Cannonlake is Intel's codename for the 10 nanometer die shrink of Intel's Skylake microarchitecture, expected to be released in 2016. As a die shrink, Cannonlake is a "tick" in Intel's tick-tock execution plan as the next step in semiconductor fabrication.
Cannonlake will be used in conjunction with Intel 200 Series chipsets, also known as Union Point. The platform as a whole will be named Union Bay.
Further process nodes than Cannonlake's 10 nm are not clear, although Intel development documents from Q3 2012 indicates 7 nm node may reach production around 2017, with 5 nm in 2019. In 2009 Intel's former CEO Paul S. Otellini was quoted as saying that silicon is in its last decade as the base material of the CPU, with replacement options such as Indium antimonide or optical computing.
- "Intel's Cannonlake 10nm Microarchitecture is Due For 2016 - Compatible On Union Bay With Union Point PCH". WCCFTech. Retrieved 24 September 2014.
- "Intel forges ahead to 7nm – without the use of EUV lasers - ExtremeTech". ExtremeTech. Retrieved 29 September 2014.
- "Intel Has 5 nm Processors in Sight". tomshardware.com. 2012-09-13.
- "Intel looks beyond silicon for processors past 2017". Apcmag.com. 2009-10-25.