List of integrated circuit packaging types

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A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole packages[edit]

Through-hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
Acronym Full name Remark
SIP Single in-line package
DIP Dual in-line package 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) or 0.6 in (15.24 mm) apart.
CDIP Ceramic DIP[1]
CERDIP Glass-sealed ceramic DIP[1]
QIP Quadruple in-line package Like DIP but with staggered (zig-zag) pins.[1]
SKDIP Skinny DIP Standard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart.[1]
SDIP Shrink DIP Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.[1]
ZIP Zig-zag in-line package
MDIP Molded DIP[2]
PDIP Plastic DIP[1]

Surface mount[edit]

Acronym Full name Remark
CCGA Ceramic column-grid array (CGA)[3]
CGA Column-grid array[3] Example
CERPACK Ceramic package[4]
LLP Lead-less lead-frame package A package with metric pin distribution (0.5–0.8 mm pitch)[6]
LGA Land grid array[3]
LTCC Low-temperature co-fired ceramic[7]
MCM Multi-chip module[8]
MICRO SMDXT Micro surface-mount device extended technology[9] Example

Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.

Chip carrier[edit]

A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

Acronym Full name Remark
BCC Bump chip carrier[3] -
CLCC Ceramic lead-less chip carrier[1] -
LCC Lead-less chip carrier[3] Contacts are recessed vertically.
LCC Leaded chip carrier[3] -
LCCC Leaded ceramic-chip carrier[3] -
DLCC Dual lead-less chip carrier (ceramic)[3] -
PLCC Plastic leaded chip carrier[1][3] -

Pin grid arrays[edit]

Acronym Full name Remark
OPGA Organic pin-grid array -
FCPGA Flip-chip pin-grid array[3] -
PAC Pin array cartridge[10] -
PGA Pin-grid array Also known as PPGA[1]
CPGA Ceramic pin-grid array[3] -

Flat packages[edit]

Acronym Full name Remark
- Flat-pack Earliest version metal/ceramic packaging with flat leads
CFP Ceramic flat-pack[3] -
CQFP Ceramic quad flat-pack[1][3] Similar to PQFP
BQFP Bumpered quad flat-pack[3] -
DFN Dual flat-pack No lead[3]
ETQFP Exposed thin quad flat-package[11] -
PQFN Power quad flat-pack No-leads, with exposed die-pad[s] for heatsinking[12]
PQFP Plastic quad flat-package[1][3] -
LQFP Low-profile quad flat-package[3] -
QFN Quad flat no-leads package Also called as micro lead frame (MLF).[3][13]
QFP Quad flat package[1][3] -
MQFP Metric quad flat-pack QFP with metric pin distribution[3]
HVQFN Heat-sink very-thin quad flat-pack, no-leads -
SIDEBRAZE[14][15] [clarification needed] [clarification needed]
TQFP Thin quad flat-pack[1][3] -
VQFP Very-thin quad flat-pack[3] -
TQFN Thin quad flat, no-lead -
VQFN Very-thin quad flat, no-lead -
WQFN Very-very-thin quad flat, no-lead -
UQFN Ultra-thin quad flat-pack, no-lead -
ODFN Optical dual flat, no-lead IC packaged in transparent packaging used in optical sensor

Small outline packages[edit]

Acronym Full name Remark
SOP Small-outline package[1]
CSOP Ceramic small-outline package
DSOP Dual small-outline package
HSOP Thermally-enhanced small-outline package
mini-SOIC Mini small-outline integrated circuit
MSOP Mini small-outline package
PSOP Plastic small-outline package[3]
PSON Plastic small-outline no-lead package
QSOP Quarter-size small-outline package The pin spacing are width of 0.635 mm.[3]
SOIC Small-outline integrated circuit Also known as SOIC NARROW and SOIC WIDE
SOJ Small-outline J-leaded package
SON Small-outline no-lead package
SSOP Shrink small-outline package[3]
TSOP Thin small-outline package[3] Example
TSSOP Thin shrink small-outline package[3]
TVSOP Thin very-small-outline package[3]
µMAX Similar to a SOIC. (A Maxim trademark example)
WSON Very-very-thin small-outline no-lead package
USON Very-very-thin small-outline no-lead package Slightly smaller than WSON

Chip-scale packages[edit]

Example WL-CSP devices sitting on the face of a U.S. penny. A SOT-23 device is shown (top) for comparison.
Acronym Full name Remark
BL Beam lead technology Bare silicon chip, an early chip-scale package
CSP Chip-scale package Package size is no more than 1.2× the size of the silicon chip[16][17]
TCSP True chip-size package Package is same size as silicon[18]
TDSP True die-size package Same as TCSP[18]
WCSP or WL-CSP or WLCSP Wafer-level chip-scale package
MICRO SMD - Chip-size package (CSP) developed by National Semiconductor[19]
COB Chip-on-board Bare silicon chip, that is usually an integrated circuit, is supplied without a package. It can often be identified by having a blob of black Epoxy instead of a square package. Also used for LEDs. In LEDs, the epoxy is poured into a mold which forms part of the package.
COF Chip-on-flex Variation of COB, where a chip is mounted directly to a flex circuit.
TAB Tape-automated bonding Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires.
COG Chip-on-glass Variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.

