Via (electronics)
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The grey and green layers are non-conducting, while the thin orange layers and vias are.
In printed circuit board design, vias are pads with plated holes that provide electrical connections between copper traces on different layers of the board. The holes are made conductive by electroplating, or are filled with annular rings or small rivets. High-density multi-layer PCBs may have microvias: blind vias are exposed only on one side of the board, while buried vias connect internal layers without being exposed on either surface. Thermal vias carry heat away from power devices. They are typically used in arrays of about a dozen vias.
In integrated circuit design, a via is a small opening in an insulating oxide layer that allows a conductive connection between different layers. A via on an integrated circuit is often called a through-chip via. A via connecting the lowest layer of metal to diffusion or poly is typically called a "contact".
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