|Founded||March 2, 2009|
|Headquarters||Santa Clara, California, U.S.|
|Thomas Caulfield (CEO)|
|Revenue||US $5.5 billion (2016)|
Number of employees
GlobalFoundries is an American semiconductor foundry headquartered in Santa Clara, California, United States. GlobalFoundries was created by the divestiture of the manufacturing arm of Advanced Micro Devices (AMD) on March 2, 2009, expanded through the acquisition of Chartered Semiconductor on January 23, 2010, and further expanded through the acquisition of IBM Microelectronics on July 1, 2015. The Emirate of Abu Dhabi is the owner of the company through its subsidiary Advanced Technology Investment Company (ATIC). On March 4, 2012, AMD announced they divested their final 14% stake in the company, which concluded AMD's multi-year plan to divest its manufacturing arm.
The firm manufactures integrated circuits in high volume mostly for semiconductor companies such as AMD, Broadcom, Qualcomm, and STMicroelectronics. It has five 200 mm wafer fabrication plants in Singapore, one 300 mm plant each in Germany and Singapore, and three plants in the United States: one 200 mm plant in Vermont (where it is the largest private employer) and two 300 mm plants in New York.
- 1 Overview
- 2 Fabrication facilities
- 3 Mergers and acquisitions
- 4 Process technologies
- 5 See also
- 6 References
- 7 External links
As of 2015, the firm owned ten fabrication plants. Fab 1 is in Dresden, Germany. Fabs 2 through 7 are in Singapore. Fabs 8 through 10 are in the northeast United States. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, India, the United States, Germany, and the United Kingdom. In Feb 2017, the company announced a new 300 Fab [Fab 11] in China for growing semiconductor market in China.
|Fab 1||300 mm||Dresden, Germany|
|Fab 2||200 mm||Woodlands, Singapore|
|Fab 3/5||200 mm||Woodlands, Singapore|
|Fab 3E||200 mm||Tampines, Singapore|
|Fab 6||200 mm||Woodlands, Singapore|
|Fab 7||300 mm||Woodlands, Singapore|
|Fab 8||300 mm||Luther Forest Technology Campus, Saratoga County, New York, United States|
|Fab 9||200 mm||Essex Junction, Vermont, United States|||
|Fab 10||300 mm||East Fishkill, New York, United States|
|Fab 11||300 mm||Chengdu, China|
300 mm fabrication facilities
Fab 1, located in Dresden, Germany, is a 364,512 m2 plant which was transferred to GlobalFoundries on its inception: Fab 36 and Fab 38 were renamed Module 1 and Module 2, respectively. Each module can produce 25,000 300 mm diameter wafers per month.
Module 1 is a 300 mm wafer production facility. It is capable of manufacturing wafers at 40nm, 28 nm BULK and 22 nm FDSOI. Module 2 was originally named "(AMD) Fab 30" and was a 200 mm fab producing 30,000 Wafer Outs Per Month, but has now been converted into a 300 mm wafer fab. Together they have a maximum full capacity of 80,000 of 300 mm wafers/month. (180,000 200 mm wafers/month equivalent), using technologies of 45 nm and below.
In September 2016, GlobalFoundries announced Fab 1 would be refit to produce 12 nm fully depleted silicon on insulator (FDSOI) products. The company expected customer's products would begin to tape out in the first half of 2019.
Fab 7, located in Woodlands, Singapore, is an operational 300 mm Fab, originally owned by Chartered Semiconductor. It produces wafers at 130 nm to 40 nm on bulk CMOS and SOI processes. It has a maximum full capacity of 50,000 300 mm wafers/month (112,500 200 mm wafers/month equivalent), using 130 to 40 nm technology.
