List of AMD processors with 3D graphics

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This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.

Features overview[edit]

The following table shows features of AMD's processors with 3D graphics, including APUs.

Platform High, standard and low power Low and ultra-low power
Codename Server Basic Toronto
Micro Kyoto
Desktop Performance Raphael Phoenix
Mainstream Llano Trinity Richland Kaveri Kaveri Refresh (Godavari) Carrizo Bristol Ridge Raven Ridge Picasso Renoir Cezanne
Entry
Basic Kabini Dalí
Mobile Performance Renoir Cezanne Rembrandt Dragon Range
Mainstream Llano Trinity Richland Kaveri Carrizo Bristol Ridge Raven Ridge Picasso Renoir
Lucienne
Cezanne
Barceló
Phoenix
Entry Dalí Mendocino
Basic Desna, Ontario, Zacate Kabini, Temash Beema, Mullins Carrizo-L Stoney Ridge Pollock
Embedded Trinity Bald Eagle Merlin Falcon,
Brown Falcon
Great Horned Owl Grey Hawk Ontario, Zacate Kabini Steppe Eagle, Crowned Eagle,
LX-Family
Prairie Falcon Banded Kestrel River Hawk
Released Aug 2011 Oct 2012 Jun 2013 Jan 2014 2015 Jun 2015 Jun 2016 Oct 2017 Jan 2019 Mar 2020 Jan 2021 Jan 2022 Sep 2022 Jan 2023 Jan 2011 May 2013 Apr 2014 May 2015 Feb 2016 Apr 2019 Jul 2020 Jun 2022 Nov 2022
CPU microarchitecture K10 Piledriver Steamroller Excavator "Excavator+"[1] Zen Zen+ Zen 2 Zen 3 Zen 3+ Zen 4 Bobcat Jaguar Puma Puma+[2] "Excavator+" Zen Zen+ "Zen 2+"
ISA x86-64 v1 x86-64 v2 x86-64 v3 x86-64 v4 x86-64 v1 x86-64 v2 x86-64 v3
Socket Desktop Performance AM5
Mainstream AM4
Entry FM1 FM2 FM2+ FM2+[a], AM4 AM4
Basic AM1 FP5
Other FS1 FS1+, FP2 FP3 FP4 FP5 FP6 FP7 FL1 FP7
FP7r2
FP8
? FT1 FT3 FT3b FP4 FP5 FT5 FP5 FT6
PCI Express version 2.0 3.0 4.0 5.0 4.0 2.0 3.0
CXL
Fab. (nm) GF 32SHP
(HKMG SOI)
GF 28SHP
(HKMG bulk)
GF 14LPP
(FinFET bulk)
GF 12LP
(FinFET bulk)
TSMC N7
(FinFET bulk)
TSMC N6
(FinFET bulk)
CCD: TSMC N5
(FinFET bulk)

cIOD: TSMC N6
(FinFET bulk)
TSMC 4nm
(FinFET bulk)
TSMC N40
(bulk)
TSMC N28
(HKMG bulk)
GF 28SHP
(HKMG bulk)
GF 14LPP
(FinFET bulk)
GF 12LP
(FinFET bulk)
TSMC N6
(FinFET bulk)
Die area (mm2) 228 246 245 245 250 210[3] 156 180 210 CCD: (2x) 70
cIOD: 122
178 75 (+ 28 FCH) 107 ? 125 149 ~100
Min TDP (W) 35 17 12 10 15 105 35 4.5 4 3.95 10 6 12 8
Max APU TDP (W) 100 95 65 45 170 54 18 25 6 54 15
Max stock APU base clock (GHz) 3 3.8 4.1 4.1 3.7 3.8 3.6 3.7 3.8 4.0 3.3 4.7 4.3 1.75 2.2 2 2.2 3.2 2.6 1.2 3.35 2.8
Max APUs per node[b] 1 1
Max core dies per CPU 1 2 1 1
Max CCX per core die 1 2 1 1
Max cores per CCX 4 8 2 4 2 4
Max CPU[c] cores per APU 4 8 16 8 2 4 2 4
Max threads per CPU core 1 2 1 2
Integer pipeline structure 3+3 2+2 4+2 4+2+1 1+3+3+1+2 1+1+1+1 2+2 4+2 4+2+1
i386, i486, i586, CMOV, NOPL, i686, PAE, NX bit, CMPXCHG16B, AMD-V, RVI, ABM, and 64-bit LAHF/SAHF Yes Yes
IOMMU[d] v2 v1 v2
BMI1, AES-NI, CLMUL, and F16C Yes Yes
MOVBE Yes
AVIC, BMI2, RDRAND, and MWAITX/MONITORX Yes
SME[e], TSME[e], ADX, SHA, RDSEED, SMAP, SMEP, XSAVEC, XSAVES, XRSTORS, CLFLUSHOPT, CLZERO, and PTE Coalescing Yes Yes
GMET, WBNOINVD, CLWB, QOS, PQE-BW, RDPID, RDPRU, and MCOMMIT Yes Yes
MPK, VAES Yes
SGX
FPUs per core 1 0.5 1 1 0.5 1
Pipes per FPU 2 2
FPU pipe width 128-bit 256-bit 80-bit 128-bit 256-bit
CPU instruction set SIMD level SSE4a[f] AVX AVX2 AVX-512 SSSE3 AVX AVX2
3DNow! 3DNow!+
PREFETCH/PREFETCHW Yes Yes
GFNI Yes
AMX
FMA4, LWP, TBM, and XOP Yes Yes
FMA3 Yes Yes
AMD XDNA Yes
L1 data cache per core (KiB) 64 16 32 32
L1 data cache associativity (ways) 2 4 8 8
L1 instruction caches per core 1 0.5 1 1 0.5 1
Max APU total L1 instruction cache (KiB) 256 128 192 256 512 256 64 128 96 128
L1 instruction cache associativity (ways) 2 3 4 8 2 3 4 8
L2 caches per core 1 0.5 1 1 0.5 1
Max APU total L2 cache (MiB) 4 2 4 16 1 2 1 2
L2 cache associativity (ways) 16 8 16 8
Max on--die L3 cache per CCX (MiB) 4 16 32 4
Max 3D V-Cache per CCD (MiB) 64
Max total in-CCD L3 cache per APU (MiB) 4 8 16 64 4
Max. total 3D V-Cache per APU (MiB) 64
Max. board L3 cache per APU (MiB)
Max total L3 cache per APU (MiB) 4 8 16 128 4
APU L3 cache associativity (ways) 16 16
L3 cache scheme Victim Victim
Max. L4 cache
Max stock DRAM support DDR3-1866 DDR3-2133 DDR3-2133, DDR4-2400 DDR4-2400 DDR4-2933 DDR4-3200, LPDDR4-4266 DDR5-4800, LPDDR5-6400 DDR5-5200 DDR5-5600, LPDDR5x-7500 DDR3L-1333 DDR3L-1600 DDR3L-1866 DDR3-1866, DDR4-2400 DDR4-2400 DDR4-1600 DDR4-3200 LPDDR5-5500
Max DRAM channels per APU 2 1 2 1 2
Max stock DRAM bandwidth (GB/s) per APU 29.866 34.132 38.400 46.932 68.256 102.400 83.200 120.000 10.666 12.800 14.933 19.200 38.400 12.800 51.200 88.000
GPU microarchitecture TeraScale 2 (VLIW5) TeraScale 3 (VLIW4) GCN 2nd gen GCN 3rd gen GCN 5th gen[4] RDNA 2 RDNA 3 TeraScale 2 (VLIW5) GCN 2nd gen GCN 3rd gen[4] GCN 5th gen RDNA 2
GPU instruction set TeraScale instruction set GCN instruction set RDNA instruction set TeraScale instruction set GCN instruction set RDNA instruction set
Max stock GPU base clock (MHz) 600 800 844 866 1108 1250 1400 2100 2400 400 538 600 ? 847 900 1200 600 1300 1900
Max stock GPU base GFLOPS[g] 480 614.4 648.1 886.7 1134.5 1760 1971.2 2150.4 3686.4 102.4 86 ? ? ? 345.6 460.8 230.4 1331.2 486.4
3D engine[h] Up to 400:20:8 Up to 384:24:6 Up to 512:32:8 Up to 704:44:16[5] Up to 512:32:8 768:48:8 128:8:4 80:8:4 128:8:4 Up to 192:12:8 Up to 192:12:4 192:12:4 Up to 512:?:? 128:?:?
IOMMUv1 IOMMUv2 IOMMUv1 ? IOMMUv2
Video decoder UVD 3.0 UVD 4.2 UVD 6.0 VCN 1.0[6] VCN 2.1[7] VCN 2.2[7] VCN 3.1 ? UVD 3.0 UVD 4.0 UVD 4.2 UVD 6.0 UVD 6.3 VCN 1.0 VCN 3.1
Video encoder VCE 1.0 VCE 2.0 VCE 3.1 VCE 2.0 VCE 3.1
AMD Fluid Motion No Yes No No Yes No
GPU power saving PowerPlay PowerTune PowerPlay PowerTune[8]
TrueAudio Yes[9] ? Yes
FreeSync 1
2
1
2
HDCP[i] ? 1.4 2.2 2.3 ? 1.4 2.2 2.3
PlayReady[i] 3.0 not yet 3.0 not yet
Supported displays[j] 2–3 2–4 3 3 (desktop)
4 (mobile, embedded)
4 2 3 4 4
/drm/radeon[k][11][12] Yes Yes
/drm/amdgpu[k][13] Yes[14] Yes[14]
  1. ^ For FM2+ Excavator models: A8-7680, A6-7480 & Athlon X4 845.
  2. ^ A PC would be one node.
  3. ^ An APU combines a CPU and a GPU. Both have cores.
  4. ^ Requires firmware support.
  5. ^ a b Requires firmware support.
  6. ^ No SSE4. No SSSE3.
  7. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  8. ^ Unified shaders : texture mapping units : render output units
  9. ^ a b To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.
  10. ^ To feed more than two displays, the additional panels must have native DisplayPort support.[10] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.
  11. ^ a b DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

Graphics API overview[edit]

The following table shows the graphics and compute APIs support across AMD GPU micro-architectures. Note that a branding series might include older generation chips.

Chip series Micro­architecture Fab Supported APIs AMD support Year introduced Introduced with
Rendering Computing / ROCm
Vulkan[15] OpenGL[16] Direct3D HSA OpenCL
Wonder Fixed-pipeline[a] 1000 nm
800 nm
Ended 1986
Mach 800 nm
600 nm
1991
3D Rage 500 nm 5.0 1996 3D Rage
Rage Pro 350 nm 1.1 6.0 1997 Rage Pro
Rage 128 250 nm 1.2 1998 Rage 128 GL/VR
R100 180 nm
150 nm
1.3 7.0 2000 Radeon
R200 Programmable
pixel & vertex
pipelines
150 nm 8.1 2001 Radeon 8500
R300 150 nm
130 nm
110 nm
2.0[b] 9.0
11 (FL 9_2)
2002 Radeon 9700
R420 130 nm
110 nm
9.0b
11 (FL 9_2)
2004 Radeon X800
R520 90 nm
80 nm
9.0c
11 (FL 9_3)
2005 Radeon X1800
R600 TeraScale 1 80 nm
65 nm
3.3 10.0
11 (FL 10_0)
ATI Stream 2007 Radeon HD 2900 XT
RV670 55 nm 10.1
11 (FL 10_1)
ATI Stream APP[17] Radeon HD 3850/3870
RV770 55 nm
40 nm
1.0 2008 Radeon HD 4850/4870
Evergreen TeraScale 2 40 nm 4.5
(Linux 4.2)
[18][19][20][c]
11 (FL 11_0) 1.2 2009 Radeon HD 5850/5870
Northern Islands TeraScale 2
TeraScale 3
2010 Radeon HD 6850/6870
Radeon HD 6950/6970
Southern Islands GCN 1st gen 28 nm 1.0 4.6 11 (FL 11_1)
12 (FL11_1)
Yes 1.2
2.0 possible
2012 Radeon HD 7950/7970
Sea Islands GCN 2nd gen 1.2 11 (FL 12_0)
12 (FL 12_0)
2.0
(1.2 in MacOS, Linux)
2.1 Beta in Linux ROCm
2.2 possible
2013 Radeon HD 7790
Volcanic Islands GCN 3rd gen 2014 Radeon R9 285
Polaris GCN 4th gen 14 nm 1.2

1.3 (GCN 4)

Current 2016 Radeon RX 480
Vega GCN 5th gen 14 nm
7 nm
1.3 11 (FL 12_1)
12 (FL 12_1)
2017 Radeon Vega Frontier Edition
Navi RDNA 7 nm 2019 Radeon RX 5700 (XT)
Navi 2X RDNA 2 7 nm
6 nm
11 (FL 12_1)
12 (FL 12_2)
2020 Radeon RX 6800 (XT)
Navi 3X RDNA 3 6 nm
5 nm
? ? 2022 Radeon RX 7900 XT(X)
  1. ^ Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.
  2. ^ These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.
  3. ^ OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

[21][22][23]

Desktop processors with 3D graphics[edit]

APU or Radeon Graphics branded[edit]

Lynx: "Llano" (2011)[edit]

