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List of Intel Core processors

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The following is a list of Intel Core processors. This includes the original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as Core 2 (Solo/Duo/Quad/Extreme), Core i3, Core i5, Core i7, Core i9, Core M (m3/m5/m7), Core 3, Core 5 and Core 7 branded processors.

Desktop processors[edit]

Release timeline
Desktop processors
2008Nehalem microarchitecture (1st generation)
2009
2010Westmere microarchitecture (1st generation)
2011Sandy Bridge microarchitecture (2nd generation)
2012Ivy Bridge microarchitecture (3rd generation)
2013Haswell microarchitecture (4th generation)
2014
2015Broadwell microarchitecture (5th generation)
Skylake microarchitecture (6th generation)
2016
2017Kaby Lake microarchitecture (7th generation)
Coffee Lake microarchitecture (8th generation)
2018
2019
2020Comet Lake microarchitecture (10th generation)
2021Rocket Lake (11th generation)
2022Alder Lake (12th generation)
2023Raptor Lake (13th generation)
Raptor Lake (14th generation)

Core 2[edit]

Front side of an Intel Core 2 Duo T7500 Processor

"Allendale" (65 nm, 800 MT/s) [edit]


Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E4300
  • SL9TB (L2)
  • SLA99 (M0)
  • SLA5G
2 1.8 GHz 2 MB 800 MT/s 0.85–1.5 V 65 W LGA 775 January 2007
  • HH80557PG0332M
  • BX80557E4300
$163
Core 2 Duo E4400
  • SLA3F (L2)
  • SLA98 (M0)
  • SLA5F
2 2 GHz 2 MB 800 MT/s 10× 0.85–1.5 V 65 W LGA 775 April 2007
  • HH80557PG0412M
  • BX80557E4400
$133
Core 2 Duo E4500
  • SLA95 (M0)
2 2.2 GHz 2 MB 800 MT/s 11× 0.85–1.5 V 65 W LGA 775 July 2007
  • HH80557PG0492M
  • BX80557E4500
$133
Core 2 Duo E4600
  • SLA94 (M0)
2 2.4 GHz 2 MB 800 MT/s 12× 1.162–1.312 V 65 W LGA 775 October 2007
  • HH80557PG0562M
  • BX80557E4600
$133
Core 2 Duo E4700
  • SLALT (G0)
2 2.6 GHz 2 MB 800 MT/s 13× 1.162–1.312 V 65 W LGA 775 March 2008
  • HH80557PG0642M
  • BX80557E4700
$133

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E6300
  • SL9SA (B2)
  • SL9TA (L2)
  • SLA2L (?)
  • SLA5E (?)
2 1.87 GHz 2 MB 1066 MT/s 0.85–1.5 V 65 W LGA 775 July 2006
  • HH80557PH0362M
  • BX80557E6300
  • BX80557E6300T2
$183
Core 2 Duo E6320
  • SLA4U (B2)
2 1.87 GHz 4 MB 1066 MT/s 0.85–1.5 V 65 W LGA 775 April 2007
  • HH80557PH0364M
  • BX80557E6320
$163
Core 2 Duo E6400
  • SL9S9 (B2)
  • SLA5D (?)
  • SL9T9 (L2)
  • SLA97 (M0)
2 2.13 GHz 2 MB 1066 MT/s 0.85–1.5 V 65 W LGA 775 July 2006
  • HH80557PH0462M
  • BX80557E6400
$224
Core 2 Duo E6420
  • SLA4T (B2)
2 2.13 GHz 4 MB 1066 MT/s 0.85–1.5 V 65 W LGA 775 April 2007
  • HH80557PH0464M
  • BX80557E6420
$183
Core 2 Duo E6600
  • SL9S8 (B2)
  • SL9ZL (B2)
2 2.4 GHz 4 MB 1066 MT/s 0.85–1.5 V 65 W LGA 775 July 2006
  • HH80557PH0564M
  • BX80557E6600
$316
Core 2 Duo E6700
  • SL9S7 (B2)
  • SL9ZF (B2)
2 2.67 GHz 4 MB 1066 MT/s 10× 0.85–1.5 V 65 W LGA 775 July 2006
  • HH80557PH0674M
  • BX80557E6700
$530

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).[1]

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.[2]

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E6540
  • SLAA5 (G0)
2 2.33 GHz 4 MB 1333 MT/s 0.85–1.5 V 65 W LGA 775 July 2007
  • HH80557PJ0534M
$163
Core 2 Duo E6550
  • SLA9X (G0)
  • SLAAT (?)
2 2.33 GHz 4 MB 1333 MT/s 0.85–1.5 V 65 W LGA 775 July 2007
  • HH80557PJ0534MG
  • BX80557E6550
  • BX80557E6550R
$163
Core 2 Duo E6750
  • SLA9V (G0)
  • SLAAR (?)
2 2.67 GHz 4 MB 1333 MT/s 0.85–1.5 V 65 W LGA 775 July 2007
  • HH80557PJ0674MG
  • BX80557E6750
  • BX80557E6750R
$183
Core 2 Duo E6850
  • SLA9U (G0)
2 3 GHz 4 MB 1333 MT/s 0.85–1.5 V 65 W LGA 775 July 2007
  • HH80557PJ0804MG
  • BX80557E6850
$266

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).[1]

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.[2]

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E6305
  • SLAGF
2 1.87 GHz 2 MB 1066 MT/s 65 W LGA 771
  • HH80557KH036F
Core 2 Duo E6405
  • SLAGG
2 2.13 GHz 2 MB 1066 MT/s 65 W LGA 771
  • HH80557KH046F

"Conroe XE" (65 nm)[edit]

[3][4]

These models feature an unlocked clock multiplier

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Extreme X6800
  • SL9S5 (B2)
  • QPHV (B1)
2 2.93 GHz 4 MB 1066 MT/s 11× 0.85–1.5 V
75 W
LGA 775 July 2006
  • HH80557PH0677M
  • BX80557X6800
$999
Core 2 Extreme X6900[5][6]
  • QTOM (B2)
  • SL9S4 (B2)
2 3.2 GHz 4 MB 1066 MT/s 12× 0.85–1.5 V
75 W
LGA 775 N/A
  • HH80557PH0884M
N/A

"Kentsfield" (65 nm)[edit]

[7][8]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Quad Q6400[9]
  • SL9UN (B3)
4 2.13 GHz 2 × 4 MB 1066 MT/s 0.8500–1.500 V
105 W
LGA 775
  • HH80562PH0468M
OEM
Core 2 Quad Q6600
  • SL9UM (B3)
  • SLACR (G0)
4 2.4 GHz 2 × 4 MB 1066 MT/s 0.8500–1.500 V
  • 105 W
  • 95 W
LGA 775 January 2007
  • HH80562PH0568M
  • BX80562Q6600
  • BXC80562Q6600
$851
Core 2 Quad Q6700
  • SLACQ (G0)
4 2.67 GHz 2 × 4 MB 1066 MT/s 10× 0.8500–1.500 V
105 W
LGA 775 July 2007
  • HH80562PH0678M
  • BX80562Q6700
  • BXC80562Q6700
$530

"Kentsfield XE" (65 nm)[edit]

[10]

These models feature an unlocked clock multiplier

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Extreme QX6700
  • SL9UL (B3)
4 2.67 GHz 2 × 4 MB 1066 MT/s 10× 0.8500–1.500 V
130 W
LGA 775 November 2006
  • HH80562PH0678M
$999
Core 2 Extreme QX6800
  • SL9UK (B3)
  • SLACP (G0)
4 2.93 GHz 2 × 4 MB 1066 MT/s 11× 0.8500–1.500 V
130 W
LGA 775 April 2007
  • HH80562PH0778M
  • HH80562XH0778M
$1199
Core 2 Extreme QX6850
  • SLAFN (G0)
4 3 GHz 2 × 4 MB 1333 MT/s 0.8500–1.500 V
130 W
LGA 775 July 2007
  • HH80562XJ0808M
$999

"Wolfdale-3M" (45 nm, 1066 MT/s)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E7200
  • SLAPC (M0)
  • SLAVN (M0)
  • SLB9W (?)
2 2.53 GHz 3 MB 1066 MT/s 9.5× 0.85–1.3625 V 65 W LGA 775 April 2008
  • EU80571PH0613M
  • BX80571E7200
$133
Core 2 Duo E7300
  • SLAPB (M0)
  • SLB9X (R0)
  • SLGA9 (R0)
2 2.67 GHz 3 MB 1066 MT/s 10× 0.85–1.3625 V 65 W LGA 775 August 2008
  • EU80571PH0673M
  • AT80571PH0673M
  • BX80571E7300
$133
Core 2 Duo E7400
  • SLB9Y (R0)
  • SLGQ8 (R0)
  • SLGW3 (R0, with VT)
2 2.8 GHz 3 MB 1066 MT/s 10.5× 0.85–1.3625 V 65 W LGA 775 October 2008
  • AT80571PH0723M
  • AT80571PH0723ML
  • BX80571E7400
$133
Core 2 Duo E7500
  • SLB9Z (R0)
  • SLGTE (R0, with VT)
2 2.93 GHz 3 MB 1066 MT/s 11× 0.85–1.3625 V 65 W LGA 775 January 2009
  • AT80571PH0773M
  • AT80571PH0773ML
  • BX80571E7500
$133
Core 2 Duo E7600
  • SLGTD (R0, with VT)
2 3.07 GHz 3 MB 1066 MT/s 11.5× 0.85–1.3625 V 65 W LGA 775 May 2009
  • AT80571PH0833ML
  • BX80571E7600
$133