Fab 8, located in Luther Forest Technology Campus, Saratoga County, New York, United States is a 300 mm fab. This fabrication plant was constructed by GF as a green field fab for advanced technologies. It is capable of manufacturing 14 nm node technology. The plant's construction began in July 2009 and the company started mass production in 2012. It has a maximum manufacturing capacity of 60,000 of 300 mm wafers/month, or the equivalent of over 135,000 of 200 mm wafers/month. In September 2016, GlobalFoundries announced it would make a multibillion-dollar investment to refit Fab 8 to produce 7 nm FinFET parts starting in the second half of 2018. The process was planned to initially use deep ultraviolet lithography, and eventually transition to extreme ultraviolet lithography.
- Technology: 28 nm and 14 nm. 7 nm planned. However, in August 2018, GlobalFoundries made the decision to suspend 7 nm development and planned production, citing the unaffordable costs to outfit Fab 8 for 7nm production. Globalfoundries held open the possibility of resuming 7nm operations in the future if additional resources could be secured. From this decision Globalfoundries executed a shift in company strategy to focus more effort on FD-SOI manufacturing and R&D. Fab 8 serves a crucial function to supply AMD (Advanced Micro Devices) with CPU Wafers for its Zen line of microprocessors used in the Ryzen, Threadripper and Epyc lines of CPUs. The original Zen and the Zen+ CPUs are of a monolithic design which were produced at Global Foundries Malta Facilities. Going forward AMD will pursue a multiple Chiplet Design with the Zen 2 microprocessor. The Zen 2 will consist of a 14/12nm manufactured IO die surrounded by a number of 7nm Core dies. When Global Foundries announced the suspension of 7nm operations AMD executed a shift in plans transferring production of the 7nm core dies to TSMC (Taiwan Semiconductor Corporation). There was speculation in some quarters as to where manufacture of the Core Dies would take place. In AMD's 2018 4th Quarter Financial Conference call which took place on January 29, 2019 AMD CEO Lisa Su announced the WSA (Wafer Supply Agreement) governing production and acquisition by AMD from Globalfoundries had been amended for the 7th time. The amendment stated AMD would continue to procure 12nm node and above from Global Foundries while giving AMD latitude to purchase 7nm node manufactured wafers from any source free from paying any royalties. The agreement will run through 2024 and insures that Global Foundries will have work for its Malta plant for that time period. Pricing commitments for Wafers runs through 2021 when it is likely the WSA will be amended again.
Fab 10, located in East Fishkill, New York, United States, was previously known as IBM Building 323. It became part of GlobalFoundries operations with the acquisition of IBM Microelectronics. It currently manufactures technology down to the 14 nm node.
200 mm fabrication facilities
Fab 2, located in Woodlands, Singapore. This fab is capable of manufacturing wafers at 600 to 350 nm for use in selected automotive IC products, High Voltage power management IC and Mixed-signal products.
Fab 3/5, located in Woodlands, Singapore. This fab is capable of manufacturing wafers at 350 to 180 nm for use in high voltage IC's for small panel display drivers and mobile power management modules.
Fab 3E, located in Tampines, Singapore. This fab produces 180 nm wafers for use in selected automotive IC products, High Voltage power management IC and Mixed-Signal products with embedded non-volatile memory technology.
Fab 6, located in Woodlands, Singapore. This fab is a full copper fab that is capable of highly integrated CMOS and RFCMOS products for applications such as Wi-Fi / Bluetooth at 180 to 110 nm processes.
Fab 6 is now closed it was replaced with a 300mm line called Fab 7
Fab 9, located in the village of Essex Junction, Vermont, United States, near Vermont's largest city of Burlington, became part of GlobalFoundries operations with the acquisition of IBM Microelectronics. The fab manufactures technologies down to the 90 nm node and is the largest private employer within the state of Vermont. The site also hosts a captive mask shop, with development efforts down to the 7 nanometer node.
Mergers and acquisitions
Merger with Chartered Semiconductor
The majority investor of GlobalFoundries, Abu Dhabi's Advanced Technology Investment Co., announced on September 6, 2009, that it has agreed to acquire Singapore-based Chartered Semiconductor Manufacturing Co. Ltd., for a total of $3.9 billion, with Chartered's operations being folded into GlobalFoundries.