  • Socket FM1
  • CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
  • GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.[24]
  • List of embedded GPU's
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors[25][26]
  • 5 GT/s UMI
  • Integrated PCIe 2.0 controller
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series
Model[note 1] Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
Cores
(threads)
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 198 2012 32 nm SOI LN-B0 2 (2) 2.5 64 KB inst.
64 KB data

per core
2×512 KB 1600 65 SD198XOJGXBOX SD198XOJZ22GX
Athlon II X2 221 2012 2.8 AD221XOJGXBOX AD221XOJZ22GX
Athlon II X4 631 2012 4 (4) 2.6 4×1 MB 1866 AD631XOJGXBOX AD631XOJZ43GX
Aug 15, 2011 100 AD631XOJGXBOX AD631XWNZ43GX
Athlon II X4 638 Feb 8, 2012 2.7 65 AD638XOJGXBOX AD638XOJZ43GX
Athlon II X4 641 Feb 8, 2012 2.8 100 AD641XWNGXBOX AD641XWNZ43GX
Athlon II X4 651 Nov 14, 2011 3.0 AD651XWNGXBOX AD651XWNZ43GX
Athlon II X4 651K 2012 AD651KWNGXBOX AD651KWNZ43GX
E2-3200 2011 2 (2) 2.4 2×512 KB HD 6370D 160:8:4 443 141.7 1600 65 ED3200OJGXBOX ED3200OJZ22GX
ED3200OJZ22HX
A4-3300 Sep 7, 2011 2.5 HD 6410D AD3300OJGXBOX
AD3300OJHXBOX
AD3300OJZ22GX
AD3300OJZ22HX
A4-3400 Sep 7, 2011 2.7 600 192 AD3400OJGXBOX
AD3400OJHXBOX
AD3400OJZ22GX
AD3400OJZ22HX
A4-3420 Dec 20, 2011 2.8 AD3420OJZ22HX
A6-3500 Aug 17, 2011 3 (3) 2.1 2.4 3×1 MB HD 6530D 320:16:8 443 283.5 1866 AD3500OJGXBOX AD3500OJZ33GX
A6-3600 Aug 17, 2011 4 (4) 4×1 MB AD3600OJGXBOX AD3600OJZ43GX
A6-3620 Dec 20, 2011 2.2 2.5 AD3620OJGXBOX AD3620OJZ43GX
A6-3650 Jun 30, 2011 2.6 100 AD3650WNGXBOX AD3650WNZ43GX
A6-3670K Dec 20, 2011 2.7 AD3670WNGXBOX AD3670WNZ43GX
A8-3800 Aug 17, 2011 2.4 2.7 HD 6550D 400:20:8 600 480 65 AD3800OJGXBOX AD3800OJZ43GX
A8-3820 Dec 20, 2011 2.5 2.8 AD3820OJGXBOX AD3820OJZ43GX
A8-3850 Jun 30, 2011 2.9 100 AD3850WNGXBOX AD3850WNZ43GX
A8-3870K Dec 20, 2011 3.0 AD3870WNGXBOX AD3870WNZ43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Models with "K" suffixes feature an unlocked multiplier and overclockable GPU.

Virgo: "Trinity" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number[34]
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 240[35] 32 nm TN-A1 [1]2 2.9 3.3 64 KB inst.
per module

16 KB data
per core
1 MB 1600 65 SD240XOKA23HJ
Athlon X2 340[36] Oct 2012 3.2 3.6 AD340XOKA23HJ
Athlon X4 730 Oct 1, 2012 [2]4 2.8 3.2 2×2 MB 1866 AD730XOKA44HJ
Athlon X4 740 Oct 2012 3.2 3.7 AD740XOKHJBOX AD740XOKA44HJ
Athlon X4 750K 3.4 4.0 100 AD750KWOHJBOX AD750KWOA44HJ
FirePro A300 Aug 7, 2012 3.4 4.0 FirePro 384:24:8
6 CU
760 583.6 65 AWA300OKA44HJ
FirePro A320 3.8 4.2 800 614.4 100 AWA320WOA44HJ
A4-5300 Oct 1, 2012 [1]2 3.4 3.6 1 MB HD 7480D 128:8:4
2 CU
723 185 1600 65 AD5300OKHJBOX AD5300OKA23HJ
A4-5300B Oct 2012 AD530BOKA23HJ
A6-5400K Oct 1, 2012 3.6 3.8 HD 7540D 192:12:4
3 CU
760 291.8 1866 AD540KOKHJBOX AD540KOKA23HJ
A6-5400B Oct 2012 AD540BOKA23HJ
A8-5500 Oct 1, 2012 [2]4 3.2 3.7 2×2 MB HD 7560D 256:16:8
4 CU
760 389.1 AD5500OKHJBOX AD5500OKA44HJ
A8-5500B Oct 2012 AD550BOKA44HJ
A8-5600K Oct 1, 2012 3.6 3.9 100 AD560KWOHJBOX AD560KWOA44HJ
A10-5700 3.4 4.0 HD 7660D 384:24:8
6 CU
760 583.6 65 AD5700OKHJBOX AD5700OKA44HJ
A10-5800K 3.8 4.2 800 614.4 100 AD580KWOHJBOX AD580KWOA44HJ
A10-5800B Oct 2012 AD580BWOA44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Richland" (2013)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Sempron X2 250[35] 32 nm RL-A1 [1]2 3.2 3.6 64 KB inst.
per module

16 KB data
per core
1 MB 65 SD250XOKA23HL
Athlon X2 350[38] 3.5 3.9 1866 AD350XOKA23HL
Athlon X2 370K Jun 2013 4.0 4.2 AD370KOKHLBOX AD370KOKA23HL
Athlon X4 750 Oct 2013 [2]4 3.4 4.0 2×2 MB AD750XOKA44HL
Athlon X4 760K Jun 2013 3.8 4.1 100 AD760KWOHLBOX AD760KWOA44HL
FX-670K[39] Mar 2014 (OEM) 3.7 4.3 65 FD670KOKA44HL
A4-4000 May 2013 [1]2 3.0 3.2 1 MB HD 7480D 128:8:4
2 CU
720 184.3 1333 AD4000OKHLBOX AD4000OKA23HL
A4-4020 Jan 2014 3.2 3.4 AD4020OKHLBOX AD4020OKA23HL
A4-6300 Jul 2013 3.7 3.9 HD 8370D 760 194.5 1600 AD6300OKHLBOX AD6300OKA23HL
A4-6300B AD630BOKA23HL
A4-6320 Dec 2013 3.8 4.0 AD6320OKHLBOX AD6320OKA23HL
A4-6320B Mar 2014 AD632BOKA23HL
A4-7300 Aug 2014 HD 8470D 192:12:4
3 CU
800 307.2 AD7300OKA23HL
A4 Pro-7300B AD730BOKA23HL
A6-6400B Jun 4, 2013 3.9 4.1 1866 AD640BOKA23HL
A6-6400K AD640KOKHLBOX AD640KOKA23HL
A6-6420B Jan 2014 4.0 4.2 AD642BOKA23HL
A6-6420K AD642KOKHLBOX AD642KOKA23HL
A8-6500T Sep 18, 2013 [2]4 2.1 3.1 2×2 MB HD 8550D 256:16:8
4 CU
720 368.6 45 AD650TYHHLBOX AD650TYHA44HL
A8-6500 Jun 4, 2013 3.5 4.1 HD 8570D 800 409.6 65 AD6500OKHLBOX AD6500OKA44HL
A8-6500B AD650BOKA44HL
A8-6600K 3.9 4.2 844 432.1 100 AD660KWOHLBOX AD660KWOA44HL
A10-6700T Sep 18, 2013 2.5 3.5 HD 8650D 384:24:8
6 CU
720 552.9 45 AD670TYHHLBOX AD670TYHA44HL
A10-6700 Jun 4, 2013 3.7 4.3 HD 8670D 844 648.1 65 AD6700OKHLBOX AD6700OKA44HL
A10-6790B Oct 29, 2013 4.0 100 AD679KWOHLBOX AD679KWOA44HL
A10-6790K Oct 28, 2013 AD679BWOA44HL
A10-6800K Jun 4, 2013 4.1 4.4 2133 AD680KWOHLBOX AD680KWOA44HL
A10-6800B AD680BWOA44HL
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini" (2013, SoC)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
Cores
(threads)
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Athlon X4 530 28 nm KB-A1 4 (4) 2.00 32 KB inst.
32 KB data

per core
2 MB 1600
single-channel
25 AD530XJAH44HM
Athlon X4 550 2.20 AD550XJAH44HM
Sempron 2650 Apr 9, 2014 2 (2) 1.45 1 MB R3 (HD 8240) 128:8:4
2 CU
400 102.4 1333
single-channel
SD2650JAHMBOX SD2650JAH23HM
Sempron 3850 4 (4) 1.30 2 MB R3 (HD 8280) 450 115.2 1600
single-channel
SD3850JAHMBOX SD3850JAH44HM
Athlon 5150 1.60 R3 (HD 8400) 600 153.6 AD5150JAHMBOX AD5150JAH44HM
Athlon 5350 2.05 AD5350JAHMBOX AD5350JAH44HM
Athlon 5370 Feb 2016 2.20 AD5370JAH44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kaveri" (2014) & "Godavari" (2015)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Box number Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
Athlon X2 450[38] Jul 31, 2014 28 nm KV-A1 [1]2 3.5 3.9 96 KB inst.
per module

16 KB data
per core
1 MB 1866 65 AD450XYBI23JA
Athlon X4 830 2018 [2]4 3.0 3.4 2×2 MB 2133 AD830XYBI44JA
Athlon X4 840[38] Aug 2014 3.1 3.8 AD840XYBJABOX AD840XYBI44JA
Athlon X4 850 2015 GV-A1 3.2 AD835XACI43KA
Athlon X4 860K Aug 2014 KV-A1 3.7 4.0 95 AD860KXBJABOX
AD860KWOHLBOX
AD860KXBJASBX
AD860KXBI44JA
Athlon X4 870K Dec 2015 GV-A1 3.9 4.1 AD870KXBJCSBX AD870KXBI44JC
Athlon X4 880K Mar 1, 2016 4.0 4.2 AD880KXBJCSBX
FX-770K[50] Dec 2014 KV-A1 3.5 3.9 65 FD770KYBI44JA
A4 Pro-7350B Jul 31, 2014 [1]2 3.4 3.8 1 MB R5 192:12:8
3 CU
514 197.3 1866 AD735BYBI23JA
Pro A4-8350B Sep 29, 2015 3.5 3.9 256:16:8
4 CU
757 387.5 AD835BYBI23JC
A6-7400K Jul 31, 2014 3.5 3.9 756 387 AD740KYBJABOX AD740KYBI23JA
A6 Pro-7400B AD740BYBI23JA
A6-7470K Feb 2, 2016 GV-A1 3.7 4.0 800 409.6 2133 AD747KYBJCBOX AD747KYBI23JC
Pro A6-8550B Sep 29, 2015 AD855BYBI23JC
A8-7500[51][52] 2014 KV-A1 [2]4 3.0 3.7 2×2 MB R7 384:24:8
6 CU
720 552.9 AD7500YBI44JA
A8-7600 Jul 31, 2014 3.1 3.8 AD7600YBJABOX AD7600YBI44JA
A8 Pro-7600B AD760BYBI44JA
A8-7650K Jan 7, 2015 3.3 95 AD765KXBJABOX
AD765KXBJASBX
AD765KXBI44JA
A8-7670K Jul 20, 2015 GV-A1 3.6 3.9 757 581.3 AD767KXBJCSBX
AD767KXBJCBOX
AD767KXBI44JC
Pro A8-8650B Sep 29, 2015 3.2 65 AD865BYBI44JC
A10-7700K Jan 14, 2014 KV-A1 3.4 3.8 720 552.9 95 AD770KXBJABOX AD770KXBI44JA
A10-7800 Jul 31, 2014 3.5 3.9 512:32:8
8 CU
737.2 65 AD7800YBJABOX AD7800YBI44JA
A10 Pro-7800B AD780BYBI44JA
A10-7850K Jan 14, 2014 3.7 4.0 95 AD785KXBJABOX AD785KXBI44JA
A10 Pro-7850B Jul 31, 2014 AD785BXBI44JA
A10-7860K Feb 2, 2016 GV-A1 3.6 757 775.1 65 AD786KYBJABOX
AD786KYBJCSBX
AD786KYBI44JC
A10-7870K May 28, 2015 3.9 4.1 866 886.7 95 AD787KXDJCBOX
AD787KXDJCSBX
AD787KXDI44JC
A10-7890K Mar 1, 2016 4.1 4.3 AD789KXDJCHBX AD789KXDI44JC
Pro A10-8750B Sep 29, 2015 3.6 4.0 757 775.1 65 AD875BYBI44JC
Pro A10-8850B 3.9 4.1 800 819.2 95 AD885BXBI44JC
Model Released Fab Step. [Modules/FPUs]
Cores/threads
Base Boost L1 L2 Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
DDR3
memory
support
TDP
(W)
Box number Part number
Clock rate (GHz) Cache[a]
CPU GPU
  1. ^ a b AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ a b Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Carrizo" (2016)[edit]

Model Released Fab Step. Socket CPU GPU Memory
support
TDP
(W)
Box number[a] Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[b] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[c]
Base Boost L1 L2
Athlon X4 835 28 nm CZ-A1 FM2+ [2]4 3.1 96 KB inst.
per module

32 KB data
per core
2×1 MB DDR3-2133 65 AD835XACI43KA
Athlon X4 845 Feb 2, 2016 3.5 3.8 AD845XYBJCSBX
AD845XACKASBX
AD845XACI43KA
A6-7480[54] Oct 2018 [1]2 1 MB R5 384:24:8
6 CU
900 691.2 AD7480ACABBOX AD7480ACI23AB
A8-7680[55] [2]4 2×1 MB R7 AD7680ACABBOX AD7680ACI43AB
Pro A6-8570E Oct 2016 AM4 [1]2 3.0 3.4 1 MB R5 256:16:4
4 CU
800 409.6 DDR4-2400 35 AD857BAHM23AB
Pro A6-8570 3.5 3.8 384:24:6
6 CU
1029 790.2 65 AD857BAGM23AB
Pro A10-8770E [2]4 2.8 3.5 2×1 MB R7 847 650.4 35 AD877BAHM44AB
Pro A10-8770 3.5 3.8 1029 790.2 65 AD877BAGM44AB
Pro A12-8870E 2.9 512:32:8
8 CU
900 921.6 35 AD887BAHM44AB
Pro A12-8870 3.7 4.2 1108 1134.5 65 AD887BAUM44AB
  1. ^ With cooler if available.
  2. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bristol Ridge" (2016)[edit]

Model Released Fab Step. CPU GPU DDR4
memory
support
TDP
(W)
Box number[a] Part number
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[b] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[c]
Base Boost L1 L2
Athlon X4 940[57] Jul 27, 2017 28 nm BR-A1 [2]4 3.2 3.6 96 KB inst.
per module

