|Traded as||KRX: 009150 KRX: 009155|
|Headquarters||Suwon, Gyeonggi-do, South Korea|
|Key people||CEO: Choi Chi-Joon|
|Products||MLCC, Printed circuit board (PCB), Power supply, Network module, Camera module, precision motor|
|Revenue||US$6.12 billion (consolidated basis) (2011)|
|Operating income||US$673 million|
Samsung Electro-Mechanics, established in 1973 as a manufacturer of key electronic components, has become the leading electronic parts maker in Korea and a major global player, with US$6.12 billion in revenue (2011).
Samsung Electro-Mechanics consists of four divisions. The LCR (Inductance Capacitance Resistance) division includes multilayer ceramic chip capacitors and tantalum capacitors; the ACI (Advanced Circuit Interconnection) division includes high density interconnections and IC (integrated circuit) substrates; the CDS (circuit drive solution) division includes digital tuners, network modules, power modules, and ubiquitous modules; and the OMS (Opto and Mechatronics Solution) division includes image sensor modules and precision motors.
1973 Mar. Samsung-Sanyo Parts Co., Ltd. established (with Sanyo Electric)
- Nov. Production commenced for electronic tuners, deflection yokes, flyback transformers and capacitors
1979 Feb. Listed on Korea Stock Exchange 1983 Mar. Withdrew Sanyo Electric's interest 1987 Feb. Corporate name changed to Samsung Electro-Mechanics
- Jun. Stock par value increased from W500 to W5,000
1993 Jun. Production commenced in Bangpakong Thailand (tuners, deflection yokes, flyback transformers and oil capacitors) 1994 May Production commenced in Tianjin China (tuners, VTRs heads, drums, drum motors)
- May Production commenced in Tijuana, Mexico (tuners, deflection yokes, flyback transformers, capacitors and speakers)
1995 Nov. Awarded a US$1B Export Tower from the Korean government 1996 Oct. Completed the 2nd factory in Dongguan, China 1998 Mar. Acquired ISO14001 certification at Dongguan, China plant
- May Line #2 completed at Tianjin
- Aug. Completed new R&D center
1999 Oct. Production commenced in Busan, Korea (MLBs, MLCCs) 2000 Feb. Production commenced in Calamba, the Philippines
- Nov. Awarded a US$2B Export Tower from the Korean government
2001 May Production commenced in Gaoxin (Tianjin), China 2002 May Busan plant awarded prize for environmental protection
- Nov. Awarded a grand prize in the contest of industrial precision technology
2003 Jul. Awarded a price for exemplary corporate governance (3rd straight year)
- Nov. Awarded 6 Sigma innovation prize at national quality management conference
2004 May Thailand plant awarded the best enterprise prize 2006 Sep. Awarded the grand prize for providing employment to the disabled (True company grand prize)
- Dec. Received Presidential commendation for assisting subcontractors
2007 Apr. Received PQS Award from Intel Corporation 2008 Aug. Members of SEM badminton team won god and silver medals at Beijing Olympics
- Oct. Awarded Korea HR Management Grand Prize
2009 Apr. Completed world’s first 0603 1μF MLCC
- Jun. Completed world’s first 3G antenna
- Oct. Company added to Dow Jones Sustainability Index
- Dec. ”Samsung Group Award” received for MLCC performance (for taking the world’s 2nd largest market share)
2010 Apr. Completed world’s smallest ultra-slim tuner
- May Ranked 16th on Businessweek Tech 100
- Jul. Monthly MLCC output reaches 20B at Tianjin plant
- Jul. Production commenced in Kunshan, China
Samsung Electro-Mechanics manufactures products in a number of categories:
Printed circuit boards (PCBs) 
The purpose of printed circuit boards (PCBs) is to transmit electrical signals among various electronic parts and components. Microcircuits and build-up technologies are applied to produce the class of PCB known as the high-density interconnection (HDI) board. These value-added parts enable engineers to make their finished products lighter, thinner and smaller. HDI boards are mainly found in top-end handheld devices, and Samsung Electro-Mechanics enjoys a major share of the world market for HDI boards used in mobile phones.