Acquisition of IBM's chip-manufacturing unit
In October 2014, GlobalFoundries received US$1.5 billion from IBM to accept taking over IBM's chip-manufacturing business unit, including a 200 mm fab (now Fab 9) in Essex Junction, Vermont, and a 300 mm fab (now Fab 10) in East Fishkill, New York. As part of the agreement, GlobalFoundries will be the sole provider of IBM's server processor chips for the next 10 years. The deal closed on July 1, 2015. IBM-India employees who moved over to GlobalFoundries as part of the acquisition are now part of its Bangalore office.
|Node name||ITRS node (nm)||Date introduced||Wafer size (mm)||Lithography (wavelength)||Gate pitch (nm)||Metal 1 pitch (nm)||SRAM bit density (µm²)|
|14LPP||14||2016||300 Bulk||Immersion UV||78||64||0.09|
|12LP||14||2018||300 Bulk||Immersion UV||-||-||-|
|12FDX||14||2018||300 FD-SOI||Immersion UV||-||-||-|
- "Following Significant Technology, Capacity and Expansion Milestones, GLOBALFOUNDRIES' Sanjay Jha to Pass Baton to Industry Veteran Tom Caulfield". 9 March 2018.
- "". January 13, 2017. Retrieved February 3, 2017.
- "GLOBALFOUNDRIES Fast Facts". Retrieved 6 August 2015.
- By Nathan Donato-Weinstein, Silicon Valley Business Journal. "GlobalFoundries moving HQ to Santa Clara, leases 165K sq. ft. building". March 12, 2013. Retrieved May 2, 2016.
- Shimpi, Anand Lal. "GlobalFoundries Granted Independence, Acquires Remaining Stake from AMD". AnandTech. Retrieved 8 December 2012.
- "Manufacturing". Retrieved 6 August 2015.
- "GLOBALFOUNDRIES Unveils Industry's First 28nm Signoff-Ready Digital Design Flows" (Press release). 13 January 2011.
- "globalfoundries-to-expand-capacities-build-a-fab-in-china" (Press release). 11 February 2017.
- D'Ambrosio, Dan (2015-07-01). "GlobalFoundries takes over in Essex Junction". Burlington Free Press.
the sprawling manufacturing campus on Robinson Parkway in Essex Junction
- "404". Retrieved 6 August 2015.
- Kampman, Jeff (8 September 2016). "GlobalFoundries adds a 12-nm node to its FD-SOI roadmap". TechReport. Retrieved 16 September 2016.
- GlobalFoundries Saratoga County, New York, USA Archived 10 March 2009 at the Wayback Machine
- Shilov, Anton (3 October 2016). "GlobalFoundries Updates Roadmap". Anandtech. Retrieved 3 October 2016.
- Kampman, Jeff (15 September 2016). "GlobalFoundries skips the 10-nm node on the way to 7-nm FinFETs". TechReport. Retrieved 16 September 2016.
- "GlobalFoundries Stops All 7nm Development". AnandTech. Retrieved 28 August 2018.
- "Jim Doyle". Retrieved 6 August 2015.
- "globalfoundries-to-expand-capacities-build-a-fab-in-china" (Press release). 11 February 2017.
- Bolaji Ojo, EE Times. “ATIC to buy, fold Chartered into GlobalFoundries.” September 7, 2009. Retrieved August 10, 2015.
- By Alex Barinka and Alan King, Bloomberg. “IBM to Pay Globalfoundries $1.5 Billion to Take Chip Unit.” October 20, 2014. Retrieved August 10, 2015.
- "Worldwide Locations". GLOBALFOUNDRIES. 2016-10-28. Retrieved 2017-09-19.
- GlobalFoundries Press Release "". Retrieved March 7, 2018.