32 KB data
per core
2×1 MB 2400 65 AD940XAGABBOX AD940XAGM44AB
Athlon X4 950[58] 3.5 3.8 AD950XAGABBOX AD950XAGM44AB
Athlon X4 970[59] 3.8 4.0 AD970XAUABBOX AD970XAUM44AB
A6-9400[60] Mar 16, 2019 [1]2 3.4 3.7 1 MB R5 192:12:4
3 CU
720 276.4 AD9400AGABBOX AD9400AGM23AB
A6-9500E[61] Sep 5, 2016 3.0 3.4 256:16:4
4 CU
800 409.6 35 AD9500AHABBOX AD9500AHM23AB
Pro A6-9500E[62] Oct 3, 2016 AD950BAHM23AB
A6-9500[63] Sep 5, 2016 3.5 3.8 384:24:6
6 CU
1029 790.2 65 AD9500AGABBOX AD9500AGM23AB
Pro A6-9500[64] Oct 3, 2016 AD950BAGM23AB
A6-9550[65] Jul 27, 2017 3.8 4.0 256:16:4
4 CU
800 409.6 AD9550AGABBOX AD9550AGM23AB
A8-9600[66] Sep 5, 2016 [2]4 3.1 3.4 2×1 MB R7 384:24:6
6 CU
900 691.2 AD9600AGABBOX AD9600AGM44AB
Pro A8-9600[67] Oct 3, 2016 AD960BAGM44AB
A10-9700E[68] Sep 5, 2016 3.0 3.5 847 650.4 35 AD9700AHABBOX AD9700AHM44AB
Pro A10-9700E[69] Oct 3, 2016 AD970BAHM44AB
A10-9700[70] Sep 5, 2016 3.5 3.8 1029 790.2 65 AD9700AGABBOX AD9700AGM44AB
Pro A10-9700[71] Oct 3, 2016 AD970BAGM44AB
A12-9800E[72] Sep 5, 2016 3.1 3.8 512:32:8[73]
8 CU
900 921.6 35 AD9800AHABBOX AD9800AUM44AB
Pro A12-9800E[74] Oct 3, 2016 AD980BAHM44AB
A12-9800[75] Sep 5, 2016 3.8 4.2 1108 1134.5 65 AD9800AUABBOX AD9800AUM44AB
Pro A12-9800[76] Oct 3, 2016 AD980BAUM44AB
  1. ^ With cooler if available.
  2. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Raven Ridge" (2018)[edit]

Common features of Zen based Raven Ridge desktop APUs:

Model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model Config[i] Clock
(MHz)
Processing
power
(GFLOPS)[ii]
Base Boost
Athlon 200GE 2 (4) 3.2 4 MB Vega 3 192:12:4
3 CU
1000 384 35 W Sep 6, 2018 US $55[77]
Athlon Pro 200GE OEM
Athlon 220GE 3.4 Dec 21, 2018 US $65[78]
Athlon 240GE 3.5 US $75[78]
Athlon 300GE 3.4 1100 424.4 Jul 7, 2019 OEM
Athlon Pro 300GE Sep 30, 2019
Athlon 320GE 3.5 Jul 7, 2019
Athlon 3000G Nov 19, 2019 US $49[79]
Athlon Silver 3050GE 3.4 Jul 21, 2020 OEM
Ryzen 3 Pro 2100GE[80] 3.2 1000 384 2019
Ryzen 3 2200GE 4 (4) 3.6 Vega 8 512:32:16
8 CU
1100 1126 Apr 19, 2018
Ryzen 3 Pro 2200GE May 10, 2018
Ryzen 3 2200G 3.5 3.7 65 W Feb 12, 2018 US $99[81]
Ryzen 3 Pro 2200G May 10, 2018 OEM
Ryzen 5 2400GE 4 (8) 3.2 3.8 RX Vega 11 704:44:16
11 CU
1250 1760 35 W Apr 19, 2018
Ryzen 5 Pro 2400GE Vega 11 May 10, 2018
Ryzen 5 2400G 3.6 3.9 RX Vega 11 65 W Feb 12, 2018 US $169[81]
Ryzen 5 Pro 2400G Vega 11 May 10, 2018 OEM
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)[edit]

Common features of Zen+ based desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: GlobalFoundries 12LP.
Model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model[i] Config[ii] Clock
(MHz)
Processing
power
(GFLOPS)[iii]
Base Boost
Athlon Pro 300GE 2 (4) 3.4 4 MB Vega 3 192:12:4
3 CU
1100 424.4 35 W Sep 30, 2019 OEM
Athlon Silver Pro 3125GE Radeon
Graphics
Jul 21, 2020
Athlon Gold 3150GE 4 (4) 3.3 3.8
Athlon Gold Pro 3150GE
Athlon Gold 3150G 3.5 3.9 65 W
Athlon Gold Pro 3150G
Ryzen 3 3200GE 3.3 3.8 Vega 8 512:32:16
8 CU
1200 1228.8 35 W Jul 7, 2019
Ryzen 3 Pro 3200GE Sep 30, 2019
Ryzen 3 3200G 3.6 4.0 1250 1280 65 W Jul 7, 2019 US $99[85]
Ryzen 3 Pro 3200G Sep 30, 2019 OEM
Ryzen 5 Pro 3350GE 3.3 3.9 Radeon
Graphics
640:40:16
10 CU
1200 1536 35 W Jul 21, 2020
Ryzen 5 Pro 3350G 4 (8) 3.6 4.0 1300 1830.4 65 W
Ryzen 5 3400GE 3.3 Vega 11 704:44:16
11 CU
35 W Jul 7, 2019
Ryzen 5 Pro 3400GE Sep 30, 2019
Ryzen 5 3400G 3.7 4.2 RX Vega 11 1400 1971.2 65 W Jul 7, 2019 US $149[85]
Ryzen 5 Pro 3400G Vega 11 Sep 30, 2019 OEM
  1. ^ Starting with 2020 releases, AMD stopped referring to integrated graphics as "Vega", therefore all Vega based iGPUs are branded as AMD Radeon Graphics (instead Radeon Vega 3 or Radeon Vega 10).[82][83][84]
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Renoir" (2020)[edit]

Common features of Ryzen 4000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
Config[i]
Model Clock
(GHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b]
2.1 512:32:16
8 CU
2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][86] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU
1702.4 65 W Jul 21, 2020
(OEM) /
Apr 4, 2022
(retail)
OEM /
US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU
1305.6 65 W
4300GE[a] 3.5 35 W
  1. ^ Core complexes (CCXs) × cores per CCX
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93]
  2. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)[edit]

Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU[a] Thermal
solution
TDP Release
date
MSRP
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Clock
(MHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 5700G[b] 8 (16) 3.8 4.6 16 MB 1 × 8 2000 512:32:8
8 CU
2048 Wraith Stealth 65 W Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $359
5700GE[b] 3.2 35 W Apr 13, 2021 OEM
Ryzen 5 5600GT 6 (12) 3.6 1 × 6 1900 448:28:8
7 CU
1702.4 65 W Jan 31, 2024[94] US $140
5600G[b] 3.9 4.4 Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $259
5600GE[b] 3.4 35 W Apr 13, 2021 OEM
5500GT 3.6 65 W Jan 31, 2024[94] US $125
Ryzen 3 5300G[b] 4 (8) 4.0 4.2 8 MB 1 × 4 1700 384:24:8
6 CU
1305.6 OEM Apr 13, 2021 OEM
5300GE[b] 3.6 35 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b c d e f Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101]

Non APU or Radeon Graphics branded[edit]

"Raphael" (2022)[edit]

Common features of Ryzen 7000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i]. Models with "F" suffixes are without iGPUs.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Thermal
solution
Chiplets Core
config[ii]
TDP Release
date
MSRP
Base Boost
Ryzen 9 7950X3D 16 (32) 4.2 5.7 128 MB[iii] 2 × CCD
1 × I/OD
2 × 8 120 W Feb 28, 2023 US $699
7950X 4.5 64 MB 170 W Sep 27, 2022
7900X3D 12 (24) 4.4 5.6 128 MB[iii] 2 × 6 120 W Feb 28, 2023 US $599
7900X 4.7 64 MB 170 W Sep 27, 2022 US $549
7900 3.7 5.4 Wraith Prism 65 W Jan 10, 2023 US $429[104]
PRO 7945 Wraith Spire Jun 13, 2023 OEM
Ryzen 7 7800X3D 8 (16) 4.2 5.0 96 MB 1 × CCD
1 × I/OD
1 × 8 120 W Apr 6, 2023 US $449
7700X 4.5 5.4 32 MB 105 W Sep 27, 2022 US $399
7700 3.8 5.3 Wraith Prism 65 W Jan 10, 2023 US $329[104]
PRO 7745 Wraith Spire Jun 13, 2023 OEM
Ryzen 5 7600X 6 (12) 4.7 1 × 6 105 W Sep 27, 2022 US $299
7600 3.8 5.1 Wraith Stealth 65 W Jan 10, 2023 US $229[104]
PRO 7645 Wraith Spire Jun 13, 2023 OEM
7500F 3.7 5.0 Wraith Stealth Jul 22, 2023 US $179[105]
  1. ^ Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Core Complexes (CCX) × cores per CCX
  3. ^ a b Only one of the two CCXes has additional 64 MB 3D V-Cache.[102] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[103]

Server APUs[edit]

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)[edit]

Model Released Fab Step. CPU GPU DDR3
memory
support
TDP
(W)
Part number Release
price
(USD)
Cores
(threads)
Clock
(GHz)
Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
L1 L2
X1150[106] May 29, 2013[107] 28 nm 4 (4) 2.0 32 KB inst.
32 KB data

per core
2 MB 1600 9–17 OX1150IPJ44HM $64
X2150 1.9 R3 (HD 8400) 128:8:4
2 CU
266–600 28.9 11–22 OX2150IAJ44HM $99
X2170 Sep 1, 2016 2.4 R5 655–800 153.6 1866 11–25 OX2170IXJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Opteron X3000-series "Toronto" (2017)[edit]

Model Released Fab Step. CPU GPU DDR4
memory
support
TDP
(W)
Part number Release
price
(USD)
[Modules/FPUs]
Cores/threads
Clock rate (GHz) Cache[a] Model Config Clock
(MHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2
X3216[109][110] June 2017 28 nm 01h [1]2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 MB R5 256:16:4
4 CU
800 409.6 1600 12–15 OX3216AAY23KA OEM for HP
X3418[109][111] [2]4 1.8 3.2 2 MB R7 384:24:6
6 CU
614.4 2400 12–35 OX3418AAY43KA
X3421[109][112] June 2017 2.1 3.4 512:32:8
8 CU
819.2 OX3421AAY43KA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mobile processors with 3D graphics[edit]

APU or Radeon Graphics branded[edit]

Sabine: "Llano" (2011)[edit]

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1
  • Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
  • L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
  • Integrated PCIe 2.0 controller
  • GPU: TeraScale 2
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
  • 2.5 GT/s UMI
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2 L3
E2-3000M 2011

6/14

32 nm B0 2 (2) 1.8 2.4 64 KB inst.
64 KB data

per core
2× 512KB HD 6380G 160:8:4 400 128 1333 35 EM3000DDX22GX
A4-3300M 2011

6/14

1.9 2.5 2× 1MB HD 6480G 240:12:4 444 213.1 35 AM3300DDX23GX
A4-3305M December 7, 2011 2× 512KB 160:8:4 593 189.7 AM3305DDX22GX
A4-3310MX 2011

6/14

2.1 2× 1MB 240:12:4 444 213.1 45 AM3310HLX23GX
A4-3320M December 7, 2011 2.0 2.6 35 AM3320DDX23GX
A4-3330MX 2.2 45 AM3330HLX23GX
A4-3330MX 2.3 2× 512KB 160:8:4 593 189.7 AM3330HLX23HX
A6-3400M 2011

6/14

4 (4) 1.4 2.3 4× 1MB HD 6520G 320:16:8 400 256 35 AM3400DDX43GX
A6-3410MX 1.6 1600 45 AM3410HLX43GX
A6-3420M December 7, 2011 1.5 2.4 1333 35 AM3420DDX43GX
A6-3430MX 1.7 1600 45 AM3430HLX43GX
A8-3500M 2011

6/14

1.5 2.4 HD 6620G 400:20:8 444 355.2 1333 35 AM3500DDX43GX
A8-3510MX 1.8 2.5 1600 45 AM3510HLX43GX
A8-3520M December 7, 2011 1.6 1333 35 AM3520DDX43GX
A8-3530MX 2011

6/14

1.9 2.6 1600 45 AM3530HLX43GX
A8-3550MX December 7, 2011 2.0 2.7 AM3550HLX43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Comal: "Trinity" (2012)[edit]

An AMD A10-4600M APU
Model number Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A4-4355M September 27, 2012 32 nm TN-A1 FP2 [1]2 1.9 2.4 64 KB inst.
per module

16 KB data
per core
1 HD 7400G 192:12:4
3 CU
327 424 125.5 1333 17 AM4355SHE23HJ
A6-4455M May 15, 2012 2.1 2.8 2 HD 7500G 256:16:8
4 CU
167.4 AM4455SHE24HJ
A8-4555M September 27, 2012 [2]4 1.6 2.4

2MB

HD 7600G 384:24:8
6 CU
320 245.7 19 AM4555SHE44HJ
A8-4557M[113] Mar

2013

1.9 2.8 HD 7000 256:16:8
4 CU
497 655 254.4 (L)1600 35 AM4557DFE44HJ
A10-4655M May 15, 2012 2.0 2.8 HD 7620G 384:24:8
6 CU
360 496 276.4 1333 25 AM4655SIE44HJ
A10-4657M[113] Mar

2013

2.3 3.2 HD 7000 497 686 381.6 (L)1600 35 AM4657DFE44HJ
A4-4300M May 15, 2012 FS1r2 [1]2 2.5 3.0 1 HD 7420G 128:8:4
2 CU
480 655 122.8 1600 AM4300DEC23HJ
A6-4400M 2.7 3.2 HD 7520G 192:12:4
3 CU
496 685 190.4 AM4400DEC23HJ
A8-4500M [2]4 1.9 2.8

