||This article's factual accuracy may be compromised due to out-of-date information. (September 2012)|
|FSB protocol||Intel QuickPath Interconnect|
|FSB frequency||1× QuickPath|
This article is part of the CPU socket series
LGA 1356 is one of the two sockets designed as a replacement for the LGA 1366 CPU socket, the other being LGA 2011 (which is known as Socket R). LGA 1356 has 1356 protruding pins to make contact with the pads on the processor. Processors of LGA 1356 and LGA 1366 sockets are not compatible with each other since they have different socket notches. It supports Intel Sandy Bridge-E microprocessors, codenamed Romley-EN, marketed under the Xeon E5-2400 series.
The main difference between LGA 2011 and LGA 1356 is 2 Intel QuickPath Interconnect (QPI)s connections on the LGA 2011 and 1 QPI connection on the LGA 1356. Other noticeable differences include 24 lanes of PCI Express (PCI-e) version 3.0 connections compared to 40 lanes on the LGA 2011, and three channels of DDR3 support compared to four on the LGA 2011. Each DDR3 channel can support one more DIMM (only applicable to DDR3 and not DDR3-L).
Socket B2 mechanical load limits
Socket B2 processors have the following mechanical maximum load limits which should not be exceeded during heatsink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable.
|IHS Surface||890 N (200 lbf)||266 N (60 lbf)|
- Timothy Prickett Morgan (May 30, 2011). "Intel's future Sandy Bridge Xeons exposed: x64 iron choices galore". The Register. Retrieved November 12, 2011.
- Hiroshige Goto (April 9, 2010). "Sandy Bridge Interface" (PDF). PC Watch website. Retrieved November 12, 2011.
- Gennadiy Shvets (February 8, 2011). "Details on Intel Xeon E5 product families". CPU World news. Retrieved November 12, 2011.
- Theo Valich (September 9, 2011). "Intel Romley Delayed to End of Q1 2012? Chipset, CPU Issues Cited". Bright side of news. Retrieved November 12, 2011.
-  page 30. From "Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide" by Intel