Flying probe

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Flying probe test systems are often used for testing Low to Mid volume production, NPI, prototypes and, boards that present accessibility problems. Flying probe testing uses electro-mechanically controlled probes to access components on printed circuit assemblies (PCAs). Commonly used for test of analog components, analog signature analysis, and short/open circuits. They can be classified as in-circuit test (ICT) systems or as Manufacturing Defects Analyzers (MDAs). They provide an alternative to the bed-of-nails technique for contacting the components on printed circuit boards. The precision movement can probe points on PLCCs, SOICs, PGAs, SSOPs, QFPs and others, without any expensive fixturing or programming required.



  • Lower cost than standard "Bed Of Nails" ICT (In-Circuit Test), because no fixturing is required
  • Provides access to components that cannot be accessed in an ICT fixture because of the accuracy of the probing techniques
  • TTM (Time-To-Market) Fast time to first test, because of fast development cycle
  • Increased fault coverage and defect detection over other test techniques

Accuracy of a Robotic Mechanism and considerations[edit]

Whenever you consider contacting small test points, unfilled via copper, and/or SMT device leads, consideration must be made to the accuracy of the robotic system that is deployed in the flying probe tester that is available. Understanding the real specifications can often be misunderstood by new users of such robotic systems.


Acculogic Inc.(

Digitaltest, Inc. (

Seica (


Takaya (