2MB

HD 7640G 256:16:8
4 CU
253.9 AM4500DEC44HJ
A10-4600M 2.3 3.2 HD 7660G 384:24:8
6 CU
380.9 AM4600DEC44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

"Richland" (2013)[edit]

Model number Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A4-5145M 2013/5 32 nm RL-A1 FP2 [1]2 2.0 2.6 64 KB inst.
per module

16 KB data
per core
1 HD 8310G 128:8:4
2 CU
424 554 108.5 (L)1333 17 AM5145SIE44HL
A6-5345M 2.2 2.8 HD 8410G 192:12:4
3 CU
450 600 172.8 AM5345SIE44HL
A8-5545M [2]4 1.7 2.7 4 HD 8510G 384:28:8
6 CU
554 345.6 19 AM5545SIE44HL
A10-5745M 2.1 2.9 HD 8610G 533 626 409.3 25 AM5745SIE44HL
A4-5150M 2013 Q1 FS1r2 [1]2 2.7 3.3 1 HD 8350G 128:8:4
2 CU
533 720 136.4 1600 35 AM5150DEC23HL
A6-5350M 2.9 3.5 HD 8450G 192:12:4
3 CU
204.6 AM5350DEC23HL
A6-5357M 2013/5 FP2 (L)1600 AM5357DFE23HL
A8-5550M 2013 Q1 FS1r2 [2]4 2.1 3.1 4 HD 8550G 256:16:8
4 CU
515 263.6 1600 AM5550DEC44HL
A8-5557M 2013/5 FP2 554 283.6 (L)1600 AM5557DFE44HL
A10-5750M 2013 Q1 FS1r2 2.5 3.5 HD 8650G 384:24:8
6 CU
533 409.3 1866 AM5750DEC44HL
A10-5757M 2013/5 FP2 600 460.8 (L)1600 AM5757DFE44HL
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

"Kaveri" (2014)[edit]

Model number Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A6-7000 June 2014 28 nm [1]2 2.2 3.0 96 KB inst.
per module

16 KB data
per core
1 R4 192:12:3
3 CU
494 533 189.6 1333 17 AM7000ECH23JA
A6 PRO - 7050B 533 204.6 1600 AM705BECH23JA
A8-7100 [2]4 1.8 3.0 2× 2 MB R5 256:16:4
4 CU
450 514 230.4 1600 20 AM7100ECH44JA
A8 PRO - 7150B 1.9 3.2 553 283.1 AM715BECH44JA
A10-7300 R6 384:24:8
6 CU
464 533 356.3 AM7300ECH44JA
A10 PRO - 7350B 2.1 3.3 533 424.7 AM735BECH44JA
FX-7500 R7 498 553 382.4 FM7500ECH44JA
A8-7200P 2.4 3.3 R5 256:16:4
4 CU
553 626 283.1 1866 35 AM740PDGH44JA
A10-7400P 2.5 3.4 R6 384:24:8
6 CU
576 654 442.3 AM740PDGH44JA
FX-7600P 2.7 3.6 R7 512:32:8
8 CU
600 686 614.4 2133 FM760PDGH44JA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Carrizo" (2015)[edit]

Model number Released Fab CPU GPU DDR

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

A6-8500P June 2015 28 nm [1]2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
800 409.6 3)1600 12-

35

AM850PAAY23KA
PRO A6-8500B AM850BAAY23KA
PRO A6-8530B Q3 2016 2.3 3.2 4)1866 AM853BADY23AB
A8-8600P June 2015 [2]4 1.6 3.0

1MB

R6 384:24:8
6 CU
720 552.9 3)2133 AM860PAAY43KA
PRO A8-8600B AM860BAAY43KA
A10-8700P 1.8 3.2 800 614.4 AM870PAAY43KA
PRO A10-8700B AM870BAAY43KA
PRO A10-8730B Q3 2016 2.4 3.3 R5 720 552.9 4)1866 AM873BADY44AB
A10-8780P December 2015 2.0 3.3 R8 512:32:8
8 CU
3)? AM878PAIY43KA
FX-8800P June 2015 2.1 3.4 R7 800 819.2 4)2133 FM880PAAY43KA
PRO A12-8800B FM880BAAY43KA
PRO A12-8830B Q3 2016 2.5 3.4 384:24:8
6 CU
758 582.1 4)1866 AM883BADY44AB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bristol Ridge" (2016)[edit]

Model number Released Fab CPU GPU DDR4

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

Pro A6-9500B October 24, 2016 28nm [1]2 2.3 3.2 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
800 409.6 1866 12-

15

Pro A8-9600B October 24, 2016 [2]4 2.4 3.3 2× 1 MB R5 384:24:6
6 CU
720 552.9 1866 12–

15

A10-9600P June 2016 AM960PADY44AB
A10-9620P[118] 2017 (OEM) 2.5 3.4 758 582.1
Pro A10-9700B October 24, 2016 R7
A12-9700P June 2016 AM970PADY44AB
Pro A8-9630B October 24, 2016 2.6 3.3 R5 800 614.4 2400 25–

45

A10-9630P June 2016 AM963PAEY44AB
Pro A10-9730B October 24, 2016 2.8 3.5 R7 900 691.2
A12-9730P June 2016 AM973PAEY44AB
Pro A12-9800B October 24, 2016 2.7 3.6 R7 512:32:8
8 CU
758 776.1 1866 12–

15

[1] FX-9800P
A12-9720P[119][120]
June 2016
2017 (OEM)
FM980PADY44AB
?
Pro A12-9830B October 24, 2016 3.0 3.7 900 921.6 2400 25–

45

FX-9830P June 2016 FM983PAEY44AB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Raven Ridge" (2017)[edit]

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(MHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Athlon Pro 200U 2019 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Radeon Vega 3 192:12:4
3 CU
1000 384 FP5 12 (8+4) DDR4-2400
dual-channel
12–25 W
Athlon 300U Jan 6, 2019 2.4 3.3
Ryzen 3 2200U Jan 8, 2018 2.5 3.4 1100 422.4
Ryzen 3 3200U Jan 6, 2019 2.6 3.5 1200 460.8
Ryzen 3 2300U Jan 8, 2018 4 (4) 2.0 3.4 Radeon Vega 6 384:24:8
6 CU
1100 844.8
Ryzen 3 Pro 2300U May 15, 2018
Ryzen 5 2500U Oct 26, 2017 4 (8) 3.6 Radeon Vega 8 512:32:16
8 CU
1126.4
Ryzen 5 Pro 2500U May 15, 2018
Ryzen 5 2600H Sep 10, 2018 3.2 DDR4-3200
dual-channel
35–54 W
Ryzen 7 2700U Oct 26, 2017 2.2 3.8 Radeon RX Vega 10 640:40:16
10 CU
1300 1664 DDR4-2400
dual-channel
12–25 W
Ryzen 7 Pro 2700U May 15, 2018 Radeon Vega 10
Ryzen 7 2800H Sep 10, 2018 3.3 Radeon RX Vega 11 704:44:16
11 CU
1830.4 DDR4-3200
dual-channel
35–54 W
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)[edit]

Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 3780U[121] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU
1971.2 15 W Oct 2019
3750H[122] RX Vega 10 640:40:16
10 CU[123]
1792.0 35 W Jan 6, 2019
3700C[124] 15 W Sep 22, 2020
3700U[a][125] Jan 6, 2019
Ryzen 5 3580U[126] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU
1497.6 Oct 2019
3550H[127] Vega 8 1.2 512:32:16
8 CU[128]
1228.8 35 W Jan 6, 2019
3500C[129] 15 W Sep 22, 2020
3500U[a][130] Jan 6, 2019
3450U[131] 3.5 Jun 2020
Ryzen 3 3350U[132] 4 (4) Vega 6 384:24:8
6 CU[133]
921.6 Jan 6, 2019
3300U[a][134] Jan 6, 2019
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[135][136][137], released April 8, 2019.

"Renoir" (2020)[edit]

  • Fabrication 7 nm by TSMC[138][139][140]
  • Socket FP6
  • Die size: 156 mm²
  • 9.8 billion transistors on one single 7 nm monolithic die[141]
  • Up to eight Zen 2 CPU cores
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fifth generation GCN-based GPU
  • Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • All the CPUs support 16 PCIe 3.0 lanes.
U[edit]
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(MHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 4980U 8 (16) 2.0 4.4 8 MB 2 × 4 Radeon
Graphics[a]
1950 512:32:8
8 CU
1996.8 15 W Apr 13, 2021
4800U 1.8 4.2 1750 1792 Mar 16, 2020
Pro 4750U 1.7 4.1 1600 448:28:8
7 CU
1433.6 May 7, 2020
4700U 8 (8) 2.0 Mar 16, 2020
Ryzen 5 4680U 6 (12) 2.1 4.0 2 × 3 1500 1344 Apr 13, 2021
Pro 4650U 384:24:8
6 CU
1152 May 7, 2020
4600U Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 Pro 4450U 4 (8) 2.5 3.7 4 MB 1 × 4 1400 320:20:8
5 CU
896 May 7, 2020
4300U 4 (4) 2.7 Mar 16, 2020
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
H[edit]
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(MHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics[a]
1750 512:32:8
8 CU
1792 45 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H 2.9 4.2 1600 448:28:8
7 CU
1433.6 45 W
4800HS
Ryzen 5 4600H 6 (12) 3.0 4.0 2 × 3 1500 384:24:8
6 CU
1152
4600HS[142][143][144] 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)[edit]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 156 mm²
  • 9.8 billion transistors on one single 7 nm monolithic die[citation needed]
  • Up to eight Zen 2 CPU cores
  • Fifth generation GCN-based GPU (7 nm Vega)

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a]
1.9 512:32:8
8 CU
1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[145] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU
1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU
1152
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)[edit]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 180 mm²
  • Up to eight Zen 3 CPU cores
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fifth generation GCN-based GPU
  • Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • All the CPUs support 16 PCIe 3.0 lanes.
U[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5800U[note 1][146] 8 (16) 1.9 4.4 16 MB 1 × 8 Radeon
Graphics[a]
2.0 512:32:8
8 CUs
2048 10–25 W Jan 12, 2021
Ryzen 5 5600U[note 1][147] 6 (12) 2.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8
5560U[148] 4.0 8 MB 1.6 384:24:8
6 CUs
1228.8
Ryzen 3 5400U[note 1][149][150] 4 (8) 2.7 4.1 1 × 4
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d Model also available as Pro version as 5450U,[151] 5650U,[152] 5850U,[153] released on March 16, 2021.
H[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 5980HX[154] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics[a]
2.1 512:32:8
8 CUs
2150.4 35–54 W Jan 12, 2021
5980HS[155] 3.0 35 W
5900HX[156] 3.3 4.6 35–54 W
5900HS[157] 3.0 35 W
Ryzen 7 5800H[158][159] 3.2 4.4 2.0 2048 35–54 W
5800HS[160] 2.8 35 W
Ryzen 5 5600H[161][162] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8 35–54 W
5600HS[163] 3.0 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)[edit]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 180 mm²
  • Up to eight Zen 3 CPU cores
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fifth generation GCN-based GPU
  • Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • All the CPUs support 16 PCIe 3.0 lanes.
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5825U[note 1][note 2][164] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics[a]
2.0 512:32:8
8 CUs
2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][165] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs
1612.8
Ryzen 3 5125C[166] 2 (4) 3.0 8 MB 1 × 2 ? 192:12:8
3 CU
? May 5, 2022
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as Pro version as 5475U,[167] 5675U,[168] 5875U,[169] released on April 19, 2022.
  2. ^ a b c Model also available as Chromebook optimized version as 5425C,[170] 5625C,[171] 5825C,[172] released on May 5, 2022.

"Rembrandt" (2022)[edit]

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC 6 nm FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs
3686.4 45 W Jan 4, 2022
[173]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs
1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[174], 6650H[175], 6650HS[176], 6850U[177], 6850H[178], 6850HS[179], 6950H[180], 6950HS[181]), released on April 19, 2022.

"Phoenix" (2023)[edit]

"Dragon Range" (2023)[edit]

Ultra-mobile APUs[edit]

Brazos: "Desna", "Ontario", "Zacate" (2011)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2
Z-01 June 1, 2011 40 nm B0 2 (2) 1.0 32KB inst.
32KB data

per core
2× 512KB HD 6250 80:8:4 276 44.1 1066 5.9 XMZ01AFVB22GV
C-30 January 4, 2011 1 (1) 1.2 512KB 9 CMC30AFPB12GT
C-50 2 (2) 1.0 2× 512KB CMC50AFPB22GT
C-60 August 22, 2011 C0 1.33 HD 6290 400 CMC60AFPB22GV
E-240 January 4, 2011 B0 1 (1) 1.5 512KB HD 6310 500 80 1066 18 EME240GBB12GT
E-300 August 22, 2011 2 (2) 1.3

512KB

488 78 EME300GBB22GV
E-350 January 4, 2011 1.6 492 78.7 EME350GBB22GT
E-450 August 22, 2011 B0
C0
1.65 HD 6320 508 600 81.2 1333 EME450GBB22GV
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Brazos 2.0: "Ontario", "Zacate" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2 L3
C-70 September 15, 2012 40 nm C0 2 (2) 1.0 1.33 32 KB inst.
32 KB data

per core
2× 512KB HD 7290 80:8:4 276 400 44.1 1066 9 CMC70AFPB22GV
E1-1200 June 6, 2012 C0 1.4 HD 7310 500 80 1066 18 EM1200GBB22GV
E1-1500 January 7, 2013 1.48 529 84.6
E2-1800 June 6, 2012 1.7 HD 7340 523 680 83.6 1333 EM1800GBB22GV
E2-2000 January 7, 2013 1.75 538 700 86
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Brazos-T: "Hondo" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3
Memory
support
TDP (W) Part number
Cores
(threads)
Clock (GHz) Cache[a] Model Config Clock (MHz) GFLOPS[b]
L1 L2
Z-60 October 9, 2012 40 nm C0 2 (2) 1.0 32KB inst.
32KB data

per core
2× 512 KB HD 6250 80:8:4 276 44.1 1066 4.5 XMZ60AFVB22GV
  1. ^ AMD in its technical documentation uses KB, which it defines as "kilobyte" and as equal to 1024 B (i.e., 1 KiB), and MB, which it defines as "megabyte" and as equal to 1024 KB (1 MiB).[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini", "Temash" (2013)[edit]

