Thermal interface material
 |
It has been suggested that this article or section be merged into Thermal grease. (Discuss) Proposed since October 2009. |
 |
This article needs additional citations for verification. Please help improve this article by adding citations to reliable sources. Unsourced material may be challenged and removed. (February 2009) |
Thermal interfacial materials (TIMs) are thermally conductive materials, which are applied to increase Thermal contact conductance across jointed solid surfaces,[1] such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.
They take many forms. The most common is the white-colored paste or thermal grease, typically silicone oil filled with aluminum oxide, zinc oxide, or boron nitride. Some brands of thermal interfaces use micronized or pulverized silver.
Another type of TIM are the phase-change materials. These are solid at room temperature but liquefy and behave like grease at operating temperatures. They are easy to handle and are not messy.
[edit] References
- ^ deSorgo, Miksa. "Thermal Interface Materials". Electronics Cooling. http://www.electronics-cooling.com/1996/09/thermal-interface-materials-2/. Retrieved 23 April 2011.
 |
This material-related article is a stub. You can help Wikipedia by expanding it. |
