PlayStation 4 technical specifications
The PlayStation 4 technical specifications describe the internal components of the PlayStation 4 video game console.
- 1 Processors and memory
- 2 Storage
- 3 Input and output
- 4 Power usage
- 5 References
Processors and memory
The PlayStation 4 uses a semi-custom accelerated processing unit (APU) developed by AMD in cooperation with Sony and is manufactured on the TSMC 28 nm process node. Its APU is a single-chip that combines a central processing unit (CPU) and graphics processing unit (GPU), as well as other components such as a memory controller and video decoder/encoder. The console also includes secondary custom chips that handle tasks associated with downloading, uploading, and social gameplay. These tasks can be handled seamlessly in the background during gameplay or while the system is in sleep mode.
Though not much is publicly known of the PS4's audio capabilities, the console also contains a dedicated hardware audio module, which can support in-game chat with minimal external resources as well as "a very large number" of MP3 streams for use in in-game audio.
The main APU (2013 release) had a die size of 19 by 18.3 mm (0.75 by 0.72 in), with GPUs, CPUs and memory controllers on the same die. 2013 release version APUs contained 20 GCN compute units on die, two of which are thought to be present to provide redundancy to improve manufacturing yield. CPUs plus CPU caches make up approximately 15% of the chip area, and the GPU compute units take up approximately 33% of the 348 mm2 (0.539 sq in) die area.
|Device||CPU (Jaguar)||GPU (GCN)||Memory||Special features|
|Cores||Frequency||L2 Cache||Cores1||Frequency||GFLOPS||Pixel Fillrate (GP/s)2||Texture Fillrate (GT/s)3||Amount||Bus Width (bit)||Bus Type||Bandwidth (GB/s)|
|Sony PS4||dual 4 core modules||1.6-? GHz||2 x 2 MB||1152:72:32||800MHz||1840||25.6||57.6||8 GB||256||GDDR5||176||8 ACEs in the GPU and additional modules|
- 1 Unified Shaders : Texture Mapping Units : Render Output Units
- 2 Pixel fillrate is calculated as the number of ROPs multiplied by the base core clock speed.
- 3 Texture fillrate is calculated as the number of TMUs multiplied by the base core clock speed.
Central processing units
The central processing unit (CPU) consists of two x86-64 quad-core modules for a total of eight cores, which are based on the Jaguar CPU architecture from AMD. Each core has 32 kB L1 instruction and data caches, with one shared 2 MB L2 cache per four core module. The CPU's base clock speed is said to be 1.6 GHz, with an unknown uptick in speed for CPU-intensive usage.
Graphics processing unit
The graphics processing unit (GPU) is AMD's GPGPU-capable Radeon GCN architecture, consisting of 18 compute units (CUs) for a total of 1,152 cores (64 cores per CU), that produces a theoretical peak performance of 1.84 TFLOPS. This processing power can be used for graphics, physics simulation, or a combination of the two, or any other tasks suited for general purpose compute. It is a customized version of AMD's 7870 GPU, with 2 CUs disabled.
Though based on AMD's GCN architecture, there are several known differentiating factors between the PS4's GPU and current-gen PC graphics cards featuring first-gen GCN architecture:
- An additional dedicated 20 GB/s bus that bypasses L1 and L2 GPU cache for direct system memory access, reducing synchronisation challenges when performing fine-grain GPGPU compute tasks.
- L2 cache support for simultaneous graphical and asynchronous compute tasks through the addition of a 'volatile' bit tag, providing control over cache invalidation, reducing the impact of simultaneous graphical and general purpose compute operations.
- An upgrade from 2 to 64 sources for compute commands, improving compute parallelism and execution priority control. This enables finer-grain control over load-balancing of compute commands including superior game-engine integration.