Temash, Elite Mobility APU[edit]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

A4-1200 May 23, 2013 28 nm KB-A1 2 (2) 1.0 32 KB inst.
32 KB data

per core
1 HD 8180 128:8:4
2 CU
225 1066 4 AT1200IFJ23HM
A4-1250 HD 8210 300 1333 8 AT1250IDJ23HM
A4-1350 4 (4) 2 1066 AT1350IDJ44HM
A6-1450 1.4 HD 8250 400 AT1450IDJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

Kabini, Mainstream APU[edit]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

L1 L2

(MB)

L3
E1-2100 May 2013 28 nm KB-A1 2 (2) 1.0 32KB inst.
32KB data

per core
1 HD 8210 128:8:4
2 CU
300 1333 9 EM2100ICJ23HM
E1-2200 Feb 2014 1.05 EM2200ICJ23HM
E1-2500 May 2013 1.4 HD 8240 400 15 EM2500IBJ23HM
E2-3000 1.65 HD 8280 450 1600 EM3000IBJ23HM
E2-3800 Feb 2014 4 1.3 2 EM3800IBJ44HM
A4-5000 May 2013 1.5 HD 8330 497 AM5000IBJ44HM
A4-5100 Feb 2014 1.55 AM5100IBJ44HM
A6-5200 May 2013 2.0 HD 8400 600 25 AM5200IAJ44HM
A4 Pro-3340B Nov 2014 2.2 HD 8240 400 AM334BIAJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Beema", "Mullins" (2014)[edit]

Mullins, Tablet/2-in-1 APU[edit]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

L3
E1 Micro-6200T Q2 2014 28 nm ML-A1 2 (2) 1.0 1.4 32 KB inst.
32 KB data

per core
1 R2 128:8:4
2 CU
300 600 1066 3.95 EM620TIWJ23JB
A4 Micro-6400T 4 (4) 1.6 2 R3 350 686 1333 4.5 AM640TIVJ44JB
A10 Micro-6700T 1.2 2.2 R6 500 AM670TIVJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

Beema, Notebook APU[edit]

Model Released Fab Step. CPU GPU DDR3 Memory support TDP (W) Part number
Cores (threads) [FPUs] Clock (GHz) Turbo (GHz) Cache[a] Model Config Clock (MHz) Turbo (MHz)
L1 L2 (MB) L3
E1-6010 Q2 2014 28 nm ML-A1 2 (2) 1.35 32 KB inst. 32 KB data per core 1 R2 128:8:4
2 CU
300 600 (L)1333 10 EM6010IUJ23JB
E1-6015[183] Q2 2015 1.4
E2-6110 Q2 2014 4 (4) 1.5 2 (L)1600 15 EM6110ITJ44JB
A4-6210 1.8 R3 350 686 AM6210ITJ44JB
A4-6250J[184] 2.0 25
A6-6310 1.8 2.4 R4 300 800 (L)1866 15 AM6310ITJ44JB
A8-6410 2.0 R5 AM6410ITJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Carrizo-L" (2015)[edit]

Model Released Fab Step. CPU GPU DDR3
Memory
support
TDP

(W)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock Turbo

(MHz)

L1 L2

(MB)

E1-7010 May 2015 28 nm ML-A1 2 1.5 32 KB inst.
32 KB data

per core
1 R2 128:8:4
2 CU
400 (L)1333 10 EM7010IUJ23JB
EM7010JCY23JB
EM7010JCY23JBD
E2-7110 4 1.8 2 R2 600 (L)1600 12–25 EM7110ITJ44JB
EM7110JBY44JB
EM7110JBY44JBD
A4-7210 2.2 R3 686 AM7210ITJ44JB
AM7210JBY44JBD
A6-7310 2.0 2.4 R4 800 (L)1866 AM7310ITJ44JB
AM7310JBY44JB
AM7310JBY44JBD
A8-7410 2.2 2.5 R5 847 15 AM7410JBY44JB
A4 PRO-3350B May 2016 2.0 2.4 R4 800 1600 AM335BITJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Stoney Ridge" (2016)[edit]

Model number Released Fab CPU GPU DDR4

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

E2-9000e November 2016 28 nm [1]2 1.5 2.0 96 KB inst.
per module

32 KB data
per core
1 R2 128:8:4
2 CU
600 153.6 1866 6 EM900EANN23AC
E2-9000 June 2016 1.8 2.2 10 EM9000AKN23AC
E2-9010 2.0 2.2 10–15 EM9010AVY23AC
A4-9120 Q2 2017 2.2 2.5 R3 655 167.6 2133 10–15 AM9120AYN23AC
A4-9125 Q2 2018 2.3 2.6 686 175.6 AM9125AYN23AC
A4-9120C January 6, 2019 1.6 2.4 R4 192:12:8
3 CU
600 230.4 1866 6 AM912CANN23AC
A6-9200e November 2016 1.8 2.7 2133 AM920EANN23AC
A6-9200 2.0 2.8 10 AM9200AKN23AC
A6-9210 June 2016 2.4 2.8 10–15 AM9210AVY23AC
A6-9220 Q2 2017 2.5 2.9 655 251.5 10–15 AM9220AYN23AC
A6-9225 Q2 2018 2.6 3.0 686 263.4 AM9225AYN23AC
A6-9220C January 6, 2019 1.8 2.7 R5 720 276.4 1866 6 AM922CANN23AC
A9-9400 November 2016 2.4 3.2 800 307.2 2133 10 AM9400AKN23AC
A9-9410 June 2016 2.9 3.5 10–25 AM9410AFY23AC
A9-9420 Q2 2017 3.0 3.6 847 325.2 AM9420AYN23AC
A9-9425 Q2 2018 3.1 3.7 900 345.6 AM9425AYN23AC
A9-9430[186] Q2 2017 3.2 3.5 847 325.2 2400 25 AD9430AJN23AC
Pro A4-4350B Q1 2018 2.5 2.9 655 251.5 2133 15
Pro A4-5350B Q1 2020 3.0 3.6 847 325.2
Pro A6-7350B Q1 2018
Pro A6-8350B Q1 2020 3.1 3.7 900 345.6
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Dalí" (2020)[edit]

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory
support
TDP Part number
Cores
(threads)
Clock rate (GHz) Cache Model Config[a] Clock
(GHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2 L3
AMD 3020e Jan 6, 2020 14 nm 2 (2) 1.2 2.6 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Radeon
Graphics
(Vega)
192:12:4
3 CU
1.0 384 FP5 12 (8+4) DDR4-2400
dual-channel
6 W YM3020C7T2OFG
Athlon PRO 3045B Q1 2021 2.3 3.2 128:8:4
2 CU
1.1 281.6 15 W YM3045C4T2OFG
Athlon Silver 3050U Jan 6, 2020 YM3050C4T2OFG
Athlon Silver 3050C Sep 22, 2020 YM305CC4T2OFG
Athlon Silver 3050e Jan 6, 2020 2 (4) 1.4 2.8 192:12:4
3 CU[187]
1.0 384 6 W YM3050C7T2OFG
Athlon PRO 3145B Q1 2021 2.4 3.3 15 W YM3145C4T2OFG
Athlon Gold 3150U Jan 6, 2020 YM3150C4T2OFG
Athlon Gold 3150C Sep 22, 2020 YM315CC4T2OFG
Ryzen 3 3250U Jan 6, 2020 2.6 3.5 1.2 460.8 YM3250C4T2OFG
Ryzen 3 3250C Sep 22, 2020 YM325CC4T2OFG
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Pollock" (2020)[edit]

Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory
support
TDP Part number
Cores
(threads)
Clock rate (GHz) Cache Model Config[a] Clock
(GHz)
Processing
power
(GFLOPS)[b]
Base Boost L1 L2 L3
AMD 3015e Jul 6, 2020 14 nm 2 (4) 1.2 2.3 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Radeon
Graphics
(Vega)
192:12:4
3 CU
0.6 230.4 FT5 12 (8+4) DDR4-1600
single-channel
6 W AM3015BRP2OFJ
AMD 3015Ce Apr 29, 2021 AM301CBRP2OFJ
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Mendocino" (2022)[edit]

Common features:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Includes integrated RDNA2 GPU.
  • Fabrication process: TSMC 6 nm FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
Base Boost
Athlon Gold 7220U[a][188] 2 (4) 2.4 3.7 4 MB 1 x 2 610M
2 CU
1900 MHz 8–15 W Sep 20, 2022[189]
Athlon Silver 7120U[a][190] 2 (2) 3.5 2 MB
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ a b Model also available as Chromebook optimized version as 7220C[191] and 7120C[192] released on May 23, 2023


Embedded APUs[edit]

G-Series[edit]

Brazos: "Ontario" and "Zacate" (2011)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2
G-Series T24L March 1, 2011
May 23, 2011
40 nm B0 1 (1) 0.8
1.0
32 KB inst.
32 KB data

per core
512 KB 1066 5 GET24LFPB12GTE
GET24LFQB12GVE
G-Series T30L March 1, 2011
May 23, 2011
1.4 18 GET30LGBB12GTE
GET30LGBB12GVE
G-Series T48L March 1, 2011
May 23, 2011
2 (2) 2 × 512 KB GET48LGBB22GTE
GET48LGBB22GVE
G-Series T16R June 25, 2012 B0 1 (1) 0.615 512 KB HD 6250 80:8:4 276 44.1 (L)1066 4.5 GET16RFWB12GVE
G-Series T40R May 23, 2011 1.0 280 44.8 1066 5.5 GET40RFQB12GVE
G-Series T40E 2 (2) 2 × 512 KB 6.4 GET40EFQB22GVE
G-Series T40N January 19, 2011
May 23, 2011
HD 6250
HD 6290
9 GET40NFPB22GTE
GET40NFPB22GVE
G-Series T40R May 23, 2011 1 (1) 512 KB HD 6250 5.5 GET40RFSB12GVE
G-Series T44R January 19, 2011
May 23, 2011
1.2 9 GET44RFPB12GTE
GET44RFPB12GVE
G-Series T48E June 25, 2012 2 (2) 1.4 2 × 512 KB 18 GET48EGBB22GVE
G-Series T48N January 19, 2011
May 23, 2011
HD 6310 500
520
80
83.2
GET48NGBB22GTE
GET48NGBB22GVE
G-Series T52R January 19, 2011
May 23, 2011
1 (1) 1.5 512 KB 500 80 1066
1333
GET52RGBB12GTE
GET52RGBB12GVE
G-Series T56E June 25, 2012 2 (2) 1.65 2 × 512 KB HD 6250 275 44 1333 GET56EGBB22GVE
G-Series T56N January 19, 2011
May 23, 2011
1.6
1.65
HD 6310
HD 6320
500 80 1066
1333
GET56NGBB22GTE
GET56NGBB22GVE
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini" (2013, SoC)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Junction temperature (°C) Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-210UA Un­known 28 nm B0 2 (2) 1.0 32 KB inst.
32 KB data

per core
1 1333 8.5 0-90 GE210UIGJ23HM
GX-210JA July 30, 2013 HD 8180E 128:8:4
2 CU
225 57.6 1066 6 GE210JIHJ23HM
GX-209HA Un­known HD 8400E 600 153.6 9 -40-105 GE209HISJ23HM
GX-210HA June 1, 2013 HD 8210E 300 76.8 1333 0-90 GE210HICJ23HM
GX-217GA 1.65 HD 8280E 450 115.2 1600 15 GE217GIBJ23HM
GX-411GA Un­known 4 (4) 1.1 2 HD 8210E 300 76.8 1066 -40-105 GE411GIRJ44HM
GX-415GA June 1, 2013 1.5 HD 8330E 500 128 1600 0-90 GE415GIBJ44HM
GX-416RA 1.6 GE416RIBJ44HM
GX-420CA 2.0 HD 8400E 128:8:4
2 CU
600 153.6 25 GE420CIAJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Steppe Eagle" (2014, SoC)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Junction temperature (°C) Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-210JC June 4, 2014 28 nm ML-A1 2 (2) [1] 1.0 32 KB inst.
32 KB data

per core
1 R1E 128:8:4
2 CU
267 68.3 1600 6 -40-105 GE210JIZJ23JB
GX-212JC 1.2 R2E 300 76.8 1333 0-90 GE212JIYJ23JB
GX-216HC 1.6 R4E 1066 10 -40-105 GE216HHBJ23JB
GX-222GC 2.2 R5E 655 167.6 1600 15 0-90 GE222GITJ23JB
GX-412HC 4 (4) [2] 1.2 2 R3E 300 76.8 1333 7 GE412HIYJ44JB
GX-424CC 2.4 R5E 497 127.2 1866 25 GE424CIXJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Crowned Eagle" (2014, SoC)[edit]

Model Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Junction

temperature

(°C)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a]
L1 L2

(MB)

GX-224PC June 4, 2014 28 nm 2 (2) [1] 2.4 32 KB inst.
32 KB data

per core
1 1866 25 0-90 GE224PIXJ23JB
GX-410VC 4 (4) [2] 1.0 2 1066 7 -40-105 GE410VIZJ44JB
GX-412TC 1.2 1600 6 0-90 GE412TIYJ44JB
GX-420MC 2.0 17.5 GE420MIXJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

LX-Family (2016, SoC)[edit]

  • Fabrication 28 nm
  • Socket FT3b (769-BGA)
  • 2 Puma x86 cores with 1MB shared L2 cache
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
  • Single channel 64-bit DDR3 memory with ECC
  • Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-208JL February 23, 2016 28 nm ML-A1 2 0.8 32 KB inst.
32 KB data

per core
1 R1E 64:4:1
1 CU
267 34.1 1333 6 GE208JIVJ23JB
GX-210HL 2017 1.0 1066 7 GE208HIZJ23JB
GX-210JL February 23, 2016 1333 6 GE210JIVJ23JB
GX-210KL 2017 4.5 GE210KIVJ23JB
GX-215GL February 23, 2016 1.5 497 63.6 1600 15 GE215GITJ23JB
GX-218GL 1.8 GE218GITJ23JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

