Die (integrated circuit)

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The "naked" die without chip carrier of a Cell processor.
A VLSI integrated-circuit die
A small-scale integrated circuit die, with bond wires attached.
Two dies bonded onto one chip carrier.
Intel Xeon E7440 open die at heat spreader Die size is 22 x 23 mm (503 mm 2) transistor count is 1 900 000 000

A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies, and die.[1][2]

See also[edit]


  1. ^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 0-8493-1951-X. 
  2. ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0-12-226930-6. 

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