"Wolfdale" (45 nm, 1333 MT/s)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E8190
  • SLAQR (C0)
2 2.67 GHz 6 MB 1333 MT/s 0.85–1.3625 V 65 W LGA 775 January 2008
  • EU80570PJ0676MN
$163
Core 2 Duo E8200
  • SLAPP (C0)
2 2.67 GHz 6 MB 1333 MT/s 0.85–1.3625 V 65 W LGA 775 January 2008
  • EU80570PJ0676M
  • BX80570E8200
$163
Core 2 Duo E8290[11]
  • SLAQQ (?)
2 2.83 GHz 6 MB 1333 MT/s 8.5× 0.85–1.3625 V 65 W LGA 775 ?
  • EU80570PJ0736MN
?
Core 2 Duo E8300
  • SLAPJ (C0)
  • SLAPN (C0)
2 2.83 GHz 6 MB 1333 MT/s 8.5× 0.85–1.3625 V 65 W LGA 775 April 2008
  • EU80570AJ0736M
  • EU80570PJ0736M
$163
Core 2 Duo E8400
  • SLAPL (C0)
  • SLB9J (E0)
2 3 GHz 6 MB 1333 MT/s 0.85–1.3625 V 65 W LGA 775 January 2008
  • EU80570PJ0806M
  • AT80570PJ0806M
  • BX80570E8400
$183
Core 2 Duo E8500
  • SLAPK (C0)
  • SLB9K (E0)
2 3.17 GHz 6 MB 1333 MT/s 9.5× 0.85–1.3625 V 65 W LGA 775 January 2008
  • EU80570PJ0876M
  • AT80570PJ0876M
  • BX80570E8500
$266
Core 2 Duo E8600
  • SLB9L (E0)
2 3.33 GHz 6 MB 1333 MT/s 10× 0.85–1.3625 V 65 W LGA 775 August 2008
  • AT80570PJ0876M
  • BX80570E8600
$266
Core 2 Duo E8700
  • SLB9E (E0)
2 3.5 GHz 6 MB 1333 MT/s 10.5× 0.85–1.3625 V 65 W LGA 775 December 2009
  • AT80570PJ1006M(OEM)
NA

a Note: The E8190 and E8290 do not support Intel VT-d.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Quad Q8200
  • SLB5M (M1)
  • SLG9S (R0)
4 2.33 GHz 2 × 2 MB 1333 MT/s 0.85–1.3625 V
95 W
LGA 775 August 2008
  • EU80580PJ0534MN
  • AT80580PJ0534MN
$224
Core 2 Quad Q8200S
  • SLG9T (R0)
  • SLGSS (R0, with Intel VT-x)
4 2.33 GHz 2 × 2 MB 1333 MT/s 0.85–1.3625 V
65 W
LGA 775 January 2009
  • AT80580AJ0534MN
  • AT80580AJ0534ML
$245
Core 2 Quad Q8300
  • SLB5W (R0)
  • SLGUR (R0, with Intel VT-x)
4 2.5 GHz 2 × 2 MB 1333 MT/s 7.5× 0.85–1.3625 V
95 W
LGA 775 November 2008
  • AT80580PJ0604MN
  • AT80580PJ0604ML
$224
Core 2 Quad Q8400
  • SLGT6 (R0, with Intel VT-x)
4 2.67 GHz 2 × 2 MB 1333 MT/s 0.85–1.3625 V
95 W
LGA 775 April 2009
  • AT80580PJ0674ML
$183
Core 2 Quad Q8400S
  • SLGT7 (R0, with Intel VT-x)
4 2.67 GHz 2 × 2 MB 1333 MT/s 0.85–1.3625 V
65 W
LGA 775 April 2009
  • AT80580AJ0674ML
$245
Core 2 Quad Q9300
  • SLAMX (M0)
  • SLAWE (M1)
4 2.5 GHz 2 × 3 MB 1333 MT/s 7.5× 0.85–1.3625 V
95 W
LGA 775 March 2008
  • EU80580PJ0606M
$266
Core 2 Quad Q9400
  • SLB6B (R0)
4 2.67 GHz 2 × 3 MB 1333 MT/s 0.85–1.3625 V
95 W
LGA 775 August 2008
  • AT80580PJ0676M
$266
Core 2 Quad Q9400S
  • SLG9U (R0)
4 2.67 GHz 2 × 3 MB 1333 MT/s 0.85–1.3625 V
65 W
LGA 775 January 2009
  • AT80580AJ0676M
$320
Core 2 Quad Q9500
  • SLGZ4 (R0)
4 2.83 GHz 2 × 3 MB 1333 MT/s 8.5× 0.85–1.3625 V
95 W
LGA 775 January 2010
  • AT80580PJ0736ML
$183
Core 2 Quad Q9505
  • SLGYY (R0)
4 2.83 GHz 2 × 3 MB 1333 MT/s 8.5× 0.85–1.3625 V
95 W
LGA 775 August 2009
  • AT80580PJ0736MG
$213
Core 2 Quad Q9505S
  • SLGYZ (R0)
4 2.83 GHz 2 × 3 MB 1333 MT/s 8.5× 0.85–1.3625 V
65 W
LGA 775 August 2009
  • AT80580AJ0736MG
$277

a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Quad Q9450
  • SLAN6 (C0)
  • SLAWR (C1)
4 2.67 GHz 2 × 6 MB 1333 MT/s 0.85–1.3625 V
95 W
LGA 775 March 2008
  • EU80569PJ067N
$316
Core 2 Quad Q9550
  • SLAN4 (C0)
  • SLAWQ (C1)
  • SLB8V (E0)
4 2.83 GHz 2 × 6 MB 1333 MT/s 8.5× 0.85–1.3625 V
95 W
LGA 775 March 2008
  • EU80569PJ073N
  • AT80569PJ073N
$530
Core 2 Quad Q9550S
  • SLGAE (E0)
4 2.83 GHz 2 × 6 MB 1333 MT/s 8.5× 0.85–1.3625 V
65 W
LGA 775 January 2009
  • AT80569AJ073N
$369
Core 2 Quad Q9650
  • SLB8W (E0)
4 3 GHz 2 × 6 MB 1333 MT/s 0.85–1.3625 V
95 W
LGA 775 August 2008
  • AT80569PJ080N
  • BX80569Q9650
$530

"Yorkfield XE" (45 nm)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Extreme QX9650
  • SLAN3 (C0)
  • SLAWN (C1)
4 3 GHz 2 × 6 MB 1333 MT/s 0.85–1.3625 V
130 W
LGA 775 November 2007[16]
  • EU80569XJ080NL
  • BX80569QX9650
$999
Core 2 Extreme QX9750[17]
  • QJEE (E0)
  • SLBBU (E0)
4 3.17 GHz 2 × 6 MB 1333 MT/s 9.5× 0.85–1.3625 V
130 W
LGA 775 N/A
  • AT80569XL087NL
N/A
Core 2 Extreme QX9770
  • SLAN2 (C0)
  • SLAWM (C1)
4 3.2 GHz 2 × 6 MB 1600 MT/s 0.85–1.3625 V
136 W
LGA 775 March 2008
  • EU80569XL088NL
  • BX80569QX9770
$1399
Core 2 Extreme QX9775
  • SLANY (C0)
4 3.2 GHz 2 × 6 MB 1600 MT/s 0.85–1.35 V
150 W
LGA 771 March 2008
  • EU80574XL088N
  • BX80574QX9775
$1499

Core i (1st gen)[edit]

Lynnfield[edit]

Common features:

  • Socket: LGA 1156.
  • All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 880 4 (8) 3.06 3.73 8 MB 95 W May 2010 US $583
875K 2.93 3.60 US $342
870 September 2009 US $562
870S 2.67 82 W July 2010 US $351
860 2.80 3.46 95 W September 2009 US $284
860S 2.53 82 W January 2010 US $337
Core i5 760 4 (4) 2.80 3.33 95 W July 2010 US $205
750 2.66 3.20 September 2009 US $196
750S 2.40 82 W January 2010 US $259

Bloomfield[edit]

Common features:

  • Socket: LGA 1366.
  • All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
  • PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
  • All CPUs feature a QPI bus to the chipset (northbridge).
    • Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • Extreme Edition processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 975 Extreme Edition 4 (8) 3.33 3.60 8 MB 130 W June 2009 US $999
965 Extreme Edition 3.20 3.46 November 2008
960 October 2009 US $562
950 3.06 3.33 June 2009
940 2.93 3.20 November 2008
930 2.80 3.06 February 2010 US $294
920 2.66 2.93 November 2008 US $284

Clarkdale[edit]

Common features:

  • Socket: LGA 1156.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i5 680 2 (4) 3.60 3.86 HD Graphics 733 4 MB 73 W April 2010 US $294
670 3.46 3.73 January 2010 US $284
661 3.33 3.60 900 87 W US $196
660 733 73 W
655K 3.20 3.46 May 2010 US $216
650 January 2010 US $176
Core i3 560 3.33 August 2010 US $138
550 3.20 May 2010
540 3.06 January 2010 US $133
530 2.93 US $113

Gulftown[edit]

Common features:

  • Socket: LGA 1366.
  • All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
  • PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
  • All CPUs feature a QPI bus to the chipset (northbridge).
    • Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 990X 6 (12) 3.46 3.73 12 MB 130 W February 2011 US $999
980X 3.33 3.60 March 2010
980 June 2011 US $583
970 3.20 3.46 July 2010 US $885

Core i (2nd gen)[edit]

Sandy Bridge-DT[edit]

Common features:

  • Socket: LGA 1155.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i3-2120, i5-2400, and i7-2600 are available as embedded processors.
  • The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 2700K 4 (8) 3.5 3.9 HD 3000 850–1350 8 MB 95 W October 2011 US $332
2600K 3.4 3.8 January 2011 US $317
2600 HD 2000 US $294
2600S 2.8 65 W US $306
Core i5 2550K 4 (4) 3.4 6 MB 95 W January 2012 US $225
2500K 3.3 3.7 HD 3000 850–1100 January 2011 US $216
2500 HD 2000 US $205
2500S 2.7 65 W US $216
2500T 2.3 3.3 650–1250 45 W
2450P 3.2 3.5 95 W January 2012 US $195
2400 3.1 3.4 HD 2000 850–1100 January 2011 US $184
2405S 2.5 3.3 HD 3000 65 W May 2011 US $205
2400S HD 2000 January 2011 US $195
2390T 2 (4) 2.7 3.5 650–1100 3 MB 35 W February 2011
2380P 4 (4) 3.1 3.4 6 MB 95 W January 2012 US $177
2320 3.0 3.3 HD 2000 850–1100 September 2011
2310 2.9 3.2 May 2011
2300 2.8 3.1 January 2011
Core i3 2130 2 (4) 3.4 850–1100 3 MB 65 W September 2011 US $138
2125 3.3 HD 3000 US $134
2120 HD 2000 February 2011 US $138
2120T 2.6 650–1100 35 W US $127
2105 3.1 HD 3000 850–1100 65 W May 2011 US $134
2102 HD 2000 Q2 2011 US $127
2100 February 2011 US $117
2100T 2.5 650–1100 35 W US $127

