PlayStation technical specifications

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The PlayStation technical specifications[1][2][3][4][5][6][7] describe the various components of the PlayStation video game console.

Central processing unit[edit]

LSI LR333x0-based Core
Geometry Transformation Engine(GTE)
Motion Decoder(MDEC)
  • Also residing within the main CPU, enables full screen, high quality FMV playback and is responsible for decompressing images and video into RAM.
  • Operating performance: 80 MIPS
  • Documented device mode is to read three RLE-encoded 16×16 macroblocks, run IDCT and assemble a single 16×16 RGB macroblock.
  • Output data may be transferred directly to GPU via DMA.
  • It is possible to overwrite IDCT matrix and some additional parameters, however MDEC internal instruction set was never documented.
  • Features:
    • Compatible with MJPEG and H.261 files
    • Directly connected to CPU bus
An SCPH-1001 motherboard.
An SCPH-9001 motherboard

Graphics processing unit[edit]

32-bit Sony GPU

Sound processing unit[edit]

16-Bit Sony SPU
  • Supports ADPCM sources with up to 24 channels
  • Sampling rate of up to 44.1 kHz
  • 512 kB RAM
  • PCM audio source
  • Digital effects include:
  • Pitch Modulation
  • Envelope
  • Looping
  • Digital Reverb
  • Load up to 512K of sampled waveforms
  • Supports MIDI Instruments

Other[edit]

CD-ROM drive
  • (660MB maximum storage capacity, double speed CD-ROM drive)
  • 2×, with a maximum data throughput of 300 kB/s(Double speed), 150 KB/sec. (Normal)
  • XA Mode 2 compliant
  • Audio CD play
  • CD-DA (CD-Digital Audio)
  • 128 kB buffer
BIOS
  • Stored on 512 kB ROM
Memory Card

I/O System Overview[edit]

  • Control Pad
  • Two control pad connectors
  • Expandable with multitap connector
  • Backup RAM
  • Two removable cards
  • 128 KB Flash Memory
  • OS support for File Save, Retrieve and Remove
  • Serial Port I/O
  • Link Cable Connectivity

Connectivity[edit]


References[edit]