Ball grid array[edit]

Ball Grid Array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.[1][3]

Acronym Full name Remark
FBGA Fine-pitch ball-grid array A square or rectangular array of solder balls on one surface[3]
LBGA Low-profile ball-grid array Also known as laminate ball-grid array[3]
TEPBGA Thermally-enhanced plastic ball-grid array -
CBGA Ceramic ball-grid array[3] -
OBGA Organic ball-grid array[3] -
TFBGA Thin fine-pitch ball-grid array[3] -
PBGA Plastic ball-grid array[3] -
MAP-BGA Mold array process - ball-grid array [2] -
UCSP Micro (μ) chip-scale package Similar to a BGA (A Maxim trademark example)[17]
μBGA Micro ball-grid array Ball spacing less than 1 mm
LFBGA Low-profile fine-pitch ball-grid array[3] -
TBGA Thin ball-grid array[3] -
SBGA Super ball-grid array[3] Above 500 balls
UFBGA Ultra-fine ball-grid array[3]

Transistor, diode, small-pin-count IC packages[edit]

A drawing of a ZN414 IC in a TO-18 package
  • MELF: Metal electrode leadless face (usually for resistors and diodes)
  • SOD: Small-outline diode.
  • SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323).
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
    • TO-3: Panel-mount with leads
    • TO-5: Metal can package with radial leads
    • TO-18: Metal can package with radial leads
    • TO-39
    • TO-46
    • TO-66: Similar shape to the TO-3 but smaller
    • TO-92: Plastic-encapsulated package with three leads
    • TO-99
    • TO-100
    • TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads
    • TO-226[20]
    • TO-247:[21] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
    • TO-251:[21] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
    • TO-252:[21] (also called SOT428, DPAK):[21] SMT package similar to the DPAK but smaller
    • TO-262:[21] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
    • TO-263:[21] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
    • TO-274:[21] Also called Super-247: SMT package similar to the TO-247 without the mounting hole

Dimension reference[edit]


A general surface mount chip, with major dimensions.
Clearance between IC body and PCB
Total Height
Lead Thickness
Total carrier length
Lead width
Lead length


A general through-hole pin chip, with major dimensions.
Clearance between IC body and board
Total height
Lead thickness
Total carrier length
Lead width
Lead length
IC body width
Lead-to-lead width

Package dimensions[edit]

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

Clearance between package body and PCB.
Height of package from pin tip to top of package.
Thickness of pin.
Length of package body only.
Pin width.
Pin length from package to pin tip.
Pin pitch (distance between conductors to the PCB).
Width of the package body only.
Length from pin tip to pin tip on the opposite side.

Dual row[edit]

Image Family Pin Name Package WB WL H C L P LL T LW
Three IC circuit chips.JPG DIP Y Dual inline package 8-DIP 6.2–6.48 7.62 7.7 9.2–9.8 2.54 (0.1 in) 3.05–3.6 1.14–1.73
32-DIP 15.24 2.54 (0.1 in)
LFCSP N Lead-frame chip-scale package 0.5
MSOP-sized chip package.jpg MSOP Y Mini small-outline package 8-MSOP 3 4.9 1.1 0.10 3 0.65 0.95 0.18 0.17–0.27
10-MSOP 3 4.9 1.1 0.10 3 0.5 0.95 0.18 0.17–0.27
16-MSOP 3 4.9 1.1 0.10 4.04 0.5 0.95 0.18 0.17–0.27
MFrey SOIC20.jpg SO
Y Small-outline integrated circuit 8-SOIC 3.9 5.8–6.2 1.72 0.10–0.25 4.8–5.0 1.27 1.05 0.19–0.25 0.39–0.46
14-SOIC 3.9 5.8–6.2 1.72 0.10–0.25 8.55–8.75 1.27 1.05 0.19–0.25 0.39–0.46
16-SOIC 3.9 5.8–6.2 1.72 0.10–0.25 9.9–10 1.27 1.05 0.19–0.25 0.39–0.46
16-SOIC 7.5 10.00–10.65 2.65 0.10–0.30 10.1–10.5 1.27 1.4 0.23–0.32 0.38–0.40
SOT23-6.jpg SOT Y Small-outline transistor SOT-23-6 1.6 2.8 1.45 2.9 0.95 0.6 0.22–0.38
SSOP Y Shrink small-outline package 0.65
TDFN N Thin dual flat no-lead 8-TDFN 3 3 0.7–0.8 3 0.65 N/A 0.19–0.3
TSOP Y Thin small-outline package 0.5
TSSOP EXP PAD 16L.gif TSSOP Y Thin shrink small-outline package 8-TSSOP 4.4 6.4 1.2 0.15 3 0.65 0.09–0.2 0.19–0.3
µSOP Y Micro small-outline package[22] µSOP-8 4.9 1.1 3 0.65
US8[23] Y US8 package 2.3 3.1 .7 2 0.5