Core i (3rd gen)[edit]

Ivy Bridge-DT[edit]

Common features:

  • Socket: LGA 1155.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i3-3220, i5-3550S and i7-3770 are available as embedded processors.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 3770K 4 (8) 3.5 3.9 HD 4000 650–1150 8 MB 77 W April 2012 US $342
3770 3.4 US $305
3770S 3.1 65 W US $305
3770T 2.5 3.7 45 W US $294
Core i5 3570K 4 (4) 3.4 3.8 6 MB 77 W US $225
3570 HD 2500 June 2012 US $205
3570S 3.1 65 W
3570T 2.3 3.3 45 W April 2012
3550 3.3 3.7 77 W
3550S 3.0 65 W
3470 3.2 3.6 650–1100 77 W June 2012 US $184
3475S 2.9 HD 4000 65 W US $201
3470S HD 2500 US $184
3470T 2 (4) 3 MB 35 W
3450 4 (4) 3.1 3.5 6 MB 77 W April 2012
3450S 2.8 65 W
3350P 3.1 3.3 69 W September 2012 US $177
3340 HD 2500 650–1050 77 W September 2013 US $182
3340S 2.8 65 W
3330 3.0 3.2 77 W September 2012
3335S 2.7 HD 4000 65 W US $194
3330S HD 2500 US $177
Core i3 3250 2 (4) 3.5 3 MB 55 W June 2013 US $138
3250T 3.0 35 W
3245 3.4 HD 4000 55 W US $134
3240 HD 2500 September 2012 US $138
3240T 2.9 35 W
3225 3.3 HD 4000 55 W US $134
3220 HD 2500 US $117
3220T 2.8 35 W
3210 3.2 55 W January 2013

Sandy Bridge-E[edit]

Common features:

  • Socket: LGA 2011.
  • All the CPUs support quad-channel DDR3-1600 RAM.
  • All CPU models provide 40 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 3970X 6 (12) 3.5 4.0 15 MB 150 W November 2012 US $999
3960X 3.3 3.9 130 W November 2011
3930K 3.2 3.8 12 MB US $583
3820 4 (8) 3.6 3.8 10 MB February 2012 US $294

Core i (4th gen)[edit]

Haswell-DT[edit]

Common features:

  • Socket: LGA 1150.
  • All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 4790K 4 (8) 4.0 4.4 HD 4600 350–1250 8 MB 88 W June 2014 US $350
4790 3.6 4.0 350–1200 84 W May 2014 US $312
4790S 3.2 65 W
4790T 2.7 3.9 45 W US $303
4785T 2.2 3.2 35 W
4770K 3.5 3.9 350–1250 84 W June 2013 US $350
4771 350–1200 September 2013 US $320
4770 3.4 June 2013 US $312
4770S 3.1 65 W US $305
4770T 2.5 3.7 45 W US $303
4765T 2.0 3.0 35 W
Core i5 4690K 4 (4) 3.5 3.9 6 MB 88 W June 2014 US $242
4690 84 W May 2014 US $213
4690S 3.2 65 W
4690T 2.5 3.5 45 W
4670K 3.4 3.8 84 W June 2013 US $242
4670 US $213
4670S 3.1 65 W
4670T 2.3 3.3 45 W
4590 3.3 3.7 350–1150 84 W May 2014 US $192
4590S 3.0 65 W
4590T 2.0 3.0 35 W
4570 3.2 3.6 84 W June 2013
4570S 2.9 65 W
4570T 2 (4) 200–1150 4 MB 35 W
4470 4 (4) 3.3 3.5 350–1100 6 MB 84 W May 2014 OEM
4460 3.2 3.4 US $182
4460S 2.9 65 W
4460T 1.9 2.7 35 W March 2014
4440 3.1 3.3 84 W September 2013
4440S 2.8 65 W
4430 3.0 3.2 84 W June 2013
4430S 2.7 65 W
Core i3 4370 2 (4) 3.8 350–1150 4 MB 54 W July 2014 US $149
4370T 3.3 200–1150 35 W March 2015 US $138
4360 3.7 350–1150 54 W May 2014 US $149
4360T 3.2 200–1150 35 W July 2014 US $138
4350 3.6 350–1150 54 W May 2014
4350T 3.1 200–1150 35 W
4340 3.6 350–1150 54 W September 2013 US $149
4330 3.5 US $138
4330T 3.0 200–1150 35 W
4170 3.7 HD 4400 350–1150 3 MB 54 W March 2015 US $117
4170T 3.2 200–1150 35 W
4160 3.6 350–1150 54 W July 2014
4160T 3.1 200–1150 35 W
4150 3.5 350–1150 54 W May 2014
4150T 3.0 200–1150 35 W
4130 3.4 350–1150 54 W September 2013 US $122
4130T 2.9 200–1150 35 W

Haswell-H[edit]

Common features:

  • Socket: BGA 1364 (soldered).
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4770R 4 (8) 3.2 3.9 Iris Pro 5200 200–1300 6 MB 65 W June 2013
Core i5 4670R 4 (4) 3.0 3.7 4 MB
4570R 2.7 3.2 200–1150

Ivy Bridge-E[edit]

Common features:

  • Socket: LGA 2011.
  • All the CPUs support quad-channel DDR3-1866 RAM.
  • All CPU models provide 40 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 4960X 6 (12) 3.6 4.0 15 MB 130 W September 2013 US $990
4930K 3.4 3.9 12 MB US $555
4820K 4 (8) 3.7 10 MB US $310

Core i (5th gen)[edit]

Broadwell-H[edit]

Common features:

  • Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
  • All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 5775R 4 (8) 3.3 3.8 Iris Pro 6200 300–1150 6 MB 65 W June 2015 OEM
5775C 3.7 US $366
Core i5 5675R 4 (4) 3.1 3.6 300–1100 4 MB OEM
5675C US $276
5575R 2.8 3.3 300–1050 OEM

Haswell-E[edit]

Common features:

  • Socket: LGA 2011-3.
  • All the CPUs support quad-channel DDR4-2133 RAM.
  • i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 5960X 8 (16) 3.0 3.5 20 MB 140 W August 2014 US $999
5930K 6 (12) 3.5 3.7 15 MB US $583
5820K 3.3 3.6 US $389

Core i (6th gen)[edit]

Skylake-S[edit]

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 6700K 4 (8) 4.0 4.2 HD 530 350–1150 8 MB 91 W August 2015 US $339
6700 3.4 4.0 65 W September 2015 US $303
6700T 2.8 3.6 350–1100 35 W
Core i5 6600K 4 (4) 3.5 3.9 350–1150 6 MB 91 W August 2015 US $243
6600 3.3 65 W September 2015 US $213
6600T 2.7 3.5 350–1100 35 W
6500 3.2 3.6 350–1050 65 W US $192
6500T 2.5 3.1 350–1100 35 W
6402P 2.8 3.4 HD 510 350–950 65 W December 2015 US $182
6400 2.7 3.3 HD 530 September 2015
6400T 2.2 2.8 35 W
Core i3 6320 2 (4) 3.9 350–1150 4 MB 51 W US $148
6300 3.8 US $139
6300T 3.3 350–950 35 W US $138
6100 3.7 350–1050 3 MB 51 W US $117
6100T 3.2 350–950 35 W
6098P 3.6 HD 510 350–1050 54 W December 2015

Skylake-H[edit]

Common features:

  • Socket: BGA 1440 (soldered).
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6785R 4 (8) 3.3 3.9 Iris Pro 580 350–1150 8 MB 65 W May 2016
Core i5 6685R 4 (4) 3.2 3.8 6 MB
6585R 2.8 3.6 350–1100

Broadwell-E[edit]

Common features:

  • Socket: LGA 2011-3.
  • All the CPUs support quad-channel DDR4-2400 RAM.
  • i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 6950X 10 (20) 3.0 3.5 25 MB 140 W May 2016 US $1723
6900K 8 (16) 3.2 3.7 20 MB US $1089
6850K 6 (12) 3.6 3.8 15 MB US $617
6800K 3.4 US $434

Core i (7th gen)[edit]

Kaby Lake-S[edit]

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 7700K 4 (8) 4.2 4.5 HD 630 350–1150 8 MB 91 W January 2017 US $339
7700 3.6 4.2 65 W US $303
7700T 2.9 3.8 35 W
Core i5 7600K 4 (4) 3.8 4.2 6 MB 91 W US $242
7600 3.5 4.1 65 W US $213
7600T 2.8 3.7 350–1100 35 W
7500 3.4 3.8 65 W US $192
7500T 2.7 3.3 35 W
7400 3.0 3.5 350–1000 65 W US $182
7400T 2.4 3.0 35 W
Core i3 7350K 2 (4) 4.2 350–1150 4 MB 60 W US $168
7320 4.1 51 W US $157
7300 4.0 US $147
7300T 3.5 350–1100 35 W
7100 3.9 3 MB 51 W US $117
7100T 3.4 35 W

Skylake-X[edit]

Common features:

  • Socket: LGA 2066.
  • All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
  • i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
2.0
Turbo
3.0
Core i9 7980XE 18 (36) 2.6 4.2 4.4 24.75 MB 165 W September 2017 US $1999
7960X 16 (32) 2.8 22 MB US $1699
7940X 14 (28) 3.1 4.3 19.25 MB US $1399
7920X 12 (24) 2.9 16.5 MB 140 W August 2017 US $1199
7900X 10 (20) 3.3 4.5 13.75 MB June 2017 US $989
Core i7 7820X 8 (16) 3.6 11 MB US $599
7800X 6 (12) 3.5 4.0 8.25 MB US $389

