On the chip, the shader units are organized in three SIMD groups with 16 processors per group, for a total of 48 processors. Each of these processors is composed of a 5-wide vector unit (total 5 FP32 ALUs) that can serially execute up to two instructions per cycle (a multiply and an addition). Thus each of the 48 processors can perform 10 floating-point ops per cycle. All processor in a SIMD group execute the same instruction, so in total up to three instruction threads can be simultaneously under execution.
Maximum pixel fillrate: 16 gigasamples per second fillrate using 4X multisample anti aliasing (MSAA), or 32 gigasamples using Z-only operation; 4 gigapixels per second without MSAA (8 ROPs × 500 MHz)
Maximum Z sample rate: 8 gigasamples per second (2 Z samples × 8 ROPs × 500 MHz), 32 gigasamples per second using 4X anti aliasing (2 Z samples × 8 ROPs × 4X AA × 500 MHz)
Maximum anti-aliasing sample rate: 16 gigasamples per second (4 AA samples × 8 ROPs × 500 MHz)
Cooling: Both the GPU and CPU of the console have heatsinks. The GPU's heatsink uses heatpipe technology, to conduct heat from the GPU and eDRAM die to the fins of the heatsink. The heatsinks are actively cooled by a pair of 60 mm exhaust fans. The new XCGPU chipset redesign is featured in both the Xbox 360 S and the Xbox 360 E and integrates the CPU (Xenon) and GPU (Xenos) in one package and is actively cooled by a single heatsink rather than two.