PlayStation technical specifications
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The PlayStation technical specifications describe the various components of the PlayStation video game console.
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Central processing unit
- LSI LR333x0-based Core
- MIPS R3000A-compatible 32-bit RISC chip running at 33.8688 MHz
- The chip is manufactured by LSI Logic Corp. with technology licensed from SGI.
- Geometry transformation engine
- Resides inside the main CPU chip, giving it additional vector math instructions used for 3D graphics
- Also residing within the main CPU, it is responsible for decompressing images and video.
- Documented device mode is to read three RLE-encoded 16×16 macroblocks, run IDCT and assemble a single 16×16 RGB macroblock.
- Output data may be transferred directly to GPU via DMA.
- It is possible to overwrite IDCT matrix and some additional parameters, however MDEC internal instruction set was never documented.
Graphics processing unit
- Handles 2D graphics processing separate from the main 3D engine on the CPU
Sound processing unit
- CD-ROM drive
- 2x, with a maximum data throughput of 300 kB/s
- XA Mode 2 Compliant
- CD-DA (CD-Digital Audio)
- 128 kB buffer
- Stored on 512 kB ROM
- Memory Card
- AV Multi Out
- RCA Composite video and Stereo out (SCPH-100x to 3xxx only)
- RFU DC Out (for Aerial cable) (SCPH-100x to 3xxx only)
- S-Video Out (SCPH-1000 only)
- Serial I/O (used for PlayStation Link Cable SCPH-100x to 900x only)
- Parallel I/O (no official use, SCPH-100x to 750x only)
- AC Connector (SCPH-100x to 900x only)