Kaby Lake-X[edit]

Common features:

  • Socket: LGA 2066.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
Core i7 7740X 4 (8) 4.3 4.5 8 MB 112 W June 2017 US $339
Core i5 7640X 4 (4) 4.0 4.2 6 MB US $242

Core i (8th gen)[edit]

Coffee Lake-S[edit]

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i7 8086K 6 (12) 4.0 5.0 UHD 630 350–1200 12 MB 95 W June 2018 US $425
8700K 3.7 4.7 October 2017 US $359
8700 3.2 4.6 65 W US $303
8700T 2.4 4.0 35 W April 2018
Core i5 8600K 6 (6) 3.6 4.3 350–1150 9 MB 95 W October 2017 US $257
8600 3.1 65 W April 2018 US $213
8600T 2.3 3.7 35 W
8500 3.0 4.1 350–1100 65 W US $192
8500T 2.1 3.5 35 W
8400 2.8 4.0 350–1050 65 W October 2017 US $182
8400T 1.7 3.3 35 W April 2018
Core i3 8350K 4 (4) 4.0 350–1150 8 MB 91 W October 2017 US $168
8300 3.7 62 W April 2018 US $138
8300T 3.2 350–1100 35 W
8100 3.6 6 MB 65 W October 2017 US $117
8100F January 2019
8100T 3.1 UHD 630 350–1100 35 W April 2018

Core i (9th gen)[edit]

Coffee Lake-R[edit]

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9-9900KS has all-core boost clock of 5.0 GHz.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i9 9900KS 8 (16) 4.0 5.0 UHD 630 350–1200 16 MB 127 W October 2019 US $524
9900K 3.6 95 W October 2018 US $488
9900KF January 2019 US $463
9900 3.1 UHD 630 350–1200 65 W April 2019 US $439
9900T 2.1 4.4 35 W
Core i7 9700K 8 (8) 3.6 4.9 12 MB 95 W October 2018 US $374
9700KF January 2019
9700 3.0 4.7 UHD 630 350–1200 65 W April 2019 US $323
9700F
9700T 2.0 4.3 UHD 630 350–1200 35 W
Core i5 9600K 6 (6) 3.7 4.6 350–1150 9 MB 95 W October 2018 US $262
9600KF January 2019 US $263
9600 3.1 UHD 630 350–1150 65 W April 2019 US $213
9600T 2.3 3.9 35 W
9500 3.0 4.2 350–1100 65 W US $192
9500F
9500T 2.2 3.7 UHD 630 350–1100 35 W
9400 2.9 4.1 350–1050 65 W January 2019 US $182
9400F
9400T 1.8 3.4 UHD 630 350–1050 35 W April 2019
Core i3 9350K 4 (4) 4.0 4.6 350–1150 8 MB 91 W US $173
9350KF January 2019
9320 3.7 4.4 UHD 630 350–1150 62 W April 2019 US $154
9300 4.3 US $143
9300T 3.2 3.8 350–1100 35 W
9100 3.6 4.2 6 MB 65 W US $122
9100F
9100T 3.1 3.7 UHD 630 350–1100 35 W

Skylake-X (9xxx)[edit]

Common features:

  • Socket: LGA 2066.
  • All the CPUs support quad-channel DDR4-2666 RAM.
  • All CPU models provide 44 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
2.0
Turbo
3.0
Core i9 9990XE[18] 14 (28) 4.0 5.0 5.0 19.25 MB 255 W January 2019 OEM
9980XE 18 (36) 3.0 4.4 4.5 24.75 MB 165 W Q4 2018 US $1979
9960X 16 (32) 3.1 22 MB US $1684
9940X 14 (28) 3.3 19.25 MB US $1387
9920X 12 (24) 3.5 US $1189
9900X 10 (20) US $989
9820X 3.3 4.1 4.2 16.5 MB US $889
Core i7 9800X 8 (16) 3.8 4.4 4.5 November 2018 US $589

Core i (10th gen)[edit]

Comet Lake-S[edit]

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo TVB Model Clock (MHz)
Core i9 10900K 10 (20) 3.7 5.2 5.3 UHD 630 350–1200 20 MB 125 W April 2020 US $488
10900KF US $472
10910 3.6 5.0 UHD 630 350–1200 Q3 2020 OEM
10900 2.8 5.1 5.2 65 W April 2020 US $439
10900F US $422
10900T 1.9 4.6 UHD 630 350–1200 35 W US $439
10850K 3.6 5.1 5.2 125 W July 2020 US $453
Core i7 10700K 8 (16) 3.8 5.1 16 MB May 2020 US $374
10700KF US $349
10700 2.9 4.8 UHD 630 350–1200 65 W US $323
10700F US $298
10700T 2.0 4.5 UHD 630 350–1200 35 W US $325
Core i5 10600K 6 (12) 4.1 4.8 12 MB 125 W April 2020 US $262
10600KF US $237
10600 3.3 UHD 630 350–1200 65 W US $213
10600T 2.4 4.0 35 W
10500 3.1 4.5 350–1150 65 W US $192
10500T 2.3 3.8 35 W
10400 2.9 4.3 350–1100 65 W US $182
10400F US $157
10400T 2.0 3.6 UHD 630 350–1100 35 W US $182
Core i3 10320 4 (8) 3.8 4.6 350–1150 8 MB 65 W US $154
10300 3.7 4.4 US $143
10300T 3.0 3.9 350–1100 35 W
10100 3.6 4.3 6 MB 65 W US $122
10100F October 2020 US $97
10100T 3.0 3.8 UHD 630 350–1100 35 W April 2020 US $122

Comet Lake-S (refresh)[edit]

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • All models support Turbo Boost 2.0.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo Model Clock (MHz)
Core i5 10505 6 (12) 3.2 4.6 UHD 630 350–1200 12 MB 65 W March 2021 US $192
Core i3 10325 4 (8) 3.9 4.7 350–1150 8 MB US $154
10305 3.8 4.5 US $143
10305T 3.0 4.0 350–1100 35 W
10105 3.7 4.4 6 MB 65 W US $122
10105F US $97
10105T 3.0 3.9 UHD 630 350–1100 35 W US $122

Cascade Lake-X (10xxx)[edit]

Common features:

  • Socket: LGA 2066.
  • All the CPUs support quad-channel DDR4-2933 RAM.
  • All CPU models provide 48 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
Base Turbo
2.0
Turbo
3.0
Core i9 10980XE 18 (36) 3.0 4.6 4.8 24.75 MB 165 W October 2019 US $979
10940X 14 (28) 3.3 19.25 MB US $784
10920X 12 (24) 3.5 US $689
10900X 10 (20) 3.7 4.5 4.7 US $590

Core i (11th gen)[edit]

Rocket Lake-S[edit]

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.[19]
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Base Turbo TVB Model Clock (MHz)
Core i9 11900K 8 (16) 3.5 5.2 5.3 UHD 750 350–1300 16 MB 125 W March 2021 US $539
11900KF US $513
11900 2.5 5.1 5.2 UHD 750 350–1300 65 W US $439
11900F US $422
11900T 1.5 4.9 UHD 750 350–1300 35 W US $439
Core i7 11700K 3.6 5.0 125 W US $399
11700KF US $374
11700 2.5 4.9 UHD 750 350–1300 65 W US $323
11700F US $298
11700T 1.4 4.6 UHD 750 350–1300 35 W US $323
Core i5 11600K 6 (12) 3.9 4.9 12 MB 125 W US $262
11600KF US $237
11600 2.8 4.8 UHD 750 350–1300 65 W US $213
11600T 1.7 4.1 35 W
11500 2.7 4.6 65 W US $192
11500T 1.5 3.9 350–1200 35 W
11400 2.6 4.4 UHD 730 350–1300 65 W US $182
11400F US $157
11400T 1.3 3.7 UHD 730 350–1200 35 W US $182

Tiger Lake-B[edit]

Common features:

  • Socket: BGA 1787 (soldered).
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • These CPUs were sold to OEMs only.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i9 11900KB 8 (16) 3.3 4.9 UHD Graphics
(32 EU)
350–1450 24 MB 55–65 W May 2021
Core i7 11700B 3.2 4.8
Core i5 11500B 6 (12) 3.3 4.6 12 MB 65 W
Core i3 11100B 4 (8) 3.6 4.4 UHD Graphics
(16 EU)
350–1400

Core i (12th gen)[edit]

Alder Lake-S[edit]

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo TVB Base Turbo
Core i9 12900KS 8 (16) 3.4 5.3 5.5 8 (8) 2.5 4.0 UHD 770 300–1550 30 MB 150 W 241 W April 2022 US $739
12900K 3.2 5.2 2.4 3.9 125 W November 2021 US $589
12900KF US $564
12900 2.4 5.1 1.8 3.8 UHD 770 300–1550 65 W 202 W January 2022 US $489
12900F US $464
12900T 1.4 4.9 1.0 3.6 UHD 770 300–1550 35 W 106 W US $489
Core i7 12700K 3.6 5.0 4 (4) 2.7 3.8 300–1500 25 MB 125 W 190 W November 2021 US $409
12700KF US $384
12700 2.1 4.9 1.6 3.6 UHD 770 300–1500 65 W 180 W January 2022 US $339
12700F US $314
12700T 1.4 4.7 1.0 3.4 UHD 770 300–1500 35 W 106 W US $339
Core i5 12600K 6 (12) 3.7 4.9 2.8 3.6 300–1450 20 MB 125 W 150 W November 2021 US $289
12600KF US $264
12600 3.3 4.8 UHD 770 300–1450 18 MB 65 W 117 W January 2022 US $223
12600T 2.1 4.6 35 W 74 W
12500 3.0 65 W 117 W US $202
12500T 2.0 4.4 35 W 74 W
12490F[20] 3.0 4.6 20 MB 65 W 117 W February 2022 CN ¥1599
12400 2.5 4.4 UHD 770 300–1450 18 MB January 2022 US $202
12400F US $192
12400T 1.8 4.2 UHD 730 350–1450 35 W 74 W US $202
Core i3 12300 4 (8) 3.5 4.4 12 MB 60 W 89 W US $143
12300T 2.3 4.2 35 W 69 W
12100 3.3 4.3 300–1400 60 W 89 W US $122
12100F 58 W US $97
12100T 2.2 4.1 UHD 730 300–1400 35 W 69 W US $122

