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IEEE Transactions on Advanced Packaging

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This is an old revision of this page, as edited by Smasongarrison (talk | contribs) at 00:11, 27 April 2023 (Moving from Category:Publications established in 1999 to Category:Academic journals established in 1999 using Cat-a-lot). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

IEEE Transactions on Advanced Packaging
DisciplineMulti-chip modules, wafer-scale integration
LanguageEnglish
Edited byGanesh Subbarayan
Publication details
Former name(s)
IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing
History1999–2010
Publisher
FrequencyQuarterly
1.276 (2010)
Standard abbreviations
ISO 4IEEE Trans. Adv. Packag.
Indexing
CODENITAPFZ
ISSN1521-3323
LCCN99111625
OCLC no.39742480
Links

IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.[1]

References

  1. ^ "IEEE Transactions on Advanced Packaging". 2010 Journal Citation Reports. Web of Science (Science ed.). Thomson Reuters. 2011.
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