Package Substrates The package substrate is responsible for conveying electrical signals between semiconductors and the motherboard on which they are attached. This substrate consists of much smaller circuitry than that found on conventional types. Ball grid array (BGA) is a technology that eliminates the need for wire bonding on chip packages. The flip-chip chip scale package (FC CSP) is a substrate that uses bumps to electrically connect the chip with the motherboard. The flip-chip ball grid array is a substrate for high-end semiconductor packages. The semiconductor chip and substrate are connected by flip-chip bumps, improving the electrical and thermal properties.
MLCC (multilayer chip capacitor) 
The multilayer chip capacitor (MLCC) is a commonly used part in electronic products. For example, a smart phone has more than 400 MLCCs, while a tablet PC contains about 500, a laptop computer contains least 800 and an LCD TV uses over 1,300. These devices serve as a kind of dam to adjust electrical current to the specification of the product in question.
The global trend toward smaller and lighter electronics products is driving demand for MLCCs of smaller sizes with higher capacities.
Power modules (SMPS) 
The power module converts externally supplied electricity to the required output voltage for electronic products.
Samsung has focused its resources on the production of power modules for displays and TVs. A segment of special note is the LED TV, which is experiencing skyrocketing demand. The company also promotes cooperation among the corporate, research and academic communities to develop technologies and next-generation devices that can ensure competitiveness going forward. Moreover, prerequisite technologies have been obtained for the switched-mode power supply (SMPS) as part of an ongoing expansion of the power module lineup.
The adapter is an external power supply that converts the alternating current delivered by an electric cord to direct current for use. Special technologies have been applied to raise conversion efficiency and reduce thickness, making these devices well suited for use with a wide range of products, from laptop PCs and LCD TVs to game consoles and lighting.
Camera modules 
The camera module has an image sensor that converts the light that enters through the lens into digital signals, which are then used to produce still pictures or video.
Samsung Electro-Mechanics is developing exceptional mobile phone camera modules with high pixel resolution, ultra-slim profile, automatic focus, zoom lens and other attractive features.
The company is also expanding its camera module business into new applications such as automobiles and home networks.
Precision motors 
Samsung Electro-Mechanics’s lineup of small electrical motors is evolving from the conventional stand-alone models to mechanical devices sold as system components.
The company is now developing precision motors that last longer and operate at much higher rpms, and this transition is expected to elevate market share.
Network Modules 
Wi-Fi Modules The Wi-Fi (a trademark) module enables personal computers, video game consoles, smartphones, tablets and other products to access the internet in real time.
Cellular Modules The cellular module uses broadband frequencies to provide tablets, personal computers and M2M devices with internet connectivity.
Digital Tuners The digital tuner is an essential component for the digital broadcasting industry. This front-end component is built into TVs and other broadcasting receivers to select the right signals from broadcasters so that viewers can watch their desired channels. Samsung Electro-Mechanics has integrated high-frequency technologies for digital tuners with the most advanced ceramics technologies to develop the world’s smallest mobile twin (satellite/terrestrial) tuners. They operate on very low power, which is good for the environment.
Global Worksite 
Samsung Electro-Mechanics, which directly sells over 80 percent of its own products overseas Samsung operates production subsidiaries, R&D centers, sales subsidiaries, and offices suitable for the characteristics of the five regions of the U.S., Europe, Japan, China, and Southeast Asia. Customers can visit Samsung Electro-Mechanics, a global supplier that guarantees high-quality products, in any corner of the globe.