Core i (13th gen)[edit]

Raptor Lake-S[edit]

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
    • E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo TVB Base Turbo
Core i9 13900KS 8 (16) 3.2 5.8 6.0 16 (16) 2.4 4.3 UHD 770 300–1650 36 MB 150 W 253 W January 2023 US $689
13900K 3.0 5.7 5.8 2.2 125 W October 2022 US $589
13900KF US $564
13900 2.0 5.5 5.6 1.5 4.2 UHD 770 300–1650 65 W 219 W January 2023 US $549
13900F US $524
13900T 1.1 5.3 0.8 3.9 UHD 770 300–1650 35 W 106 W US $549
Core i7 13790F 2.1 5.2 8 (8) 1.5 4.1 33 MB 65 W 219 W February 2023 CN ¥2999
13700K 3.4 5.4 2.5 4.2 UHD 770 300–1600 30 MB 125 W 253 W October 2022 US $409
13700KF US $384
13700 2.1 5.2 1.5 4.1 UHD 770 300–1600 65 W 219 W January 2023
13700F US $359
13700T 1.4 4.9 1.0 3.6 UHD 770 300–1600 35 W 106 W US $384
Core i5 13600K 6 (12) 3.5 5.1 2.6 3.9 300–1500 24 MB 125 W 181 W October 2022 US $319
13600KF US $294
13600 2.7 5.0 2.0 3.7 UHD 770 300–1550 65 W 154 W January 2023 US $255
13600T 1.8 4.8 1.3 3.4 35 W 92 W
13500 2.5 1.8 3.5 65 W 154 W US $232
13500T 1.6 4.6 1.2 3.2 35 W 92 W
13490F 2.5 4.8 4 (4) 1.8 3.5 65 W 148 W February 2023 CN ¥1599
13400 4.6 3.3 UHD 730 300–1550 20 MB 65 W 154 W January 2023 US $221
13400F 148 W US $196
13400T 1.3 4.4 1.0 3.0 UHD 730 300–1550 35 W 82 W US $221
Core i3 13100 4 (8) 3.4 4.5 300–1500 12 MB 60 W 89 W US $134
13100F US $109
13100T 2.5 4.2 UHD 730 300–1500 35 W 69 W US $134

Core i (14th gen)[edit]

Raptor Lake-S Refresh[edit]

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
MSRP
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo TVB Base Turbo
Core i9 14900KS 8 (16) 3.2 5.9 6.2 16 (16) 2.4 4.5 UHD 770 300–1650 36 MB 150 W 253 W March 2024 US $689
14900K 5.8 6.0 4.4 125 W October 2023 US $589
14900KF US $564
14900 2.0 5.6 5.8 1.5 4.3 UHD 770 300–1650 65 W 219 W January 2024 US $549
14900F US $524
14900T 1.1 5.5 0.9 3.7 UHD 770 300–1650 35 W 106 W US $549
Core i7 14790F 2.1 5.4 8 (8) 1.5 4.2 65 W 219 W China only
14700K 3.4 5.6 12 (12) 2.5 4.3 UHD 770 300–1600 33 MB 125 W 253 W October 2023 US $409
14700KF US $384
14700 2.1 5.4 1.5 4.2 UHD 770 300–1600 65 W 219 W January 2024
14700F US $359
14700T 1.3 5.2 0.9 3.7 UHD 770 300–1600 35 W 106 W US $384
Core i5 14600K 6 (12) 3.5 5.3 8 (8) 2.6 4.0 300–1550 24 MB 125 W 181 W October 2023 US $319
14600KF US $294
14600 2.7 5.2 2.0 3.9 UHD 770 300–1550 65 W 154 W January 2024 US $255
14600T 1.8 5.1 1.3 3.6 35 W 92 W
14500 2.6 5.0 1.9 3.7 65 W 154 W US $232
14500T 1.7 4.8 1.2 3.4 35 W 92 W
14490F 2.8 4.9 4 (4) 2.1 3.7 65 W 148 W China only
14400 2.5 4.7 1.8 3.5 UHD 730 300–1550 20 MB US $221
14400F US $196
14400T 1.5 4.5 1.1 3.2 UHD 730 300–1550 35 W 82 W US $221
Core i3 14100 4 (8) 3.5 4.7 300–1500 12 MB 60 W 110 W US $134
14100F US $109
14100T 2.7 4.4 UHD 730 300–500 35 W 69 W US $134

Mobile processors[edit]

Release timeline
Mobile processors
2009Nehalem microarchitecture (1st generation)
2010Westmere microarchitecture (1st generation)
2011Sandy Bridge microarchitecture (2nd generation)
2012Ivy Bridge microarchitecture (3rd generation)
2013Haswell microarchitecture (4th generation)
2014
2015Broadwell microarchitecture (5th generation)
Skylake microarchitecture (6th generation)
2016
2017Kaby Lake microarchitecture (7th/8th generation)
2018Coffee Lake microarchitecture (8th generation)
2019Comet Lake microarchitecture (10th generation)
Ice Lake (10th generation)
2020Tiger Lake (11th generation)
2021
2022Alder Lake (12th generation)
2023Raptor Lake (13th generation)
Raptor Lake (14th generation)

Core[edit]

Yonah[edit]


Model Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Release
price (USD)



Core Solo U1300 1.07 GHz 2 MB 533 MT/s 0.95–1.05 V
5.5 W
April 2006 $241


Core Solo U1400 1.2 GHz 2 MB 533 MT/s 0.95–1.05 V
5.5 W
Socket 479/FC-μBGA April 2006 $262


Core Solo U1500 1.33 GHz 2 MB 533 MT/s 10× 0.85–1.1 V
5.5 W
Socket 479/FC-μBGA January 2007 $262


Core Duo U2400 1.07 GHz 2 MB 533 MT/s 0.8–1.1 V
9 W
Socket 479/FC-μBGA June 2006 $262


Core Duo U2500 1.2 GHz 2 MB 533 MT/s 0.8–1.1 V
9 W
Socket 479/FC-μBGA June 2006 $289



Core Duo L2300 1.5 GHz 2 MB 667 MT/s 0.762–1.212 V
15 W
Socket 479/FC-μBGA January 2006 $284


Core Duo L2400 1.67 GHz 2 MB 667 MT/s 10× 0.762–1.212 V
15 W
Socket 479/FC-μBGA January 2006 $316


Core Duo L2500 1.83 GHz 2 MB 667 MT/s 11× 0.762–1.212 V
15 W
Socket 479/FC-μBGA September 2006 $316



Core Solo T1200 1.5 GHz 2 MB 667 MT/s 0.7625–1.3 V
27 W
Socket M July 2006


Core Solo T1250 1.73 GHz 2 MB 533 MT/s 13× 0.7625–1.3 V
31 W
Socket M


Core Solo T1300 1.67 GHz 2 MB 667 MT/s 10× 0.7625–1.3 V
27 W
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
  • Socket M
  • Socket M
January 2006 $209


Core Solo T1350 1.87 GHz 2 MB 533 MT/s 14× 0.7625–1.3 V
31 W
Socket M July 2006


Core Solo T1400 1.83 GHz 2 MB 667 MT/s 11× 0.7625–1.3 V
27 W
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
  • Socket M
  • Socket M
May 2006 $209


Core Solo T1500 2 GHz 2 MB 667 MT/s 12× 0.7625–1.3 V
27 W
  • Socket 479/FC-μBGA
  • Socket M
August 2006


Core Duo T2050 1.6 GHz 2 MB 533 MT/s 12× 0.762–1.3 V
31 W
Socket M May 2006 $140


Core Duo T2250 1.73 GHz 2 MB 533 MT/s 13× 0.762–1.3 V
31 W
Socket M May 2006 OEM


Core Duo T2300 1.67 GHz 2 MB 667 MT/s 10× 0.762–1.3 V
31 W
January 2006 $241


Core Duo T2300E 1.67 GHz 2 MB 667 MT/s 10× 0.762–1.3 V
31 W
  • Socket M
  • Socket M
  • μFCBGA-479
  • μFCBGA-479
May 2006 $209


Core Duo T2350 1.87 GHz 2 MB 533 MT/s 14× 0.762–1.3 V
31 W
Socket M OEM


Core Duo T2400 1.83 GHz 2 MB 667 MT/s 11× 0.762–1.3 V
  • 31 W
  • 31 W
  • 27 W
  • 27 W
  • Socket M
  • Socket M
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
January 2006 $294


Core Duo T2450 2 GHz 2 MB 533 MT/s 15× 0.762–1.3 V
31 W
Socket M OEM


Core Duo T2500 2 GHz 2 MB 667 MT/s 12× 0.762–1.3 V
31 W
  • Socket M
  • Socket M
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
January 2006 $423


Core Duo T2600 2.17 GHz 2 MB 667 MT/s 13× 0.762–1.3 V
31 W
  • Socket M
  • Socket M
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
January 2006 $637


Core Duo T2700 2.33 GHz 2 MB 667 MT/s 14× 0.762–1.3 V
31 W
  • Socket M
  • Socket 479/FC-μBGA
June 2006 $637


Core 2[edit]

Inside of old Sony VAIO laptop (VGN-C140G)

"Merom-L" (65 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
ultra-low voltage
Core 2 Solo ULV U2100
  • SLAGM (A1)
1 1.07 GHz 1 MB 533 MT/s 0.86–0.975 V
5.5 W
Micro-FCBGA September 2007
  • LE80537UE0041M
$241
Core 2 Solo ULV U2200
  • SLAGL (A1)
1 1.2 GHz 1 MB 533 MT/s 0.86–0.975 V
5.5 W
Micro-FCBGA September 2007
  • LE80537UE0091M
$262