I-Family: "Brown Falcon" (2016, SoC)[edit]

Model Released Fab CPU GPU Memory
support
TDP

(W)

Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-217GI February 23, 2016 28 nm [1] 2 1.7 2.0 96 KB inst.
per module

32 KB data
per core
1 R6E 256:16:4
4 CU
758 388 DDR3/DDR4-1600 15 GE217GAAY23KA
GX-420GI[196][197] 2016 [2] 4 2.0 2.2 2 R6E


R7E
256:16:4
4 CU

384:24:4
6 CU
758


626
388


480.7
DDR4-1866 16.1 GE420GAAY43KA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

J-Family: "Prairie Falcon" (2016, SoC)[edit]

Model Released Fab CPU GPU Memory
support
TDP

(W)

Junction temperature (°C) Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-212JJ 2018 28 nm [1] 2 1.2 1.6 96 KB inst.
per module

32 KB data
per core
1 R1E 64:4:1
1 CU
600 76.8 DDR3-1333
DDR4-1600
6–

10

0-90 GE212JAWY23AC
GX-215JJ 2017 1.5 2.0 R2E 128:8:2
2 CU
153.6 DDR3-1600
DDR4-1866
GE215JAWY23AC
GX-220IJ 2018 2.0 2.2 10–

15

GE220IAVY23AC
GX-224IJ 2017 2.4 2.8 R4E 192:12:3
3 CU
230.4 DDR3-1866
DDR4-2133
GE224IAVY23AC
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

R-Series[edit]

Comal: "Trinity" (2012)[edit]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

R-252F May 21, 2012 32 nm B0 [1] 2 1.9 2.4 64 KB inst.
per module

16 KB data
per core
1 HD 7400G 192:12:4
3 CU
333 417 127.8 1333 17 RE252FSHE23HJE
R-260H 2.1 2.6 2? HD 7500G 256:16:8
4 CU
327 424 167.4 RE260HSHE24HJE
R-268D 2.5 3.0 1 HD 7420G 192:12:4
3 CU
470 640 180.4 1600 35 RE268DDEC23HJE
R-272F 2.7 3.2 HD 7520G 497 686 190.8 RE272FDEC23HJE
R-452L [2] 4 1.6 2.4 2 × 2 MB HD 7600G 256:16:8
4 CU
327 424 167.4 19 RE452LSHE44HJE
R-460H 1.9 2.8 HD 7640G 497 655 254.4 35 RE460HDEC44HJE
R-460L 2.0 HD 7620G 384:24:8
6 CU
360 497 276.4 1333 25 RE460LSIE44HJE
R-464L 2.3 3.2 HD 7660G 497 686 381.6 1600 35 RE464LDEC44HJE
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bald Eagle" (2014)[edit]

Model Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Junction temperature (°C) Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

RX-219NB May 20, 2014 28 nm [1] 2 2.2 3.0 96 KB inst.
per module

16 KB data
per core
1 1600 15-

17

0-100 RE219NECH23JA
RX-225FB R4 192:12:4
3 CU
464 533 178.1 RE225FECH23JA
RX-425BB [2] 4 2.5 3.4 4 R6 384:24:8
6 CU
576 654 442.3 1866 30-

35

RE425BDGH44JA
RX-427BB 2.7 3.6 R7 512:32:8
8 CU
600 686 614.4 2133 30-

35

RE427BDGH44JA
RX-427NB RE427NDGH44JA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Merlin Falcon" (2015, SoC)[edit]

Model Released Fab Stepping CPU GPU Memory
support
TDP

(W)

Junction temperature (°C) Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(GHz)

Turbo Processing
power
(GFLOPS)[b]
L1 L2

(MB)

L3
RX-216TD October 21, 2015 28 nm [1] 2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 DDR3/DDR4-1600 12-

15

0-90 RE216TAAY23KA
RX-216GD R5 256:?:?
4 CU
0.8 409.6 RE216GAAY23KA
RX-416GD [2] 4 2.4 2 R6 384:?:?
6 CU
0.72 552.9 15 -40-105 RE416GATY43KA
RX-418GD October 21, 2015 1.8 3.2 384:?:?
6 CU
0.8 614.4 DDR3-2133
DDR4-2400
12-

35

0-90 RE418GAAY43KA
RX-421BD 2.1 3.4 R7 512:?:?
8 CU
819.2 RE421BAAY43KA
RX-421ND RE421NAAY43KA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1000-Series[edit]

V1000-Family: "Great Horned Owl" (2018, SoC)[edit]

Model Release
date
Fab CPU GPU Memory
support
TDP Junction
temp.
range

(°C)
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
V1202B February 2018 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:16
3 CU
1.0 384 DDR4-2400
dual-channel
12–25 W 0–105
V1404I December 2018 4 (8) 2.0 3.6 Vega 8 512:32:16
8 CU
1.1 1126.4 -40–105
V1500B 2.2 0–105
V1605B February 2018 2.0 3.6 Vega 8 512:32:16
8 CU
1.1 1126.4
V1756B 3.25 DDR4-3200
dual-channel
35–54 W
V1780B December 2018 3.35
V1807B February 2018 3.8 Vega 11 704:44:16
11 CU
1.3 1830.4
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

R1000-Family: "Banded Kestrel" (2019, SoC)[edit]

Model Release
date
Fab CPU GPU Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
R1102G February 25, 2020 GloFo
14LP
2 (2) 1.2 2.6 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:4
3 CU
1.0 384 DDR4-2400
single-channel
6 W
R1305G 2 (4) 1.5 2.8 DDR4-2400
dual-channel
8-10 W
R1505G April 16, 2019 2.4 3.3 12–25 W
R1606G 2.6 3.5 1.2 460.8
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

2000-Series[edit]

V2000-Family: "Grey Hawk" (2020, SoC)[edit]

Model Release
date
Fab CPU GPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Archi-
tecture
Config[i] Clock
(GHz)
Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
V2516[201] November 10, 2020[202] TSMC
7FF
6 (12) 2.1 3.95 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB GCN 5 384:24:8
6 CU
1.5 1152 FP6 20
(8+4+4+4)
PCIe 3.0
DDR4-3200
dual-channel

LPDDR4X-4266
quad-channel
10–25 W
V2546[201] 3.0 3.95 35–54 W
V2718[201] 8 (16) 1.7 4.15 448:28:8
7 CU
1.6 1433.6 10–25 W
V2748[201] 2.9 4.25 35–54 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

R2000-Family: "River Hawk" (2022, SoC)[edit]

Custom APUs[edit]

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit.[203] Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One.[204] So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

Chip
(device)
Release date Fab Die area (mm2) CPU GPU Memory Storage API support Special features
Archi-
tecture
Cores Clock (GHz) L2 cache Archi-
tecture
Core config[a] Clock (MHz) GFLOPS[b] Pixel fillrate (GP/s)[c] Texture fillrate (GT/s)[d] Other Size Bus type & width Band-
width (GB/s)
Audio Other
Liverpool
(PS4)
Nov 2013 28 nm 348 Jaguar 8 cores 1.6 2× 2 MB GCN 2 1152:72:32
18 CU
800 1843 25.6 57.6 8 ACEs 8 GB GDDR5
256-bit
176 3DBD/DVD
1× 2.5" SATA hard drive
Easily replaceable hard drive
USB 3.0
OpenGL 4.2, GNM, GNMX and PSSL Dolby Atmos (BD)
S/PDIF
PS VR
PS4 additional modules
HDR10 (except discs)[e]
CEC
Optional IR sensor
Durango
(Xbox One)
Nov 2013 363 1.75 768:48:16
12 CU
853 1310 13.6 40.9 2 ACEs 32 MB ESRAM[f] 204 3DBD/DVD/CD
1× 2.5" SATA hard drive
USB 3.0
Direct3D 11.2 and 12 Fully Dolby Atmos, DTS:X, and Windows Sonic
S/PDIF
Xbox One additional modules
FreeSync (1)
HDMI 1.4 through
IR sensor and IR out port
Kensington lock
8 GB DDR3
256-bit
68
Edmonton
(Xbox One S) [205]
Jun 2016 16 nm 240 914 1404 14.6 43.9 2 ACEs 32 MB ESRAM 219 4KBD/3DBD/DVD/CD[g]
1× 2.5" SATA hard drive
USB 3.0
Fully Dolby Atmos, DTS:X, and Windows Sonic
S/PDIF
Xbox One S additional modules
Fully HDR10
Dolby Vision (streaming)
FreeSync (1&2)
HDMI 1.4 through
IR sensor and IR out port
Kensington lock
8 GB DDR3
256-bit
68
(PS4 Slim) Sep 2016 208 1.6 1152:72:32
18 CU
800 1843 25.6 57.6 8 ACEs 8 GB GDDR5
256-bit
176 3DBD/DVD
1× 2.5" SATA hard drive
Easily replaceable hard drive
USB 3.0
OpenGL 4.2, GNM, GNMX and PSSL Dolby Atmos (BD) PS VR
PS4 Slim additional modules
HDR10 (except discs)
CEC
Optional IR sensor
Neo
(PS4 Pro) [206][207][208]
Nov 2016 325 2.13 GCN 4
(Polaris) [209]
2304:144:32
36 CU
911 4198 58.3 131.2 4 ACEs and 2 HWS
Double-rate FP16[h]
checkerboard rendering
8 GB[210] GDDR5
256-bit
218 3DBD/DVD
1× 2.5" SATA hard drive
Easily replaceable hard drive
USB 3.0
OpenGL 4.2 (4.5), GNM, GNMX and PSSL Dolby Atmos (BD)
S/PDIF
PS VR
PS4 Pro additional modules
HDR10 (except discs)
Up to 4K@60 Hz
CEC
Optional IR sensor
1 GB DDR3[i] ?
Scorpio
(Xbox One X) [211][212][213]
Nov 2017 359 Customized
Jaguar
2.3 2560:160:32
40 CU
1172 6001 37.5 187.5 4 ACEs and 2 HWS 12 GB GDDR5
384-bit
326 4KBD/3DBD/DVD/CD
1× 2.5" SATA hard drive
USB 3.0
Direct3D 11.2 and 12 Fully Dolby Atmos, DTS:X, and Windows Sonic
S/PDIF
Xbox One X additional modules
Fully HDR10
Dolby Vision (streaming)
FreeSync (1&2)
Up to 4K@60 Hz
HDMI 1.4b through
IR sensor and IR out port
Fenghuang
(Subor Z+) [214][215][216]
cancelled [217] 14 nm [218] 397 Zen 4 cores
8 threads
3.0 GCN 5 1536:96:32
24 CU
1300 3994 41.6 124.8 Double-rate FP16 8 GB GDDR5
256-bit
154 1× 2.5" SATA SSD
1× 2.5" SATA hard drive
Easily replaceable drives
USB 3.0
Vulkan 1.1, Direct3D 12.1 S/PDIF Subor Z Plus additional modules
Windows 10 Enterprise LTSC
Oberon
(PS5) [219]
Nov 2020 7 nm 308 Zen 2 8 cores
16 threads
3.5 (variable) 8 MB RDNA 2 2304:144:64
36 CU
2233 (variable) 10290 (variable) 142.9 321.6 Double-rate FP16
Real-time ray tracing
Primitive shaders
Custom 3D audio blocks
16 GB GDDR6
256-bit
448 4KBD
Custom 5.5 GB/s PCIe 4.0 x4 NVMe SSD
PCIe 4.0 M.2 slot
Easily replaceable M.2 SSD
USB (except PS5 games)
Vulkan 1.2 PS5 TEMPEST 3D AudioTech PS VR
Dedicated DMA controller and I/O coprocessors
Custom coherency engines and cache scrubbers
Custom decompression block
HDR
Up to 4K@120 Hz
Up to 8K@30 Hz
Anaconda
(Xbox Series X)
Nov 2020 360 3.6
(3.8 w/o SMT)
4 MB 3328:208:64
52 CU
1825 12147 116.8 379.6 Double-rate FP16
Real-time ray tracing
Mesh shaders
Variable rate shading
ANN acceleration
10 GB GDDR6
320-bit
560 4KBD
Custom 2.4 GB/s NVMe SSD
Custom expansion card
USB 3.1 (except XSX games)
DirectX 12 Ultimate Custom spatial audio block
MS Project Acoustics
Fully Dolby Atmos, DTS:X, and Windows Sonic
Custom decompression block
HDR
VRR
Up to 4K@120 Hz
Up to 8K@30 Hz
CEC
6 GB GDDR6
192-bit[j]
336
Lockhart
(Xbox Series S)
197 3.4
(3.6 w/o SMT)
1280:80:32
20 CU
1565 4006 50.1 125.2 8 GB GDDR6
128-bit
224
2 GB GDDR6
32-bit
56
Van Gogh
"Aerith"
(Steam Deck)[220]
Dec 2021 163 4 cores
8 threads
2.4-3.5 2 MB 512:32:16
8 CU
1000-1600 1000-1600 16-25.6 32-51.2 Double-rate FP16
Real-time ray tracing
Variable rate shading
16 GB LPDDR5
128-bit
88 64 GB eMMC (PCIe Gen 2 × 1)
256 GB NVMe SSD (PCIe Gen 3 × 4)
512 GB NVMe SSD (PCIe Gen 3 × 4)
microSD card slot
DirectX 9-12 Ultimate, OpenGL 4.6, Vulkan 1.2
Van Gogh
"Sephiroth"(Steam Deck OLED)
Nov 2023 6 nm 131 102 256 GB NVMe SSD (PCIe Gen 3 × 4)
512 GB NVMe SSD (PCIe Gen 3 × 4)
1 TB NVMe SSD (PCIe Gen 3 × 4)
microSD card slot
  1. ^ Unified shaders : Texture mapping units : Render output units
  2. ^ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. ^ Pixel fillrate is calculated as the number of ROPs multiplied by the base (or boost) core clock speed.
  4. ^ Texture fillrate is calculated as the number of TMUs multiplied by the base (or boost) core clock speed.
  5. ^ UHD BD is the only video disc format supporting HDR.
  6. ^ Cache
  7. ^ "Digital" version does not have an optical drive.
  8. ^ Feature preview of Rapid Packed Math, introduced in GCN 5.
  9. ^ Swap
  10. ^ A plain 320-bit 20 GB version could be made by just replacing four 1 GB GDDR6 chips by 2 GB ones.

