LGA 1151

From Wikipedia, the free encyclopedia
Jump to navigation Jump to search
LGA 1151
Type LGA
Contacts 1151
Processors
Predecessor LGA 1150
Memory support

This article is part of the CPU socket series

LGA 1151,[1] also known as Socket H4, is an Intel microprocessor compatible socket which comes in two distinct versions: the first revision which supports both Intel's Skylake[2] and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively.

LGA 1151 is designed as a replacement for the LGA 1150 (known as Socket H3). LGA 1151 has 1151 protruding pins to make contact with the pads on the processor. The Fully Integrated Voltage Regulator, i.e. a voltage regulator which integrated on the CPU's die, introduced with Haswell and Broadwell, has again been moved to the motherboard.

Most motherboards for the first revision of the socket support solely DDR4 memory,[1] a lesser number support DDR3(L) memory,[3] and the least number have slots for both DDR4 or DDR3(L) but only one memory type can be installed.[4] Some have UniDIMM support, enabling either type of memory to be placed in the same DIMM, rather than having separate DDR3 and DDR4 DIMMs.[5] The second revision socket motherboards support only DDR4 memory.

Skylake, Kaby Lake, and Coffee Lake chipsets support VT-d, Intel Rapid Storage Technology, Intel Clear Video Technology, and Intel Wireless Display Technology (an appropriate CPU is required). Most motherboards with the LGA 1151 socket support varying video outputs (DVI, HDMI 1.4 or DisplayPort 1.2 – depending on the model). VGA output is optional since Intel dropped support for this video interface starting with Skylake.[6] HDMI 2.0 (4K@60 Hz) is only supported on motherboards equipped with Intel’s Alpine Ridge Thunderbolt controller.[7]

Skylake, Kaby Lake, and Coffee Lake chipsets do not support the legacy conventional PCI interface; however, motherboard vendors may implement it using external chips.

Heatsinks for sockets LGA 1151, 1150, 1155, and 1156 are interchangeable as they all have the same distance of 75 mm between each screw hole.

LGA 1151 revision 1[edit]

DDR3 memory support[edit]

Intel officially states[8][9] that Skylake's and Kaby Lake's integrated memory controllers (IMC) support DDR3L memory modules only rated at 1.35 V and DDR4 at 1.2 V, which led to the speculation that higher voltages of DDR3 modules could damage or destroy the IMC and processor.[10] Meanwhile, ASRock, Gigabyte, and Asus guarantee that their Skylake and Kaby Lake DDR3 motherboards support DDR3 modules rated at 1.5 and 1.65V.[11][12][13]

Skylake chipsets (100 series)[edit]

H110 B150 Q150 H170 Q170 Z170
Overclocking CPU (via BCLK[14] only;[15] might be disabled in new motherboards and BIOS releases[16]) + GPU + RAM (limited) CPU (multiplier + BCLK[14]) + GPU + RAM
Kaby Lake CPUs support Yes, after a BIOS update[17]
Coffee Lake CPUs support No
Memory support DDR4 (max. 64 GiB total; 16 GiB per slot) or

DDR3(L) (max. 32 GiB total; 8 GiB per slot)[18][19]

Maximum DIMM slots 2 4
Maximum USB 2.0/3.0 ports 6/4 6/6 6/8 4/10
Maximum SATA 3.0 ports 4 6
Processor PCI Express v3.0 configuration 1 ×16 Either 1 ×16; 2 ×8; or 1 ×8 and 2 ×4
PCH PCI Express configuration 6 × 2.0 8 × 3.0 10 × 3.0 16 × 3.0 20 × 3.0
Independent Display Support
(digital ports/pipes)
3/2 3/3
SATA RAID 0/1/5/10 support No Yes
Intel Active Management, Trusted Execution and vPro Technology No Yes No
Chipset TDP 6 W
Chipset lithography 22 nm
Release date September 1, 2015[20][21] Q3'15[22] September 1, 2015[20][21] August 5, 2015[23]

Kaby Lake chipsets (200 series)[edit]

There is no equivalent Kaby Lake chipset analogous to the H110 chipset. Four additional PCH PCI-E lanes in Kaby Lake chipsets are reserved for implementing an M.2 slot to support Intel Optane Memory. Otherwise, corresponding Kaby Lake and Skylake chipsets are practically the same.[24]

Light blue indicates a difference between comparable Skylake and Kaby Lake chipsets.