"Merom", "Merom-2M" (standard-voltage, 65 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo T5200
  • SL9VP (B2)
2 1.6 GHz 2 MB 533 MT/s 12× 0.95–1.175 V
34 W
Socket M October 2006
  • LF80537GE0252M
OEM
Core 2 Duo T5250
  • SLA9S (M0)
2 1.5 GHz 2 MB 667 MT/s 0.95–1.175 V
35 W
Socket P Q2 2007
  • LF80537GF0212M
OEM
Core 2 Duo T5270
  • SLALK (M0)
2 1.4 GHz 2 MB 800 MT/s 0.95–1.175 V
35 W
Socket P October 2007
  • LF80537GG0172M
OEM
Core 2 Duo T5300
  • SL9WE (L2)
2 1.73 GHz 2 MB 533 MT/s 13× 0.95–1.175 V
34 W
Socket M Q1 2007
  • LF80537GE0302M
OEM
Core 2 Duo T5450
  • SLA4F (M0)
2 1.67 GHz 2 MB 667 MT/s 10× 0.95–1.175 V
35 W
Socket P Q2 2007
  • LF80537GF0282MT
OEM
Core 2 Duo T5470
  • SLAEB (M0)
2 1.6 GHz 2 MB 800 MT/s 0.95–1.175 V
35 W
Socket P July 2007
  • LF80537GG0252M
OEM
Core 2 Duo T5500
  • SL9SH (B2)
  • SLGFK (G2)
  • SL9U4 (L2)
2 1.67 GHz 2 MB 667 MT/s 10× 0.95–1.175 V
34 W
Socket M August 28, 2006
  • LF80537GF0282M
$209
Core 2 Duo T5500
  • SL9SQ (B2)
  • SL9U8 (L2)
2 1.67 GHz 2 MB 667 MT/s 10× 0.95–1.175 V
34 W
BGA479 August 2006
  • LE80537GF0282M
$209
Core 2 Duo T5550
  • SLA4E (M0)
2 1.83 GHz 2 MB 667 MT/s 11× 0.95–1.175 V
35 W
Socket P January 2008
  • LF80537GF0342MT
OEM
Core 2 Duo T5600
  • SL9SG (B2)
  • SL9U3 (L2)
2 1.83 GHz 2 MB 667 MT/s 11× 0.95–1.175 V
34 W
Socket M August 2006
  • LF80537GF0342M
$241
Core 2 Duo T5600
  • SL9SP (B2)
  • SL9U7 (L2)
2 1.83 GHz 2 MB 667 MT/s 11× 0.95–1.175 V
34 W
BGA479 August 2006
  • LE80537GF0342M
$241
Core 2 Duo T5670
  • SLAJ5 (M0)
2 1.8 GHz 2 MB 800 MT/s 0.95–1.175 V
35 W
Socket P Q2 2008
  • LF80537GG0332MN
OEM
Core 2 Duo T5750
  • SLA4D (M0)
2 2 GHz 2 MB 667 MT/s 12× 0.95–1.175 V
35 W
Socket P January 2008
  • LF80537GF0412M
OEM
Core 2 Duo T5800
  • SLB6E (M0)
2 2 GHz 2 MB 800 MT/s 10× 0.95–1.175 V
35 W
Socket P Q4 2008
  • LF80537GG041F
OEM
Core 2 Duo T5850[21]
  • SLA4C (M0)
2 2.17 GHz 2 MB 667 MT/s 13× 0.95–1.175 V
35 W
Socket P Q4 2008
  • LF80537GF0482M
OEM
Core 2 Duo T5870
  • SLAZR (M0)
2 2 GHz 2 MB 800 MT/s 10× 0.95–1.175 V
35 W
Socket P 2008
  • LF80537GG0412MN
OEM
Core 2 Duo T5900[22]
  • SLB6D (M0)
2 2.2 GHz 2 MB 800 MT/s 11× 0.95–1.175 V
35 W
Socket P July 2008
  • LF80537GG049F
OEM
Core 2 Duo T7100
  • SLA4A (M0)
2 1.8 GHz 2 MB 800 MT/s 0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0332M
$209
Core 2 Duo T7100
  • SLA3U (M1)
2 1.8 GHz 2 MB 800 MT/s 0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0332M
$209
Core 2 Duo T7200
  • SL9SF (B2)
2 2 GHz 4 MB 667 MT/s 12× 0.95–1.175 V
34 W
  • Socket M
August 2006
  • LF80537GF0414M
$294
Core 2 Duo T7200
  • SL9SL (B2)
2 2 GHz 4 MB 667 MT/s 12× 0.95–1.175 V
34 W
  • FCBGA6
August 2006
  • LE80537GF0414M
$294
Core 2 Duo T7250
  • SLA49 (M0)
  • SLAXH (M0)
2 2 GHz 2 MB 800 MT/s 10× 0.95–1.175 V
35 W
  • Socket P
September 2007
  • LF80537GG0412M
$290
Core 2 Duo T7250
  • SLA3T (M1)
2 2 GHz 2 MB 800 MT/s 10× 0.95–1.175 V
35 W
  • FCBGA6
September 2007
  • LE80537GG0412M
$290
Core 2 Duo T7300
  • SLAMD (G0)
  • SLA45 (E1)
2 2 GHz 4 MB 800 MT/s 10× 0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0414M
  • LF80537GG0414M
$241
Core 2 Duo T7300
  • SLA3P (E1)
  • SLAMF (G0)
2 2 GHz 4 MB 800 MT/s 10× 0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0414M
$241
Core 2 Duo T7400
  • SL9SE (B2)
  • SLGFJ (G2)
2 2.17 GHz 4 MB 667 MT/s 13× 0.95–1.175 V
34 W
  • Socket M
August 2006
  • LF80537GF0484M
$423
Core 2 Duo T7400
  • SL9SK (B2)
  • SLGFV (G2)
2 2.17 GHz 4 MB 667 MT/s 13× 0.95–1.175 V
34 W
  • FCBGA6
August 2006
  • LE80537GF0484M
$423
Core 2 Duo T7500
  • SLA44 (E1)
  • SLAF8 (G0)
2 2.2 GHz 4 MB 800 MT/s 11× 0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0494M
$316
Core 2 Duo T7500
  • SLA3N (E1)
  • SLADM (G0)
2 2.2 GHz 4 MB 800 MT/s 11× 0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0494M
$316
Core 2 Duo T7600
  • SL9SD (B2)
2 2.33 GHz 4 MB 667 MT/s 14× 0.95–1.175 V
34 W
  • Socket M
August 2006
  • LF80537GF0534M
$637
Core 2 Duo T7600
  • SL9SJ (B2)
2 2.33 GHz 4 MB 667 MT/s 14× 0.95–1.175 V
34 W
  • FCBGA6
August 2006
  • LE80537GF0534M
$637
Core 2 Duo T7600G[23]
  • SL9U5 (B2)
2 2.33 GHz 4 MB 667 MT/s 14× 0.95–1.175 V
34 W
  • Socket M
December 2006
  • LF80537GF0534MU
Core 2 Duo T7700
  • SLA43 (E1)
  • SLAF7 (G0)
2 2.4 GHz 4 MB 800 MT/s 12× 0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0564M
$530
Core 2 Duo T7700
  • SLA3M (E1)
  • SLADL (G0)
2 2.4 GHz 4 MB 800 MT/s 12× 0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0564M
$530
Core 2 Duo T7800
  • SLAF6 (G0)
2 2.6 GHz 4 MB 800 MT/s 13× 0.95–1.175 V
35 W
  • Socket P
September 2007
  • LF80537GG0644ML
$530
Core 2 Duo T7800
  • SLA75 (G0)
2 2.6 GHz 4 MB 800 MT/s 13× 0.95–1.175 V
35 W
  • FCBGA6
September 2007
  • LE80537GG0644M
$530

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo SL7100[24]
  • SLAJD
  • SLAT4
2 1.2 GHz 4 MB 800 MT/s
12 W
μFC-BGA 956
  • SY80537LG0094M
OEM
Core 2 Duo L7200
  • SL9SN (B2)
2 1.33 GHz 4 MB 667 MT/s 0.9–1.2 V
17 W
FCBGA6 Q1 2007
  • LE80537LF0144M
$284
Core 2 Duo L7300
  • SLA3S (E1)
2 1.4 GHz 4 MB 800 MT/s 0.9–1.1 V
17 W
FCBGA6 May 2007
  • LE80537LG0174M
$284
Core 2 Duo L7400
  • SL9SM (B2)
  • SLGFX (G2)
2 1.5 GHz 4 MB 667 MT/s 0.9–1.2 V
17 W
FCBGA6 Q1 2007
  • LE80537LF0214M
$316
Core 2 Duo L7500
  • SLA3R (E1)
  • SLAET (G0)
2 1.6 GHz 4 MB 800 MT/s 0.9–1.1 V
17 W
FCBGA6 May 2007
  • LE80537LG0254M
$316
Core 2 Duo SP7500[25][failed verification][26]
  • SLAT2
  • SLAEV
2 1.6 GHz 4 MB 800 MT/s 1.0–1.25 V
20 W
μFC-BGA 956
  • SY80537GG0254M
OEM
Core 2 Duo L7700
  • SLAES (G0)
2 1.8 GHz 4 MB 800 MT/s 0.9–1.1 V
17 W
FCBGA6 September 2007
  • LE80537LG0334M
$316
Core 2 Duo SP7700[25][failed verification]
  • SLALQ
  • SLALR
  • SLASZ
2 1.8 GHz 4 MB 800 MT/s 1.0–1.25 V
20 W
μFC-BGA 956
  • SY80537GG0334M
  • SY80537GG0334ML
OEM

