Talk:Die singulation

Untitled[edit]

How can you cut a brittle material such as silicon in fine pieces without damaging the fine IC structures? --Abdull 14:14, 17 February 2007 (UTC)[reply]

I dont know how they do it in industry but the way we did it in our undergraduate labs was to use a special device to accurately score the surface and then break the chips apart. I imagine whatever cutting method they use ,quite a wide margin is allowed between the edge of the functional area of the chip and the cutting line. 86.1.116.158 (talk) 01:44, 18 December 2009 (UTC)[reply]

What are the references for the second and third paragraphs in the lead section? Once those sections have references, will it be better to move those two paragraphs out of the lead section and into the body of the article? --MTLE4470 grp8 kml (talk) 00:33, 27 January 2017 (UTC)[reply]