.

Prof. Chu is associate editor of Materials Science and Engineering: Reports, and a member of the editorial board of Biomaterials, Advanced Materials Interfaces, Surface and Interface Analysis, Surface and Coatings Technology, Recent Patents on Materials Science, International Journal of Molecular Engineering, and Cancer Technology: Basic, Translational, and Clinical Research.

Publications[edit]

Prof. Chu has authored / co-authored more than 1,100 journal papers and given more than 100 plenary, keynote, and invited talks in international scientific conferences. He is also editor of 8 books on plasma science and engineering, biomaterials, and nanotechnology and co-authored more than 30 book chapters. For a complete list of his publications, please visit: http://www6.cityu.edu.hk/appkchu/plasma/Paul%20Chu/paul_chu.htm. Updated information is also available on Google Scholars (http://scholar.google.com/citations?hl=en&user=m5i0T5gAAAAJ&view_op=list_works&pagesize=100) and Thomson Reuters ResearcherID (http://www.researcherid.com/rid/B-5923-2013).

    • Ion-Beam-Based Nanofabrication, Materials Research Society Symposium Proceedings volume 1020 (ISBN 978-1-55899-980-2), D. Ila, J. Baglin, N. Kishimoto, and P. K. Chu (Editors), USA (2007).
    • Biomaterials and Surface Modification (ISBN 978-81-308-0182-7), P. K. Chu and X. Y. Liu (Editors), Research Signpost, Kerala, India (2007).
    • Biomaterials Fabrication and Processing Handbook (ISBN 978-0849379734), P. K. Chu and X. Y. Liu (Editors), CRC Press / Taylor and Francis, California (2008).
    • Surface Modification of Materials by Coatings and Films (ISBN 978-81-308-0285-5), X. Y. Liu and P. K. Chu (Editors), Research Signpost, Kerala, India (2009).
    • Ion Beams and Nano-Engineering, Materials Research Society Symposium Proceedings volume 1181 (ISBN 978-1-60511-154-4), D. Ila, P. K. Chu. J. K. N. Lindner, N. Kishimoto, and J. E. E. Baglin (Editors), Materials Research Society, Warrendale, USA (2009).
    • Solid State Circuits Technologies (ISBN 978-953-307-086-5), P. K. Chu (Editor), IN-TECH, Croatia (2010).
    • 2010 3rd IEEE International NanoElectronics Conference (Hong Kong) Proceedings (ISBN 978-1-4244-3544-9), P. K. Chu (Editor), IEEE Press (2010).

Patents[edit]

  • He has been granted 12 US, 1 European, and 8 Chinese patents

References[edit]

  1. ^ New IEEE Fellows 2003, retrieved 1/24/07

External links[edit]