Audio processing unit
The rest of the microchip consists of the on-die memory controller, which is shared by the CPU and the GPU and some additional logic concerned with memory access. With AMD being a founding member of and Sony a contributor to the HSA Foundation the uncore of the PlayStation 4 supports several of the features promoted by the Heterogeneous System Architecture like e.g. hUMA (heterogeneous Uniform Memory Access). This means the system memory is not partitioned, so that a portion of it is exclusively available to the GPU, but unified, hence enabling hardware zero-copy.
System memory (RAM)
The PS4 contains a total of 8 GiB (16×4 Gbit (512 MiB) memory chips) of GDDR5 unified system memory, and is capable of running at a maximum clock frequency of 2.75 GHz (5500 MT/s) with a maximum bandwidth of 176 GB/s. This is 16 times the amount of RAM found in the PS3 and is expected to give the console considerable longevity. The unified memory architecture allows the CPU and GPU to access a consolidated memory, removing the need for separate, dedicated memory pools.
The read-only optical drive reads Blu-ray discs at 6x constant angular velocity for a maximum read speed of 27 MB/s – a significant upgrade from the PS3's 2x speeds that were capped at 9 MB/s. To further enhance optical drive performance, the PS4 features a hardware on-the-fly zlib decompression module (a special piece of hardware used to quickly decompress the data on the Blu-ray disc, which has been compressed to save space and bandwidth), allowing for greater effective bandwidth, whilst at the same time, the console continuously caches data onto its hard disk, even buffering unread data when a game is not actively accessing the optical drive, forming part of Sony's PlayGo strategy.
An additional 256 MB chip, (using a 2 Gbit DDR3 SDRAM chip in the 2013 release) is fitted, thought to be used by the auxiliary processor. An additional 32 MB (256 Mbit) flash memory chip is also fitted.
Input and output
The PlayStation 4 features 802.11 b/g/n WiFi connectivity, Ethernet (10BASE-T, 100BASE-TX and 1000BASE-T), Bluetooth 2.1, and two USB 3.0 ports. An auxiliary port is also included for connection to the PlayStation Camera, a motion detection digital camera device first introduced on the PS2. A mono headset, which can be plugged into the DualShock 4, comes bundled with the system. Audio/video output options include HDMI and optical S/PDIF. The PlayStation 4 does not have an analog audio/video output.
|AMD TrueAudio||This package of user-programmable audio DSPs offloads audio processing from the CPU. Possible effects include 3D audio, audio compression and decompression, reverb, and voice stream processing.|||
|Upload/Download||Capable of uploading and downloading data to the hard disk|
|Video compression/decompression||Capable of encoding/decoding video formats on-the-fly[examples needed]|
|Zlib decoder||Decoding of compressed data from the Blu-ray optical drive|
|WiFi module||Marvell Wireless Avastar 88W8797 Wireless communication : IEEE 802.11 b/g/n, Bluetooth 2.1(EDR).
Skyworks 2614B 315BB
|HDMI module||HDMI output|||
|Ethernet controller||Marvell Alaska 88EC060-NNB2 Ethernet 10/100/1000 support|||
|USB controller||USB 3.0 support|||
|Standby mode||10 W|
|Standby mode (with download)||70 W|
|Idle on menu||89–91 W|
|Game installation||108–116 W|
|Gaming (Resogun)||130–139 W|
|Gaming (Killzone)||144–151 W|
The PS4 is powered via an internal "universal" 110–240 V AC power supply, with a maximum power rating of 250 W. According to tests by Eurogamer, initial consoles drew approximately 80 W when operational in menu mode, rising to around 110–120 W in gameplay, with peaks of 140 W with both gameplay and menus active, tests by the Natural Resources Defense Council showed similar power consumption figures with 137 W gameplay peaks (with PS4 Camera connected); power consumption in (internet connected) standby mode was measured at 8.8 W under the same conditions, with a lower power "off" state drawing 0.5 W.
The PS4 cooling system uses a single centrifugal fan, which draws air in from both sides of the console, split into flows above and below the main PCB, before entering the fan from top and bottom; the fan exhaust then cools the main APU via a heat pipe–connected heatsink, with the exhaust passing over the main power supply before being emitted from the rear of the console.
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