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The present disambiguation page holds the title of a primary topic, and an article needs to be written about it. It is believed to qualify as a broad-concept article. It may be written directly at this page or drafted elsewhere and then moved over here. Related titles should be described in Liquid cooling, while unrelated titles should be moved to Liquid cooling (disambiguation).
Examples of liquid cooling technologies include:
- Water cooling
- Cooling by convection or circulation of coolant
- Liquid Cooling and Ventilation Garment, a garment worn by astronauts
- Liquid metal cooled reactor
- Radiator (engine cooling)
In computing and electronics, liquid cooling involves the technology that uses a special water block to conduct heat away from the processor as well as the chipset. This method can also be used in combination with other traditional cooling methods such as those that use air. The application to microelectronics is either indirect or direct. The former pertains to the category that utilizes cold plate cooling, which uses water as coolant while, in the latter (also referred to as liquid immersion cooling), the surface of the chips comes in contact with the liquid since there is no wall separating the heat source from the coolant. This immersion cooling also offer a higher transfer coefficient, although this depends on the specific coolant used and mode of convective heat transfer. One of the main benefits achieved is the reduction of noise and it is also more efficient. Some of the drawbacks include the risk entailed with the close proximity of liquid to electronics as well as its cost. Liquid cooling systems are more expensive than fan sets, which require less components such as reservoir, pump, water blocks, hose, and radiator.
- Docter, Quentin; Dulaney, Emmett; Skandier, Toby (2012). CompTIA A+ Complete Deluxe Study Guide Recommended Courseware: Exams 220-801 and 220-802, Second Edition. Hoboken, NJ: John Wiley & Sons. p. 61. ISBN 9781118324066.
- Tong, Ho-Ming; Lai, Yi-Shao; Wong, C. P. (2013). Advanced Flip Chip Packaging. Dordrecht: Springer Science & Business Media. p. 447. ISBN 9781441957689.
- Yarin, L. P.; Mosyak, A.; Hetsroni, G. (2008). Fluid Flow, Heat Transfer and Boiling in Micro-Channels. Berlin: Springer-Verlag. p. 13. ISBN 9783540787549.
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