"Merom-2M" (ultra-low-voltage, 65 nm)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo U7500
  • SLA2V (L2)
  • SLAUT (M0)
2 1.07 GHz 2 MB 533 MT/s 0.8–0.975 V
10 W
FCBGA6 (Socket M) April 2007
  • LE80537UE0042M
$262
Core 2 Duo U7500
  • SLV3X (M0)
2 1.07 GHz 2 MB 533 MT/s 0.8–0.975 V
10 W
FCBGA6 (Socket P) February 2008
  • LE80537UE0042ML
$262
Core 2 Duo U7600
  • SLA2U (L2)
  • SLAUS (M0)
2 1.2 GHz 2 MB 533 MT/s 0.8–0.975 V
10 W
FCBGA6 (Socket M) April 2007
  • LE80537UE0092M
$289
Core 2 Duo U7600
  • SLV3W (M0)
2 1.2 GHz 2 MB 533 MT/s 0.8–0.975 V
10 W
FCBGA6 (Socket P) April 2007
  • LE80537UE0092ML
$289
Core 2 Duo U7700
  • SLA6X (L2)
  • SLAUR (M0)
2 1.33 GHz 2 MB 533 MT/s 10× 0.8–0.975 V
10 W
FCBGA6 (Socket M) December 2007
  • LE80537UE0142M
$289
Core 2 Duo U7700
  • SLV3V (M0)
2 1.33 GHz 2 MB 533 MT/s 10× 0.8–0.975 V
10 W
FCBGA6 (Socket P) February 2008
  • LE80537UE0142ML
$289

"Merom XE" (65 nm) [edit]

These models feature an unlocked clock multiplier

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Extreme X7800
  • SLA6Z (E1)
2 2.6 GHz 4 MB 800 MT/s 13× 1.0375–1.3 V
44 W
Socket P July 2007
  • LF80537GG0644M
$851
Core 2 Extreme X7900
  • SLA33 (E1)
  • SLAF4 (G0)
2 2.8 GHz 4 MB 800 MT/s 14× 1.0375–1.3 V
44 W
Socket P August 2007
  • LF80537GG0724M
$851

"Penryn-L" (45 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Small Form Factor, ultra-low voltage
Core 2 Solo SU3300
  • SLGAR (M0)
  • SLGAJ (R0)
1 1.2 GHz 3 MB 800 MT/s 1.05–1.15 V
5.5 W
μFC-BGA 956 May 2008
  • AV80585UG0093M
$262
Core 2 Solo SU3500
  • SLGFM (R0)
1 1.4 GHz 3 MB 800 MT/s 1.05–1.15 V
5.5 W
μFC-BGA 956 Q2 2009
  • AV80585UG0173M
$262

"Penryn" (Apple iMac specific, 45 nm)[edit]

  • Die size: 107 mm2
  • The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
  • Steppings: C0, E0
Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo E8135
  • SLAQA (C0)
2 2.4 GHz 6 MB 1066 MT/s
44 W
Socket P April 2008
  • FF80576E8135
  • FF80576GH0676M
Core 2 Duo E8135
  • SLG8W (E0)
2 2.67 GHz 6 MB 1066 MT/s 10×
44 W
Socket P March 2009
  • AW80576GH0676M
  • AW80576E8135
Core 2 Duo E8135
  • SLGED (E0)
2 2.67 GHz 6 MB 1066 MT/s 10×
35 W
Socket P March 2009
  • AW80576GH0676M
Core 2 Duo E8235
  • SLAQB (C0)
2 2.8 GHz 6 MB 1066 MT/s 10.5×
44 W
Socket P April 2008
  • FF80576GH0726M
Core 2 Duo E8335
  • SLAQC (C0)
2 2.93 GHz 6 MB 1066 MT/s 11×
44 W
Socket P April 2008
  • FF80576GH0776M
Core 2 Duo E8335
  • SLGEB (E0)
2 2.93 GHz 6 MB 1066 MT/s 11× 1.0500–1.2250 V
35 W
Socket P March 2009
  • AW80576GH0776M
Core 2 Duo E8435
  • SLAQD (C0)
2 3.07 GHz 6 MB 1066 MT/s 11.5× 1.0500–1.2375 V
55 W
Socket P April 2008
  • FF80576GH0836M
Core 2 Duo E8435
  • SLGEA (E0)
2 3.07 GHz 6 MB 1066 MT/s 11.5×
44 W
Socket P March 2009
  • AW80576GH0836M

"Penryn", "Penryn-3M" (standard-voltage, 45 nm) [edit]

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo T6400
  • SLGJ4 (R0)
2 2 GHz 2 MB 800 MT/s 10× 1.00–1.250 V
35 W
January 2009
  • AW80577GG0412MA
OEM
Core 2 Duo T6500
  • SLGF4 (R0)
2 2.1 GHz 2 MB 800 MT/s 10.5× 1.00–1.250 V
35 W
Socket P January 2009
  • AW80577GG0452ML
  • AW80577GG0452MA
OEM
Core 2 Duo T6570
  • SLGLL (R0)
2 2.1 GHz 2 MB 800 MT/s 10.5× 1.00–1.250 V
35 W
Socket P Q3 2009
  • AW80577GG0452MH
OEM
Core 2 Duo T6600
  • SLGJ9 (R0)
  • SLGF5 (R0)
2 2.2 GHz 2 MB 800 MT/s 11× 1.00–1.250 V
35 W
Socket P January 2009
  • AW80577GG0492MA
  • AW80577GG0492ML
OEM
Core 2 Duo T6670
  • SLGLK (R0)
  • SLGLJ (R0)
2 2.2 GHz 2 MB 800 MT/s 11× 1.00–1.250 V
35 W
Socket P Q3 2009
  • AW80577GG0492MH
OEM
Core 2 Duo T6900
  • SLGHZ (?)
2 2.5 GHz 2 MB 800 MT/s 12.5× 1.00–1.250 V
35 W
Socket P ?
  • AW80577GG0602MA
OEM
Core 2 Duo T6970
  • SLGLJ (R0)
2 2.5 GHz 2 MB 800 MT/s 12.5× 1.00–1.250 V
35 W
Socket P ?
  • AW80577GG0602MH
OEM
Core 2 Duo T8100
  • SLAP9 (M0)
  • SLAVJ (M0)
  • SLAYP (M0)
  • SLAYZ (C0)
  • SLAUU (C0)
2 2.1 GHz 3 MB 800 MT/s 10.5× 1.000–1.250 V
35 W
Socket P January 2008
  • FF80577GG0453M (M0)
  • FF80577GG0453MN
  • FF80576GG0453M (C0)
  • BX80577T8100
$209
Core 2 Duo T8100
  • SLAPS (M0)
  • SLAXG (M0)
  • SLAPT (C0)
  • SLAZD (C0)
2 2.1 GHz 3 MB 800 MT/s 10.5× 1.000–1.250 V
35 W
FCBGA6 January 2008
  • EC80577GG0453M (M0)
  • EC80576GG0453M (C0)
$209
Core 2 Duo T8300
  • SLAPA (M0)
  • SLAYQ (M0)
2 2.4 GHz 3 MB 800 MT/s 12× 1.00–1.250 V
35 W
Socket P January 2008
  • FF80577GG0563M
  • BX80577T8300
$241
Core 2 Duo T8300
  • SLAPR (M0)
  • SLAPU (C0)
  • SLAZC (C0)
2 2.4 GHz 3 MB 800 MT/s 12× 1.00–1.250 V
35 W
FCBGA6 January 2008
  • EC80577GG0563M (M0)
  • EC80576GG0563M (C0)
$241
Core 2 Duo T9300
  • SLAQG (C0)
  • SLAYY (C0)
2 2.5 GHz 6 MB 800 MT/s 12.5× 1.000–1.250 V
35 W
Socket P January 2008
  • FF80576GG0606M
$316
Core 2 Duo T9300
  • SLAPV (C0)
  • SLAZB (C0)
2 2.5 GHz 6 MB 800 MT/s 12.5× 1.000–1.250 V
35 W
FCBGA6 January 2008
  • EC80576GG0606M
$316
Core 2 Duo T9400
  • SLB46 (C0)
  • SLB4D (C0)
  • SLGE5 (E0)
2 2.53 GHz 6 MB 1066 MT/s 9.5× 1.050–1.162 V
35 W
Socket P July 2008
  • AW80576GH0616M
$316
Core 2 Duo T9400
  • SL3BX (C0)
  • SLGEK (E0)
2 2.53 GHz 6 MB 1066 MT/s 9.5× 1.050–1.162 V
35 W
FCBGA6 July 2008
  • AV80576GH0616M
$316
Core 2 Duo T9500
  • SLAQH (C0)
  • SLAYX (C0)
2 2.6 GHz 6 MB 800 MT/s 13× 1.000–1.250 V
35 W
Socket P January 2008
  • FF80576GG0646M
$530
Core 2 Duo T9500
  • SLAPW (C0)
  • SLAZA (C0)
  • SLB49 (C0)
  • SLB4A (C0)
2 2.6 GHz 6 MB 800 MT/s 13× 1.000–1.250 V
35 W
FCBGA6 January 2008
  • EC80576GG0646M
  • AV80576SH0616M
$530
Core 2 Duo T9550
  • SLGE4 (E0)
2 2.67 GHz 6 MB 1066 MT/s 10× 1.050–1.212 V
35 W
Socket P December 2008
  • AW80576GH0676MG
$316
Core 2 Duo T9550
  • SLGEL (E0)
2 2.67 GHz 6 MB 1066 MT/s 10× 1.050–1.212 V
35 W
FCBGA6 December 2008
  • AV80576GH0676MG
$316
Core 2 Duo T9600
  • SLB47 (C0)
  • SLG8N (C0)
  • SLG9F (E0)
2 2.8 GHz 6 MB 1066 MT/s 10.5× 1.050–1.162 V
35 W
Socket P July 2008
  • AW80576GH0726M
$530
Core 2 Duo T9600
  • SLB43 (C0)
  • SLGEM (E0)
2 2.8 GHz 6 MB 1066 MT/s 10.5× 1.050–1.162 V
35 W
FCBGA6 July 2008
  • AV80576GH0726M
$530
Core 2 Duo T9800
  • SLGES (E0)
2 2.93 GHz 6 MB 1066 MT/s 11× 1.050–1.212 V
35 W
Socket P December 2008
  • AW80576GH0776MG
$530
Core 2 Duo T9800
  • SLGEP (E0)
2 2.93 GHz 6 MB 1066 MT/s 11× 1.050–1.212 V
35 W
FCBGA6 December 2008
  • AV80576GH0776MG
$530
Core 2 Duo T9900
  • SLGEE (E0)
2 3.07 GHz 6 MB 1066 MT/s 11.5× 1.050–1.2125 V
35 W
Socket P April 2009
  • AW80576GH0836MG
$530
Core 2 Duo T9900
  • SLGKH (E0)
2 3.07 GHz 6 MB 1066 MT/s 11.5× 1.050–1.2125 V
35 W
FCBGA6 April 2009
  • AV80576GH0836MG
$530