Quad rows[edit]

Image Family Pin Name Package WB WL H C L P LL T LW
Qfj52.jpg PLCC N Plastic leaded chip-carrier 1.27
CLCC N Ceramic leadless chip-carrier 48-CLCC 14.22 14.22 2.21 14.22 1.016 N/A 0.508
Cyrix cx9210 gfdl.jpg LQFP Y Low-profile Quad Flat Package 0.50
PIC18F8720.jpg TQFP Y Thin quad flat-package TQFP-44 10.00 12.00 0.35–0.50 0.80 1.00 0.09–0.20 0.30–0.45
TQFN N Thin quad flat no-lead


Package x y z
52-ULGA 12 mm 17 mm 0.65 mm
52-ULGA 14 mm 18 mm 0.10 mm
52-VELGA ? ? ?

Multi-chip packages[edit]

A variety of techniques for interconnecting several chips within a single package have been proposed and researched:

See also[edit]


  1. ^ a b c d e f g h i j k l m n o "CPU Collection Museum - Chip Package Information". The CPU Shack. Retrieved 2011-12-15.
  2. ^ "Archived copy" (PDF). Archived from the original (PDF) on 2011-08-15. Retrieved 2011-02-03.CS1 maint: archived copy as title (link)
  3. ^ a b c d e f g h i j k l m n o p q r s t u v w x y z aa ab ac ad ae af ag ah ai aj ak al am "Integrated Circuit, IC Package Types; SOIC. Surface Mount Device Package". Retrieved 2011-12-15.
  4. ^ "National Semiconductor CERPACK Package Products". Archived from the original on 2012-02-18. Retrieved 2011-12-15.
  5. ^ "National Semiconductor CQGP Package Products". Archived from the original on 2007-10-21. Retrieved 2011-12-15.
  6. ^ "National's LLP Package". Archived from the original on 2011-02-13. Retrieved 2011-12-15.
  7. ^ "LTCC Low Temperature Co-fired Ceramic". Retrieved 2011-12-15.
  8. ^ Frye, R.C.; Gabara, T.J.; Tai, K.L.; Fischer, W.C.; Knauer, S.C. (1993). "Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs". IEEE Xplore - Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs. pp. 464–467. doi:10.1109/ASIC.1993.410760. ISBN 978-0-7803-1375-0.
  9. ^ "National Semiconductor Launches New Generation of Ultra-Miniature, High Pin-Count Integrated Circuit Packages". Archived from the original on 2012-02-18. Retrieved 2011-12-15.
  10. ^ Meyers, Michael; Jernigan, Scott (2004). Mike Meyers' A+ Guide to PC Hardware. The McGraw-Hill Companies. ISBN 978-0-07-223119-9.
  11. ^ [1] Archived August 18, 2011, at the Wayback Machine
  12. ^ "Press Releases - Motorola Mobility, Inc". Retrieved 2011-12-15.
  13. ^ "Xilinx new CPLDs with two I/O banks". 2004-12-08. Retrieved 2011-12-15.
  14. ^ "Packages". 2010-11-15. Retrieved 2011-12-15.
  15. ^ "Archived copy". Archived from the original on 2008-11-20. Retrieved 2009-10-24.CS1 maint: archived copy as title (link)
  16. ^ "CSP - Chip Scale Package". Retrieved 2011-12-15.
  17. ^ a b "Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications - Maxim". 2007-04-18. Retrieved 2011-12-15.
  18. ^ a b "Chip Scale Review Online". Retrieved 2011-12-15.
  19. ^ "Packaging Technology | National Semiconductor – Package Drawings, Part Marking, Package Codes, LLP, micro SMD, Micro-Array". Archived from the original on 2010-08-01. Retrieved 2011-12-15.
  20. ^
  21. ^ a b c d e f g
  22. ^
  23. ^ "Fairchild's TinyLogic family overview" (PDF). March 22, 2013. Archived from the original (PDF) on January 8, 2015.
  24. ^ Proximity Communication - the Technology, 2004, archived from the original on 2009-07-18

External links[edit]