Qualcomm's Kryo is the brand name of a series of custom or semi-custom ARM-based CPUs. These CPUs implement the ARMv8-A 64-bit instruction set, and serve as the successor to the older 32-bit Krait core.
First announced in September 2015 and used in the Snapdragon 820 SoC. The Kryo cores can be used in both parts of the big.LITTLE configuration, where two dual-core clusters (in the case of Snapdragon 820 and 821) run at different clock frequency, similar to how both Cortex-A53 clusters work in the Snapdragon 615.
The Kryo in the 820/821 is an in-house custom ARMv8.0-A (AArch64/AArch632) design and not based on an ARM Cortex design.
- 820: 2x Kryo Performance @ 2.15GHz + 2x Kryo Efficiency @ 1.59GHz
- 821: 2x Kryo Performance @ 2.34GHz + 2x Kryo Efficiency @ 2.19GHz
- 32 KB L1i + 24 KB L1d cache
- 1 MB L2 cache (Performance cluster) and 512 KB L2 cache for (Efficiency cluster)
- Samsung 14nm LPP Process
- Performance core+L2 die size: 2.79mm2
Kryo 2xx Series
The Kryo 2xx Series CPUs is not a derivative of the original Kryo microarchitecture, but rather is a semi-custom design licensed under ARM’s Built on ARM Cortex Technology (BoC) license . The Kryo 2xx Series CPUs is derivative of the ARM's Cortex-A73 for the Performance/Gold cluster and Cortex-A53 for the Efficiency/Silver cluster in a big.LITTLE arrangement.
The Kryo 280 CPU was announced along with the Snapdragon 835 Mobile Platform in November 2016. Compared to the original Kryo the new Kryo 280 core has improved integer instructions per clock but lower floating point instructions per clock. However overall the 835 was praised by reviewers for offering significant performance and efficiency advantage compared to the 820 and Exynos 8895 largely due to improvements in CPU scheduling and DVFS systems.
- 835: 4x Kryo 280 Performance @ 2.45GHz + 4x Kryo 280 Efficiency @ 1.90GHz
- 2 MB L2 cache (performance cluster) and 1 MB L2 cache (efficiency cluster)
- Samsung 10nm LPE Process
The Kryo 260 CPU was announced along with the Snapdragon 660 Mobile Platform for mid-range smartphone in May 2017. The Kryo 260 cores are also used in the Snapdragon 636 and Snapdragon 665.
- 665: 4x Kryo 260 Gold @ 2.0GHz + 4x Kryo 260 Silver @ 1.8GHz
- 660: 4x Kryo 260 Performance @ 2.2GHz + 4x Kryo 260 Efficiency @ 1.8GHz
- 636: 4x Kryo 260 Performance/Gold @ 1.8GHz + 4x Kryo 260 Efficiency/Silver @ 1.6GHz
- 2 MiB L2 cache for Performance/Gold and 1 MiB L2 cache for Efficiency/Silver cores
- 660/636: Samsung 14LPP Process
- 665: Samsung 11nm LPP Process
Kryo 250 CPU was introduced in the Snapdragon 632 Mobile Platform, announced in June 2018. Also built on a 14 nm process, it is similar to Kryo 260, with a few differences in the size for L2 cache. Qualcomm claims it has an increased performance of 40% compared to the Snapdragon 625, which only uses Cortex-A53 cores.
Kryo 3xx Series
The Kryo 3xx Series CPUs features semi-custom Gold and Silver cores derivative of Arm's Cortex-A75 and Cortex-A55 respectively, arranged in configurations with DynamIQ. These are Qualcomm's first CPUs to support ARMv8.2-A and DynamIQ. DynamIQ allows for more flexibility in CPU configuratoin including the amounts of cores/cache in each CPU clusters.
The Kryo 385 core was announced as a part of the Snapdragon 845 in December 2017. Qualcomm expected 25–30% increased performance in task run on the high-performance cores, and 15% increase on efficiency cores, relative to the Snapdragon 835. Testing found significant advantages in performance and efficiency compared with the Exynos 8895 and 9810. The Kryo 385 is also used in the Snapdragon 850.
- 845: 4x Kryo 385 Gold @ 2.8GHz + 4x Kryo 385 Silver @ 1.8GHz
- 850: 4x Kryo 385 Gold @ 2.95GHz + 4x Kryo 385 Silver @ 1.8GHz
- 4x256KB L2 cache for Gold and 4x128KB L2 cache for Silver
- 2MB L3 in DSU @ 1478MHz and 3MB system cache
- Samsung 10nm LPP Process
- CPU die size: 11.39mm²
- Gold core+L2 die size: 1.57mm²
- Silver core+L2 die size: ~0.53mm²
The Kryo 360 is Qualcomm's upper mid-range semi-custom core. It was introduced in Snapdragon 710, announced in May 2018. The Kryo 360 is also used in the Snapdragon 670 and 712.
- 712: 2x Kryo 360 Gold @ 2.3GHz + 6x Kryo 360 Silver @ 1.7GHz
- 710: 2x Kryo 360 Gold @ 2.2GHz + 6x Kryo 360 Silver @ 1.7GHz
- 670: 2x Kryo 360 Gold @ 2.0GHz + 6x Kryo 360 Silver @ 1.7GHz
- Samsung 10nm LPP Process
Kryo 4xx Series
The Kryo 4xx Series CPUs features semi-custom Gold Prime/Gold and Silver cores derivative of ARM's Cortex-A76 and Cortex-A55 respectively, arranged in configurations with DynamIQ. Qualcomm reveal their semi-custom Cortex-A76 have larger out-of-order execution window (reorder buffer) and data prefetchers more optimised in floating point workloads.
The Kryo 495 CPU was announced with the Snapdragon 8cx on 6 December 2018. Qualcomm claims the 8cx is 60% more efficient than the Snapdragon 850.
- 8cx: 4x Kryo 495 "performance" + 4x Kryo 495 "efficiency" 
- 8cx: Total of 10MB L3 and system level cache 
- TSMC 7nm CLN7FF (N7) Process 
The Kryo 485 CPU was announced with the Snapdragon 855 on 5 December 2018. Qualcomm claim up to 45% increase in performance compared to 845's Kryo 385. Testing found the 855 outperformed the 845 by 51% in SPECint2006, 61% in SPECfp2006 and 39% in power efficiency. The 855 also is significantly more efficient than the Exynos 9820.
- 855: 1x Kryo 485 Gold Prime @ 2.84GHz + 3x Kryo 485 Gold @ 2.42GHz + 4x Kryo 485 Silver @ 1.80GHz
- 855: 1x512KB pL2 cache for Gold Prime, 3x256KB pL2 cache for Gold and 4x128KB pL2 cache for Silver
- 855: 2MB sL3 cache @ 1612MHz and 3MB system level cache
- TSMC 7nm CLN7FF (N7) Process
The Kryo 470 CPU is Qualcomm's upper mid-range semi-custom core. It was introduced in April 2019 in the Snapdragon 730 and 730G.
- 730/730G: 2x Kryo 470 Gold @ 2.2GHz + 6x Kryo 470 Silver @ 1.8GHz
- 1MB system level cache
- Samsung 8nm LPP Process
The Kryo 460 CPU is Qualcomm's mid-range semi-custom core. It was introduced in October 2018 in the Snapdragon 675.
- 675: 2x Kryo 460 Gold @ 2.0GHz + 6x Kryo 460 Silver @ 1.7GHz
- 256KB L2 cache for Gold and 64KB L2 cache for Silver cores
- 1MB system level cache
- Samsung 11nm LPP Process
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