Domestic worksite (Korea) 
H.Q. & Suwon Plant
150, Maeyoung Road, Yeongtong-Gu, Suwon City, Kyeonggi Province 443-743, Korea
25, Samsung Road, Yeondong-myeon, Sejong 339-702, Korea
114, Noksansaneopjung Road, Gangseo-gu, Busan 618-270, Korea
21st Fl, Samsung Seocho-Tower 1320-10, Seocho 2-dong, Seocho-gu, Seoul 137-857, Korea
Overseas Plant 
Dongguan Samsung Electro-Mechanics Co., Ltd.(DSEM) Hengkeng Management Area, Liaobu Town, Dongguan City, Guangdong Province, China 523413
Tianjin Samsung Electro-Mechanics Co., Ltd.(TSEM) 27, Heiniucheng-Road, Tianjin, China 300210
Samsung High-Tech Electro-Mechanics Co., Ltd.(STEM) Xiqing Dist. Micro-Electronics Industrial Park, Jingang Highway, Tianjin, China 300385
Kunshan Samsung Electro-Mechanics Co., Ltd.(KSEM) 8, Yoaning Rd, Kunshan E&T Development Zone, Jiangsu Province, P.R. China 215300
Samsung Electro-Mechanics Philippines Corp.(SEMPHIL) Block No. 5, Calamba Premiere International Park, Barangay Batino, Calamba, Laguna, The Philippines
Samsung Electro-Mechanics Thailand Co., Ltd.(SEMT) Wellgrow Industrial Estate, 93 Moo 5T. Bangsamak, A. Bangpakong, Chachoengsao 24180, Thailand
Hungary Plant Samsung Electro-Mechanics Hungary branch, H-2310 Leshegy utca 2-4 Szigetszentmiklos Pest megye, Hungary
Overseas Sales office 
- Samsung Electro-Mechanics America, Inc. 3333 Michelson Drive Suite 500, Irvine, California, 92612, U.S.
- Sao Paulo Office 04578-910 Av. Das Nações Unidas, 12901 - Torre Oeste 22 andar - Brooklin Novo Sao Paulo, Brasil
- San Jose Office 85W Tasman Drive, San Jose, California, 95134 U.S.
- Chicago Office 1870 West Winchester Blvd. Suite# 247 Libertyville, Illinois, 60048 U.S.
- Phoenix Office 4505 E. Chandler Blvd., Suite 115, Phoenix, Arizona, 85048, U.S.
- R&D Center (Atlanta) 30308 75 Fifth Street, NW Suite 760 Atlanta Georgria, U.S.
- Samsung Electro-Mechanics GmbH. Samsung Haus, Am Kronberger Hang 6, 65824 Schwalbach/TS, Germany
- London Office Samsung House 1000, Hillswood Drive, Chertsey Surrey KT16 OPS, UK
- Istanbul Office Harman Caddesi, Polat Plaza B-Block No.4, Kat4 Levent-80640 Istanbul, Turkey
- Helsinki Office 02601 Lars Sonckin Kaari 14 Espoo Finland
- Samsung Electro-Mechanics (H.K.) Ltd. 8/F., Central Plaza, 18 Harbour Road, Wanchai, Hongkong, China
- Shenzhen Office46 F, New World Center, Yitian Road, Futian District, Shenzhen, China 518026
- Suzhou Plant Suchuan #17D Industrial Square, No.428 Xinlong Street, Suzhou Industrial Park, Suzhou, China 215000
- Beijing Office 24F, China Merchants Tower, No.118, Jianguo Rd., Chaoyang District, Beijing, China 100022
- Shanghai Office Rm. 1211, Shanghai International Trade Center No.2201 Yan An (W) Rd., Shanghai, China 200335
- Taipei Office 9F-1, No.399, Ruey Kuang Road, Neihu District, Taipei City 114, Taiwan R.O.C.
- Samsung Japan Co., Ltd. 17th Fl., Roppongi T-Cube Building,3-1-1, Roppongi, Minato-Ku, Tokyo 106-8532, Japan
- Osaka Office 6th Fl., Crystal Tower, 1-2-27, Shiromi Chuo-ku, Osaka 540-6006, Japan
- Samsung Electro-Mechanics Private Limited. 3 Church Street Samsung Hub #23-02 Singapore 049483
- Bangkok Office 23rd Floor, Lake Rajada Bldg., 193/100 Rachadapisek Road, Klongtoey, Bangkok 10110, Thailand
- Penang Office 11700, 1-05-3A, Menara IJM Land, Lebuh Tunku Kudin 3, Gelugor, Penang, Malaysia
- Manila Office Block No. 5, Calamba Premiere International Park, Barangay Batino, Calamba, Laguna, The Philippines
- New Delhi Office 122009, Vipul Tech Square, 2nd Floor, Golf Course Road, Sector-43, Guragon, Haryana, India
- Bengaluru R&D Center 560-052 3rd Floor, J.P.& Devi Arcade, #69, Millers Road Bangalore Karnataka India
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- Samsung Electro-mechanics's Badminton Club