Die (integrated circuit)
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
Single NPN bipolar junction transistor die.
A small-scale integrated circuit die, with bond wires attached.
A VLSI integrated-circuit die.
Two dice bonded onto one chip carrier.
- Integrated circuit design
- Semiconductor fabrication
- Wafer dicing
- Die preparation
- Chip carrier
- Wire bonding and Ball bonding
- Semiconductor intellectual property core – functionality block, that can be mixed with others
- Wedge Bonding Process on YouTube – animation
- Industrial Bonder on YouTube – the video shows bonding not brazing
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