B250 Q250 H270 Q270 Z270
Overclocking No[25] CPU (multiplier + BCLK[26]) + GPU + RAM
Skylake CPUs support Yes
Coffee Lake CPUs support No
Memory support DDR4 (max. 64 GiB total; 16 GiB per slot) or

DDR3(L) (max. 32 GiB total; 8 GiB per slot)[27]

Maximum DIMM slots 4
Maximum USB 2.0/3.0 ports 6/6 6/8 4/10
Maximum SATA 3.0 ports 6
Processor PCI Express v3.0 configuration 1 ×16 Either 1 ×16; 2 ×8; or 1 ×8 and 2 ×4
PCH PCI Express configuration 12 × 3.0 14 × 3.0 20 × 3.0 24 × 3.0
Independent Display Support
(digital ports/pipes)
3/3
SATA RAID 0/1/5/10 support No Yes
Intel Active Management, Trusted Execution and vPro Technology No Yes No
Intel Optane Memory Support Yes, requires Core i3/i5/i7 CPU[28]
Chipset TDP 6 W[29]
Chipset lithography 22 nm[29]
Release date January 3, 2017[30]

LGA 1151 revision 2[edit]

Second revision of the LGA 1151 socket for Coffee Lake CPUs[edit]

The LGA 1151 socket was revised for the Coffee Lake generation CPUs and comes along with the Intel 300-series chipsets.[31] While physical dimensions remain unchanged, the updated socket re-assigns some reserved pins, adding power and ground lines to support the requirements of 6-core CPUs. The new socket also relocates the processor detection pin, breaking compatibility with earlier processors and motherboards. As a result, desktop Coffee Lake CPUs are officially not compatible with the 100 (original Skylake) and 200 (Kaby Lake) series chipsets.[32] Similarly, 300 series chipsets only support Coffee Lake and are not compatible with Skylake and Kaby Lake CPUs.

Coffee Lake chipsets (300 series)[edit]

Like with Kaby Lake chipsets, four additional PCH PCI-E lanes in Coffee Lake chipsets are reserved for implementing an M.2 slot to support Intel Optane Memory.

H310 B360 H370 Q370 Z370 Z390
Overclocking No CPU (multiplier + BCLK[33]) + GPU + RAM
Skylake/Kaby Lake CPUs support No
Coffee Lake CPUs support Yes; however, motherboards based on chipsets other than Z390 require a BIOS update in order to support the 9th gen Coffee Lake CPUs
Memory support DDR4 (max. 64 GiB total; 16 GiB per slot)
Maximum DIMM slots 2 4
Maximum USB 2.0 ports 10 12 14
USB 3.1 ports configuration 4 USB 3.1 Gen 1 Ports Up to 4 USB 3.1 Gen 2 Ports

Up to 6 USB 3.1 Gen 1 Ports

Up to 4 USB 3.1 Gen 2 Ports

Up to 8 USB 3.1 Gen 1 Ports

Up to 6 USB 3.1 Gen 2 Ports

Up to 10 USB 3.1 Gen 1 Ports

10 USB 3.1 Gen 1 Ports Up to 6 USB 3.1 Gen 2 Ports

Up to 10 USB 3.1 Gen 1 Ports

Maximum SATA 3.0 ports 4 6
Processor PCI Express v3.0 configuration 1 ×16 Either 1 ×16; 2 ×8; or 1 ×8 and 2 ×4
PCH PCI Express configuration 6 × 2.0 12 × 3.0 20 × 3.0 24 × 3.0
Independent Display Support (digital ports/pipes) 3/2 3/3
Integrated Wireless (802.11ac) Yes* No Yes*
SATA RAID 0/1/5/10 support No Yes
Intel Optane Memory Support No Yes, requires Core i3/i5/i7 CPU
Intel Smart Sound Technology No Yes
Chipset TDP 6 W[34]
Chipset lithography 14 nm[35] 22 nm[34] ?
Release date April 2, 2018[36] October 5, 2017[37] October 8, 2018[38]

* depends on OEM's implementation

See also[edit]

References[edit]

