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Burn-in ovens are designed for dynamic and static burn-in of integrated circuits and other electronic devices, including laser diodes. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations. Operating temperatures can go over 260 °C (500 °F), and can use both single and multiple temperature settings.
Burn-in oven applications can be used in numerous different applications such as high-dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of microprocessors and other semiconductor devices.
One company builds systems designed for burn-in of low power laser diodes up to 1A and high power laser diodes up to 300A.