See also[edit]

Notes[edit]

  1. ^ a b c d e Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

References[edit]

  1. ^ "AMD Announces the 7th Generation APU: Excavator mk2 in Bristol Ridge and Stoney Ridge for Notebooks". May 31, 2016. Retrieved January 3, 2020.
  2. ^ "AMD Mobile "Carrizo" Family of APUs Designed to Deliver Significant Leap in Performance, Energy Efficiency in 2015" (Press release). November 20, 2014. Retrieved February 16, 2015.
  3. ^ "The Mobile CPU Comparison Guide Rev. 13.0 Page 5 : AMD Mobile CPU Full List". TechARP.com. Retrieved December 13, 2017.
  4. ^ a b "AMD VEGA10 and VEGA11 GPUs spotted in OpenCL driver". VideoCardz.com. Retrieved June 6, 2017.
  5. ^ Cutress, Ian (February 1, 2018). "Zen Cores and Vega: Ryzen APUs for AM4 – AMD Tech Day at CES: 2018 Roadmap Revealed, with Ryzen APUs, Zen+ on 12nm, Vega on 7nm". Anandtech. Retrieved February 7, 2018.
  6. ^ Larabel, Michael (November 17, 2017). "Radeon VCN Encode Support Lands in Mesa 17.4 Git". Phoronix. Retrieved November 20, 2017.
  7. ^ a b "AMD Ryzen 5000G 'Cezanne' APU Gets First High-Res Die Shots, 10.7 Billion Transistors In A 180mm2 Package". wccftech. August 12, 2021. Retrieved August 25, 2021.
  8. ^ Tony Chen; Jason Greaves, "AMD's Graphics Core Next (GCN) Architecture" (PDF), AMD, retrieved August 13, 2016
  9. ^ "A technical look at AMD's Kaveri architecture". Semi Accurate. Retrieved July 6, 2014.
  10. ^ "How do I connect three or More Monitors to an AMD Radeon™ HD 5000, HD 6000, and HD 7000 Series Graphics Card?". AMD. Retrieved December 8, 2014.
  11. ^ Airlie, David (November 26, 2009). "DisplayPort supported by KMS driver mainlined into Linux kernel 2.6.33". Retrieved January 16, 2016.
  12. ^ "Radeon feature matrix". freedesktop.org. Retrieved January 10, 2016.
  13. ^ Deucher, Alexander (September 16, 2015). "XDC2015: AMDGPU" (PDF). Retrieved January 16, 2016.
  14. ^ a b Michel Dänzer (November 17, 2016). "[ANNOUNCE] xf86-video-amdgpu 1.2.0". lists.x.org.
  15. ^ "Conformant Products - The Khronos Group Inc". The Khronos Group. Retrieved June 6, 2019.
  16. ^ "Conformant Products - The Khronos Group Inc". The Khronos Group. Retrieved June 6, 2019.
  17. ^ "GPU-Tech.org - Catalyst 11.10 WHQL - First official Battlefield 3 driver for Radeon cards". GPU-Tech.org. October 31, 2011.
  18. ^ "AMD Radeon Software Crimson Edition Beta". AMD. Retrieved April 20, 2018.
  19. ^ "Mesamatrix". mesamatrix.net. Retrieved April 20, 2018.
  20. ^ "RadeonFeature". X.Org Foundation. Retrieved April 20, 2018.
  21. ^ Wallossek, Igor; Woligroski, Don (December 21, 2011). "Graphics Core Next: The Southern Islands Architecture". Tom's Hardware. Retrieved July 26, 2013.
  22. ^ Broekhuijsen, Niels (February 20, 2013). "AMD Clarifies 2013 Radeon Plans". Tom's Hardware. Retrieved July 26, 2013.
  23. ^ "Radeon Vega Frontier Edition". AMD. December 30, 2022. Archived from the original on June 27, 2017. Retrieved July 30, 2017.
  24. ^ "AMD launches A-Series and the first 32nm Athlon II X4 CPUs". Retrieved November 10, 2013.
  25. ^ Theo Valich (May 28, 2012). "AMD Comes Clean on Transistor Numbers With FX, Fusion Processors". Retrieved August 23, 2013.
  26. ^ Anand Lal Shimpi (September 27, 2012). "AMD A10-5800K & A8-5600K Review: Trinity on the Desktop, Part 1". Retrieved August 23, 2013.
  27. ^ a b c d e f g h i j k l m n o p q r s t u v w x y z aa ab ac ad ae af ag ah "Processor Programming Reference (PPR) for AMD Family 17h Model 01h, Revision B1 Processors" (PDF). AMD Technical Documentation. AMD Developer Central: Advanced Micro Devices, Inc. April 15, 2017. p. 25. Retrieved November 1, 2019.
  28. ^ "Trinity Improvements Include Updated Piledriver Cores and VLIW4 GPUs". May 4, 2012. Retrieved November 10, 2013.
  29. ^ a b c "AMD detonates Trinity: Behold Bulldozer's second coming - ExtremeTech". Retrieved October 7, 2017.
  30. ^ "AMD Trinity On The Desktop: A10, A8, And A6 Get Benchmarked!—Trinity: Coming Soon To A Desktop Near You". Retrieved November 10, 2013.
  31. ^ "AMD Trinity for Desktops. Part 1: Graphics Core". X-bit labs. September 27, 2012. Archived from the original on October 11, 2012.
  32. ^ "Review: AMD A10-5800K Dual Graphics evaluation—CPU". October 4, 2012. Retrieved November 10, 2013.
  33. ^ "The AMD A8-3850 Review: Llano on the Desktop". Retrieved November 10, 2013.
  34. ^ "Product Search Results—Bottom Line Telecommunications". Bottom Line Telecommunications Corporation. Retrieved November 10, 2013.
  35. ^ a b "AMD Sempron CPU". Retrieved March 2, 2015.
  36. ^ Альберт Шаповалов (September 10, 2014). "Обзор и тестирование процессора AMD Athlon X2 340". Ru.gecid.com/ (in Russian). Retrieved September 12, 2016.
  37. ^ Hassan Mujtaba. "AMD A10-6800K and A10-6700 "Richland" APU Review". Wccftech. Retrieved March 20, 2020.
  38. ^ a b c "AMD Athlon Processors". Retrieved March 2, 2015.
  39. ^ btarunr (March 23, 2014). "AMD FX-670K CPU Shows Up in the Wild". TechPowerUp.
  40. ^ Anton Shilov (May 30, 2013). "AMD's Next-Gen "Kaveri" APUs Will Require New Mainboards". Archived from the original on June 7, 2013. Retrieved December 17, 2014.
  41. ^ "AMD Godavari core". www.cpu-world.com. Retrieved September 16, 2018.
  42. ^ Joel Hruska. "AMD Kaveri A10-7850K and A8-7600 review: Was it worth the wait for the first true heterogeneous chip?". ExtremeTech. Retrieved March 20, 2020.
  43. ^ a b Hassan Mujtaba (July 4, 2013). "AMD Kaveri APU Architecture Detailed". Retrieved March 15, 2015.
  44. ^ a b "A technical look at AMD's Kaveri architecture". SemiAccurate. January 15, 2014.
  45. ^ a b c "AMD to add ARM processors to boost chip security". June 14, 2012. Retrieved September 3, 2013.
  46. ^ a b c "AMD and ARM Fusion redefine beyond x86". Archived from the original on November 5, 2013. Retrieved November 10, 2013.
  47. ^ a b "Carrizo presentation, page 12 - Carrizo is the 1st ARM Trustzone capable performance APU" (PDF). Retrieved January 13, 2020.
  48. ^ "AMD A10-7850K Graphics Performance". February 14, 2014. Retrieved April 2, 2014.
  49. ^ "AMD A8-7600 Kaveri APU review - The Embedded GPU - HSA & hUMA". January 14, 2014.
  50. ^ Gennadiy Shvets (October 18, 2014). "HP offers desktop PCs with AMD FX-770K Kaveri processor". OFweek. Archived from the original on May 13, 2018. Retrieved March 23, 2016.
  51. ^ "ASRock - FM2+ CPU Support List". asrock.com. Retrieved October 18, 2020.
  52. ^ 电脑维修技术网. "AMD APU A8-7500 CPU怎么样?". pc811.com. Retrieved October 18, 2020.
  53. ^ Hassan Mujtaba (August 26, 2015). "AMD Details Carrizo APUs Energy Efficient Design at Hot Chips 2015 – 28nm Bulk High Density Design With 3.1 Billion Transistors, 250mm2 Die". Wccftech. Retrieved March 20, 2020.
  54. ^ "AMD quietly launches new Carrizo APU: A8-7680 processor". October 26, 2018. Retrieved June 29, 2019.
  55. ^ Cutress, Ian (October 28, 2018). "Day of the Dead: AMD Releases new Carrizo FM2+ APU, the A8-7680". Retrieved June 29, 2019.
  56. ^ Cutress, Ian (September 23, 2016). "AMD 7th Gen Bristol Ridge and AM4 Analysis". Anandtech.com. Retrieved September 23, 2016.
  57. ^ "7th Gen AMD Athlon™ X4 940". AMD.
  58. ^ "7th Gen AMD Athlon™ X4 940". AMD.
  59. ^ "7th Gen AMD Athlon™ X4 940". AMD.
  60. ^ "AMD A6-Series A6-9400 - AD9400AGM23AB / AD9400AGABBOX". CPU-World.
  61. ^ "7th Gen A6-9500E APU". AMD.
  62. ^ "7th Gen AMD PRO A6-9500E APU". AMD.
  63. ^ "7th Gen A6-9500 APU". AMD.
  64. ^ "7th Gen AMD PRO A6-9500 APU". AMD.
  65. ^ "7th Gen A6-9550 APU". AMD.
  66. ^ "7th Gen A8-9600 APU". AMD.
  67. ^ "7th Gen AMD PRO A8-9600 APU". AMD.
  68. ^ "7th Gen A10-9700E APU". AMD.
  69. ^ "7th Gen AMD PRO A10-9700E APU". AMD.
  70. ^ "7th Gen A10-9700 APU". AMD.
  71. ^ "7th Gen AMD PRO A10-9700 APU". AMD.
  72. ^ "7th Gen A12-9800E APU". AMD.
  73. ^ Sang-ho, Lee (September 19, 2016). "AMD Final Heavy Equipment X Carrier ZEN Bristol Ridge A12-9800 platform change". BodNara Korea. Retrieved November 12, 2016.
  74. ^ "7th Gen AMD PRO A12-9800E APU". AMD.
  75. ^ "7th Gen A12-9800 APU". AMD.
  76. ^ "7th Gen AMD PRO A12-9800 APU". AMD.
  77. ^ Cutress, Ian (September 6, 2018). "AMD Announces New $55 Low-Power Processor: Athlon 200GE". AnandTech. Retrieved November 14, 2023.
  78. ^ a b Shilov, Anton (December 21, 2018). "AMD Athlon 220GE and Athlon 240GE with Radeon Vega Graphics Launched". AnandTech. Retrieved November 14, 2023.
  79. ^ Armasu, Lucian (November 19, 2019). "AMD's Unlocked Athlon 3000G APU Starts Shipping at $49". Tom's Hardware. Retrieved November 14, 2023.
  80. ^ "HP Desktop Pro A G2 Specifications". HP Customer Support. Retrieved December 23, 2022.
  81. ^ a b Schiesser, Tim (January 8, 2018). "AMD's 2nd-gen Ryzen is coming in April, desktop Ryzen APUs arrive February 12". TechSpot. Retrieved June 10, 2019.
  82. ^ "AMD Athlon Desktop Processors with Radeon Graphics". AMD. Archived from the original on July 29, 2020. Retrieved November 16, 2023.
  83. ^ "AMD Athlon PRO Desktop Processor". AMD. Archived from the original on July 29, 2020. Retrieved November 16, 2023.
  84. ^ "AMD Ryzen PRO Desktop Processor". AMD. Archived from the original on July 29, 2020. Retrieved November 16, 2023.
  85. ^ a b Cutress, Dr.Ian (June 10, 2019). "AMD Ryzen 3000 APUs: Up to Vega 11, More MHz, Under $150, Coming July 7th". AnandTech. Retrieved November 16, 2023.
  86. ^ "AMD Spring 2022 Ryzen Desktop Processor Update Includes Six New Models Besides 5800X3D". TechPowerUp. March 16, 2022. Retrieved March 8, 2024.
  87. ^ "AMD Ryzen 3 PRO 4350GE". AMD. Retrieved October 18, 2022.
  88. ^ "AMD Ryzen 3 PRO 4350G". AMD. Retrieved October 18, 2022.
  89. ^ "AMD Ryzen 3 PRO 4650GE". AMD. Retrieved October 18, 2022.
  90. ^ "AMD Ryzen 3 PRO 4650G". AMD. Retrieved October 18, 2022.
  91. ^ "AMD Ryzen 3 PRO 4750GE". AMD. Retrieved October 18, 2022.
  92. ^ "AMD Ryzen 3 PRO 4750G". AMD. Retrieved October 18, 2022.
  93. ^ "AMD Ryzen 4000 Series Desktop Processors with AMD Radeon Graphics Set to Deliver Breakthrough Performance for Commercial and Consumer Desktop PCs". AMD. July 21, 2020. Retrieved October 18, 2022.
  94. ^ a b Wallossek, Igor (January 8, 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved January 9, 2024.
  95. ^ "AMD Ryzen 3 PRO 5350GE". AMD.
  96. ^ "AMD Ryzen 3 PRO 5350G". AMD.
  97. ^ "AMD Ryzen 5 PRO 5650GE". AMD.
  98. ^ "AMD Ryzen 5 PRO 5650G". AMD.
  99. ^ "AMD Ryzen 7 PRO 5750GE". AMD.
  100. ^ "AMD Ryzen 7 PRO 5750G". AMD.