  1. ^ a b Cutress, Ian. "Intel Skylake Z170 Motherboards: A Quick Look at 55+ New Products". Retrieved 2015-08-05.
  2. ^ "MSI Z170A GAMING M7 (Intel LGA-1151) Review". Retrieved 2015-08-05.
  3. ^ "GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)". Retrieved 2015-09-07.
  4. ^ "ASRock > B150M Combo-G". Retrieved 2015-09-15.
  5. ^ Cutress, Ian. "The Intel 6th Gen Skylake Review: Core i7-6700K and i5-6600K Tested". Retrieved 2015-08-05.
  6. ^ "ARK | Intel® Core™ i7-6700K Processor (8M Cache, up to 4.20 GHz)". Retrieved 2015-08-06.
  7. ^ Cutress, Ian. "Intel Skylake Z170 Motherboards: A Quick Look at 55+ New Products". Retrieved 2015-08-06.
  8. ^ "Intel® Core™ i7-6700K Processor (8M Cache, up to 4.20 GHz) Specifications". Intel® ARK (Product Specs). Retrieved 2016-02-06.
  9. ^ "Intel® Core™ i7-7700K Processor (8M Cache, up to 4.50 GHz) Product Specifications". Intel® ARK (Product Specs). Retrieved 2017-08-07.
  10. ^ "Skylake's IMC Supports Only DDR3L". Retrieved 2015-09-29.
  11. ^ "GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)". Retrieved 2016-02-06.
  12. ^ "Fatal1ty Z170 Gaming K4/D3 Memory Support List".
  13. ^ Günsch, Michael. "Skylake-Mainboards: Asus präsentiert Z170-Platinen mit DDR3 bis 1,65 Volt". ComputerBase (in German). Retrieved 2016-02-06.
  14. ^ a b Cutress, Ian. "The Intel 6th Gen Skylake Review: Core i7-6700K and i5-6600K Tested". Retrieved 2015-09-18.
  15. ^ "Asus H170-PLUS D3 Manual" (PDF). Retrieved 2015-09-18.
  16. ^ "It's official: Intel shuts down the cheap overclocking party by closing Skylake loophole". PCWorld. Retrieved 2016-02-09.
  17. ^ "MSI and Asus update motherboards with Kaby Lake support". KitGuru. 2016-10-06. Retrieved 2016-11-03.
  18. ^ "Intel bids adieu to DDR3: Majority of 'Skylake-S' mainboards to use DDR4 | KitGuru". www.kitguru.net. Retrieved 2015-05-25.
  19. ^ "GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0)". Retrieved 2015-09-07.
  20. ^ a b "Asus Announces 10 New Motherboards Based On Latest 100-Series Intel Chipsets". Retrieved 2015-10-03.
  21. ^ a b "ASUS Announces H170, B150, H110 and Q170 Motherboard Series". www.asus.com. Retrieved 2015-10-03.
  22. ^ "Intel® Q150 Chipset (Intel® GL82Q150 PCH) Specifications". Intel® ARK (Product Specs). Retrieved 2015-12-26.
  23. ^ "Intel Unleashes Next-Gen Enthusiast Desktop PC Platform at Gamescom". Intel Newsroom. Retrieved 2015-08-05.
  24. ^ "The Intel Core i7-7700K Review - Kaby Lake and 14nm+ | Z270 Chipset and ASUS Maximus IX Code". www.pcper.com. Retrieved 2017-01-26.
  25. ^ "Intel Kaby Lake: Z270, Optane, Overclocking & HD Graphics 630". Tom's Hardware. 2017-01-03. Retrieved 2017-01-18.
  26. ^ "Overclocking Intel's Core i7-7700K: Kaby Lake Hits The Desktop!". Tom's Hardware. 2016-11-29. Retrieved 2017-01-18.
  27. ^ "B150M-C D3 | Motherboards | ASUS USA". ASUS USA. Retrieved 2017-05-17.
  28. ^ "Intel® Optane™ Memory". Intel. Retrieved 2017-01-18.
  29. ^ a b "Intel® Z270 Chipset Specifications". Intel® ARK (Product Specs). Retrieved 2017-01-18.
  30. ^ "Get Ready for the Best New PCs for the New Year with New 7th Generation Intel Core Processors | Intel Newsroom". Intel Newsroom. Retrieved 2017-01-18.
  31. ^ Cutress, Ian. "The AnandTech Coffee Lake Review: Initial Numbers on the Core i7-8700K and Core i5-8400". Retrieved 2017-10-05.
  32. ^ Cutress, Ian. "Intel Launches 8th Generation Core CPUs, Starting with Kaby Lake Refresh for 15W Mobile". Retrieved 2017-08-22.
  33. ^ "ASRock Z370 Taichi Benchmarks & Rating - Tom's Hardware". Tom's Hardware. 2017-11-05. Retrieved 2018-04-03.
  34. ^ a b "Intel® Z370 Chipset Product Specifications". Intel® ARK (Product Specs). Retrieved 2018-04-03.
  35. ^ "Intel® H310 Chipset Product Specifications". Intel® ARK (Product Specs). Retrieved 2018-04-03.
  36. ^ "Intel Adds To Coffee Lake CPU Family, Outs New 300-Series Chipsets". Tom's Hardware. 2018-04-03. Retrieved 2018-04-03.
  37. ^ Cutress, Ian. "The AnandTech Coffee Lake Review: Initial Numbers on the Core i7-8700K and Core i5-8400". Retrieved 2018-04-03.
  38. ^ Cutress, Ian. "Intel Announces 9th Gen Core CPUs: Core i9-9900K (8-Core), i7-9700K, & i5-9600K". Retrieved 2018-10-08.