  101. ^ btarunr (June 1, 2021). "AMD Announces Ryzen 5000G and PRO 5000G Desktop Processors". TechPowerUp.
  102. ^ "AMD Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023.
  103. ^ AMD Provides More Ryzen 9 7950X3D Details. PC World. January 5, 2023 – via YouTube.
  104. ^ a b c "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD (Press release). January 4, 2023. Retrieved January 5, 2023.
  105. ^ WhyCry (July 23, 2023). "AMD Ryzen 5 7500F reviews are out, CPU to launch globally at $179". VideoCardz.com. Retrieved July 23, 2023.
  106. ^ "AMD Opteron X1150 - OX1150IPJ44HM". CPUWorld. Retrieved November 13, 2023.
  107. ^ "AMD Launches the AMD Opteron X-Series Family: the Industry's Highest Performance Small Core x86 Server Processors". AMD (Press release). May 29, 2013. Retrieved November 13, 2023.
  108. ^ Kennedy, Patrick (June 5, 2017). "New HPE ProLiant MicroServer Gen10 Powered by AMD Opteron X3000 APUs". Retrieved June 5, 2017.
  109. ^ a b c d "Opteron Family". AMD. Archived from the original on May 20, 2017. Retrieved June 5, 2017.
  110. ^ "AMD Opteron X3216 - OX3216AAY23KA". CPUWorld. Retrieved November 13, 2023.
  111. ^ "AMD Opteron X3418 - OX3418AAY43KA". CPUWorld. Retrieved November 13, 2023.
  112. ^ "AMD Opteron X3421 - OX3421AAY43KA". CPUWorld. Retrieved November 13, 2023.
  113. ^ a b "AMD lists A8-4557M and A10-4657M mobile APUs". www.cpu-world.com. Retrieved September 17, 2018.
  114. ^ "AMD intros 35W Richland mobile APUs". March 12, 2013. Retrieved November 10, 2013.
  115. ^ Poeter, Damon. (March 12, 2013) AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion
  116. ^ "AMD Kaveri APU with SteamrollerB Core Features 20% CPU and 30% GPU Performance Uplift over Richland – Platform Details Unveiled | TechNationNews.com". Archived from the original on December 3, 2013. Retrieved November 26, 2013.
  117. ^ a b Cutress, Ian (June 1, 2016). "AMD Announces 7th Generation APU". Anandtech.com. Retrieved June 1, 2016.
  118. ^ "AMD A10-9620P SoC - Benchmarks and Specs". Notebookcheck.net. Retrieved July 20, 2018.
  119. ^ "AMD A12-9720P SoC - Benchmarks and Specs". Notebookcheck.net. Retrieved July 20, 2018.
  120. ^ "HP Pavilion 17 - HP® Official Store". Store.hp.com. Retrieved July 20, 2018.
  121. ^ "AMD Ryzen 7 3780U Microsoft Surface® Edition".
  122. ^ "AMD Ryzen 7 3750H Mobile Processor with Radeon RX Vega 10 Graphics".
  123. ^ "AMD Radeon RX Vega 10 Mobile Specs | TechPowerUp GPU Database". Techpowerup.com.
  124. ^ "AMD Ryzen 7 3700C".
  125. ^ "AMD Ryzen 7 3700U Mobile Processor with Radeon RX Vega 10 Graphics".
  126. ^ "AMD Ryzen 5 3580U Microsoft Surface® Edition".
  127. ^ "AMD Ryzen 5 3550H Mobile Processor with Radeon Vega 8 Graphics". Retrieved January 8, 2018.
  128. ^ "AMD Radeon Vega 8 Specs | TechPowerUp GPU Database". Techpowerup.com.
  129. ^ "AMD Ryzen 5 3500C".
  130. ^ "AMD Ryzen 5 3500U Mobile Processor with Radeon Vega 8 Graphics".
  131. ^ "AMD Ryzen 5 3450U Processor".
  132. ^ "AMD Ryzen 3 3350U". AMD.
  133. ^ "AMD Radeon Vega 6 Mobile Specs | TechPowerUp GPU Database". Techpowerup.com.
  134. ^ "AMD Ryzen 3 3300U Mobile Processor with Radeon Vega 6 Graphics". Retrieved January 6, 2019.
  135. ^ "AMD Ryzen 3 PRO 3300U Mobile Processor with Radeon Vega 6 Graphics".
  136. ^ "AMD Ryzen 5 PRO 3500U Mobile Processor with Radeon Vega 8 Graphics".
  137. ^ "AMD Ryzen 7 PRO 3700U Mobile Processor with Radeon Vega 10 Graphics".
  138. ^ Cutress, Ian (January 6, 2020). "AMD Ryzen 4000 Mobile APUs: 7nm, 8-core on both 15W and 45W, Coming Q1". anandtech.com. AnandTech. Retrieved January 7, 2020.
  139. ^ Alcorn, Paul (January 7, 2020). "AMD Launches Threadripper 3990X and Ryzen 4000 'Renoir' APUs". tomshardware.com. Tom's Hardware. Retrieved January 7, 2020.
  140. ^ Gartenberg, Chaim (January 6, 2020). "AMD's 7nm Ryzen 4000 CPUs are here to take on Intel's 10nm Ice Lake laptop chips". theverge.com. The Verge. Retrieved January 7, 2020.
  141. ^ "AMD "Renoir" die Shot Pictured". March 16, 2020. Archived from the original on December 9, 2020. Retrieved June 25, 2021.
  142. ^ "AMD Ryzen 5 4600HS". AMD. Retrieved November 10, 2023.[permanent dead link]
  143. ^ "AMD Ryzen 5 4600HS Mobile processor". CPUWorld. Retrieved November 10, 2023.
  144. ^ "AMD Ryzen 7 4600HS Laptop Processor". Notebookcheck. Retrieved November 10, 2023.
  145. ^ "AMD Ryzen 5 5500U Specs". TechPowerUp. Retrieved September 17, 2021.
  146. ^ "AMD Ryzen 7 5800U". AMD.
  147. ^ "AMD Ryzen 5 5600U". AMD.
  148. ^ "AMD Ryzen 5 5560U". AMD.
  149. ^ "AMD Ryzen 3 5400U". AMD.
  150. ^ "AMD Ryzen 3 5400U Mobile processor - 100-000000288". CPU-World. Retrieved September 17, 2021.
  151. ^ "AMD Ryzen 3 PRO 5450U". AMD.
  152. ^ "AMD Ryzen 5 PRO 5650U". AMD.
  153. ^ "AMD Ryzen 7 PRO 5850U". AMD.
  154. ^ "AMD Ryzen 9 5980HX". AMD.
  155. ^ "AMD Ryzen 9 5980HS". AMD.
  156. ^ "AMD Ryzen 9 5900HX". AMD.
  157. ^ "AMD Ryzen 9 5900HS". AMD.
  158. ^ "AMD Ryzen 7 5800H". AMD.
  159. ^ "AMD Ryzen 7 5800H Specs". TechPowerUp. Retrieved September 17, 2021.
  160. ^ "AMD Ryzen 7 5800HS". AMD.
  161. ^ "AMD Ryzen 5 5600H". AMD.
  162. ^ "AMD Ryzen 5 5600H Mobile processor - 100-000000296". CPU-World. Retrieved September 17, 2021.
  163. ^ "AMD Ryzen 5 5600HS". AMD.
  164. ^ "AMD Ryzen 7 5825U". AMD.
  165. ^ "AMD Ryzen 5 5625U". AMD.
  166. ^ "AMD Ryzen 3 5125C". AMD.
  167. ^ "AMD Ryzen 3 PRO 5475U". AMD.
  168. ^ "AMD Ryzen 5 PRO 5675U". AMD.
  169. ^ "AMD Ryzen 7 PRO 5875U". AMD.
  170. ^ "AMD Ryzen 3 5425C". AMD.
  171. ^ "AMD Ryzen 5 5625C". AMD.
  172. ^ "AMD Ryzen 7 5825C". AMD.
  173. ^ "AMD Unveils New Ryzen Mobile Processors Uniting "Zen 3+" core with AMD RDNA 2 Graphics in Powerhouse Design". AMD.
  174. ^ "AMD Ryzen 5 PRO 6650U". AMD.
  175. ^ "AMD Ryzen 5 PRO 6650H". AMD.
  176. ^ "AMD Ryzen 5 PRO 6650HS". AMD.
  177. ^ "AMD Ryzen 7 PRO 6850U". AMD.
  178. ^ "AMD Ryzen 7 PRO 6850H". AMD.
  179. ^ "AMD Ryzen 7 PRO 6850HS". AMD.
  180. ^ "AMD Ryzen 9 PRO 6950H". AMD.
  181. ^ "AMD Ryzen 9 PRO 6950HS". AMD.
  182. ^ a b c Shimpi, Anand Lal. "Previewing AMD's Brazos, Part 1: More Details on Zacate/Ontario and Fusion". Anandtech.com. Retrieved July 20, 2018.
  183. ^ "Archived copy". Archived from the original on May 27, 2015. Retrieved May 26, 2015.{{cite web}}: CS1 maint: archived copy as title (link)
  184. ^ "HP ProDesk 405 G2 Microtower-PC". Retrieved February 24, 2015.
  185. ^ Cutress, Ian. "AMD's Carrizo-L APUs Unveiled: 12-25W Quad Core Puma+". Anandtech.com. Retrieved July 20, 2018.
  186. ^ "HP Pavilion Desktops - HP® Official Store". Store.hp.com. Retrieved July 20, 2018.
  187. ^ "AMD Radeon Vega 3 Mobile Specs". TechPowerUp. Retrieved April 25, 2023.
  188. ^ "AMD Athlon™ Gold 7220U". AMD.
  189. ^ "AMD Ryzen 7020 Series Processors for Mobile Bring High-End Performance and Long Battery Life to Everyday Users". September 20, 2022. Retrieved September 21, 2022.
  190. ^ "AMD Athlon™ Silver 7120U". AMD.
  191. ^ "AMD Athlon Gold 7220C". AMD.
  192. ^ "AMD Athlon Silver 7120C". AMD.
  193. ^ "Welcome to AMD - Processors - Graphics and Technology - AMD". Amd.com. Retrieved July 20, 2018.
  194. ^ "Embedded Products - High Performance GPU - AMD". Amd.com. Retrieved July 20, 2018.
  195. ^ https://www.amd.com/Documents/I-Family-Product-Brief.pdf[bare URL PDF]
  196. ^ https://store.hp.com/us/en/pdp/hp-t630-thin-client-p-2zv00at-aba-1?pStoreID=epp[dead link]
  197. ^ "AMD G-Series GX-420GI - GE420GAAY43KA". Cpu-world.com. July 6, 2022. Retrieved August 22, 2022.
  198. ^ https://www.amd.com/Documents/J-Family-Product-Brief.pdf[bare URL PDF]
  199. ^ https://www.amd.com/Documents/2nd_Gen_Rseries_Product_Brief.pdf[bare URL PDF]
  200. ^ https://www.amd.com/Documents/merlin-falcon-product-brief.pdf[bare URL PDF]
  201. ^ a b c d "Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD.
  202. ^ "AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency". AMD.
  203. ^ "AMD Establishes Semi-Custom Business Unit to Create Tailored Products with Customer-Specific IP". Archived from the original on October 1, 2013. Retrieved November 10, 2013.
  204. ^ "Three for three: How AMD won the war for the heart of next-gen consoles". Polygon. June 15, 2013. Retrieved November 10, 2013.
  205. ^ MACHKOVECH, SAM (August 2, 2016). "Microsoft hid performance boosts for old games in Xbox One S, told no one". Ars Technica. Retrieved August 2, 2016.
  206. ^ Walton, Mark (August 10, 2016). "PS4 Neo: Sony confirms PlayStation event for September 7". Ars Technica. Retrieved August 10, 2016.
  207. ^ Walton, Mark (April 19, 2016). "Sony PS4K is codenamed NEO, features upgraded CPU, GPU, RAM—report". Ars Technica. Retrieved August 10, 2016.
  208. ^ Smith, Ryan (September 8, 2016). "Analyzing Sony's Playstation 4 Pro Hardware Reveal: What Lies Beneath". Anandtech. Retrieved September 8, 2016.
  209. ^ Freedman, Andrew (November 3, 2017). "Xbox One X vs. PlayStation 4 Pro: Which Powerhouse Should You Get?". Tom's Guide. Retrieved November 3, 2017.
  210. ^ "PS4 Pro's additional RAM frees up memory for game developers". Polygon. Retrieved November 23, 2018.
  211. ^ http://www.anandtech.com/show/11536/microsofts-project-scorpio-get-a-launch-date-xbox-one-x-499-november-7th
  212. ^ https://arstechnica.com/gaming/2017/04/xbox-scorpio-hardware-specs/
  213. ^ Cutress, Ian (August 21, 2017). "Hot Chips: Microsoft Xbox One X Scoprio Engine Live Blog". Anandtech. Retrieved August 21, 2017.
  214. ^ Cutress, Ian (August 3, 2018). "AMD Creates Quad Core Zen SoC with 24 Vega CUs for Chinese Consoles". Anandtech.
  215. ^ Cutress, Ian (August 6, 2018). "More Details About the ZhongShan Subor Z+ Console, with Custom AMD Ryzen SoC". Anandtech.
  216. ^ Leadbetter, Richard (September 15, 2018). "Hands-on with the Subor Z-Plus: AMD tech tested in new Chinese console". Retrieved October 28, 2018.
  217. ^ Judd, Will (May 16, 2019). "The Subor Z+ console team has disbanded - but it's not game over yet". Gamer Network.
  218. ^ Leadbetter, Leadbetter (September 15, 2018). Hands-On: Subor Z Plus Chinese PC/Console Hybrid - Ryzen+Vega AMD Analysis!. Eurogamer. Event occurs at 2 minutes 2 seconds. Retrieved October 28, 2018.
  219. ^ Smith, Ryan (April 16, 2019). "Sony Teases Next-Gen PlayStation: Custom AMD Chip with Zen 2 CPU & Navi GPU, SSD Too". Anandtech.
  220. ^ "Tech Specs". steamdeck.com. Retrieved July 18, 2021.

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