"Penryn", "Penryn-3M" (medium-voltage, 45 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo P7350
  • SLB44 (C0)
  • SLB53 (M0)
2 2 GHz 3 MB 1066 MT/s 7.5× 1.00–1.250 V
25 W
Socket P Mid 2008
  • AW80576GH0413M
  • AW80577SH0413M
OEM
Core 2 Duo P7350
  • SLG8E (C0)
  • SLGE3 (R0)
2 2 GHz 3 MB 1066 MT/s 7.5× 1.00–1.250 V
25 W
FC-BGA478 Mid 2008 OEM
Core 2 Duo P7370
  • SLG8X (R0)
  • SLGF9 (R0)
2 2 GHz 3 MB 1066 MT/s 7.5× 1.00–1.250 V
25 W
Socket P January 2009
  • AW80577SH0413M
  • AW80577SH0413ML
OEM
Core 2 Duo P7450
  • SLB45 (C0)
  • SLGF7 (R0)
  • SLB54 (M0)
  • SLB56 (M0)
2 2.13 GHz 3 MB 1066 MT/s 1.00–1.250 V
25 W
Socket P January 2009
  • AW80577SH0463M
  • AW80576GH0463M (C0)
OEM
Core 2 Duo P7450
  • SLGFF (C0)
2 2.13 GHz 3 MB 1066 MT/s 1.00–1.250 V
25 W
FC-BGA478 January 2009
  • AW80577P7450M (C0)
OEM
Core 2 Duo P7550
  • SLGF8 (R0)
2 2.27 GHz 3 MB 1066 MT/s 8.5× 1.00–1.250 V
25 W
Socket P June 2009
  • AW80577SH0513MA
OEM
Core 2 Duo P7570
  • SLGLW (R0)
2 2.27 GHz 3 MB 1066 MT/s 8.5× 1.00–1.250 V
25 W
Socket P Q3 2009
  • AW80577SH0513ML
OEM
Core 2 Duo P8400
  • SLB3R (M0)
  • SLB3Q (M0)
  • SLB52 (M0)
  • SLG8Z (M0)
  • SLGCC (R0)
  • SLGCQ (R0)
  • SLGCF (R0)
  • SLGFC (R0)
  • SLGCL (R0)
2 2.27 GHz 3 MB 1066 MT/s 8.5× 1.00–1.250 V
25 W
Socket P June 13, 2008[34]
  • AW80577SH0513M
  • AW80577SH0513MN
  • BX80577P8400
$209
Core 2 Duo P8400
  • SLB4M (M0)
2 2.27 GHz 3 MB 1066 MT/s 8.5× 1.00–1.250 V
25 W
FC-BGA478 June 2008
  • AV80577SH0513M
$209
Core 2 Duo P8600
  • SLB3S (M0)
  • SLGA4 (M0)
  • SLGFD (R0)
2 2.4 GHz 3 MB 1066 MT/s 1.00–1.250 V
25 W
Socket P June 2008[35]
  • AW80577SH0563M
  • BX80577P8600
$241
Core 2 Duo P8600
  • SLB4N (M0)
  • SLGDZ (R0)
2 2.4 GHz 3 MB 1066 MT/s 1.00–1.250 V
25 W
FC-BGA478 June 2008
  • AV80577SH0563M
$241
Core 2 Duo P8700
  • SLGFE (R0)
2 2.53 GHz 3 MB 1066 MT/s 9.5× 1.00–1.250 V
25 W
Socket P December 2008
  • AW80577SH0613MG
  • BX80577P8700
$241
Core 2 Duo P8700
  • SLGFG (R0)
2 2.53 GHz 3 MB 1066 MT/s 9.5× 1.00–1.250 V
25 W
FC-BGA478 December 2008
  • AV80577SH0613MG
$241
Core 2 Duo P8800
  • SLGLR (R0)
2 2.67 GHz 3 MB 1066 MT/s 10× 1.00–1.250 V
25 W
Socket P Q2 2009
  • AW80577SH0673MG
  • BX80577P8800
$241
Core 2 Duo P8800
  • SLGLA (E0)
2 2.67 GHz 3 MB 1066 MT/s 10× 1.00–1.250 V
25 W
FC-BGA478 Q2 2009
  • AV80577SH0673MG
$241
Core 2 Duo P9500
  • SLB4E (C0)
  • SLGE8 (E0)
2 2.53 GHz 6 MB 1066 MT/s 9.5× 1.05–1.162 V
25 W
Socket P July 2008
  • AW80576SH0616M
  • AV80576SH0616M
$348
Core 2 Duo P9600
  • SLGE6 (E0)
2 2.67 GHz 6 MB 1066 MT/s 10× 1.05–1.212 V
25 W
Socket P December 2008
  • AW80576SH0676MG
$348
Core 2 Duo P9700
  • SLGQS (E0)
2 2.8 GHz 6 MB 1066 MT/s 10.5× 1.012–1.175 V
28 W
Socket P June 2009
  • AW80576SH0726MG
$348

"Penryn" (medium-voltage, 45 nm, Small Form Factor)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo SP9300
  • SLB63 (C0)
2 2.27 GHz 6 MB 1066 MT/s 8.5× 0.900–1.225 V
25 W
μFC-BGA 956 July 2008
  • AV80576SH0516M
$284
Core 2 Duo SP9400
  • SLB64 (C0)
  • SLGHG (C0)
  • SLGAA (E0)
2 2.4 GHz 6 MB 1066 MT/s 0.900–1.225 V
25 W
μFC-BGA 956 July 2008
  • AV80576SH0566M
$284
Core 2 Duo SP9600
  • SLGER (E0)
2 2.53 GHz 6 MB 1066 MT/s 9.5× 0.900–1.225 V
25 W
μFC-BGA 956 Q1 2009
  • AV80576SH0516M
  • AV80576SH0616M
$316

"Penryn" (low-voltage, 45 nm, Small Form Factor)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo SL9300
  • SLB65 (C0)
  • SLGHC (C0)
  • SLGAG (E0)
2 1.6 GHz 6 MB 1066 MT/s 1.050–1.150 V
17 W
μFC-BGA 956 September 2008
  • AV80576LH0256M
$284
Core 2 Duo SL9380
  • SLGA2 (C0)
  • SLGAD (E0)
2 1.8 GHz 6 MB 800 MT/s 1.050–1.150 V
17 W
μFC-BGA 956 September 2008
  • AV80576LG0336M
$316
Core 2 Duo SL9400
  • SLB66 (C0)
  • SLGHD (C0)
  • SLGAB (E0)
2 1.87 GHz 6 MB 1066 MT/s 1.050–1.150 V
17 W
μFC-BGA 956 September 2008
  • AV80576LH0366M
$316
Core 2 Duo SL9600
  • SLGEQ (E0)
2 2.13 GHz 6 MB 1066 MT/s 1.050–1.150 V
17 W
μFC-BGA 956 Q1'09
  • AV80576LH0466M
$316

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)[edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Duo SU7300
  • SLGS6 (R0)
  • SLGYV (R0)
2 1.3 GHz 3 MB 800 MT/s 6.5× 1.05–1.15 V 10 W μFC-BGA 956 September 2009
  • AV80577UG0133M
  • AV80577UG0133ML
$289
Core 2 Duo SU9300
  • SLB5Q (M0)
  • SLGAL (R0)
2 1.2 GHz 3 MB 800 MT/s 1.05–1.15 V 10 W μFC-BGA 956 September 2008
  • AV80577UG0093M
$262
Core 2 Duo SU9400
  • SLB5V (M0)
  • SLGHN (M0)
  • SLGAK (R0)
2 1.4 GHz 3 MB 800 MT/s 1.05–1.15 V 10 W μFC-BGA 956 September 2008
  • AV80577UG0173M
$289
Core 2 Duo SU9600
  • SLGEX (R0)
  • SLGFN (R0)
2 1.6 GHz 3 MB 800 MT/s 1.05–1.15 V 10 W μFC-BGA 956 Q1 2009
  • AV80577UG0253M
$289

"Penryn XE" (45 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Extreme X9000
  • SLAQJ (C0)
  • SLAZ3 (C0)
2 2.8 GHz 6 MB 800 MT/s 14× 1.062–1.150 V
44 W
Socket P January 2008
  • FF80576ZG0726M
$851
Core 2 Extreme X9100
  • SLB48 (C0)
  • SLG8M (C0)
  • SLGE7 (E0)
2 3.07 GHz 6 MB 1066 MT/s 11.5× 1.062–1.150 V
44 W
Socket P July 2008
  • AW80576GH0836M
$851

"Penryn QC" (45 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Quad Q9000
  • SLGEJ (E0)
4 2 GHz 2 × 3 MB 1066 MT/s 7.5× 1.050–1.175 V
45 W
Socket P December 2008
  • AW80581GH0416M
  • BX80581Q9000
$348
Core 2 Quad Q9100
  • SLB5G (E0)
4 2.27 GHz 2 × 6 MB 1066 MT/s 8.5× 1.050–1.175 V
45 W
Socket P August 2008
  • AW80581GH051003
$851

"Penryn QC XE" (45 nm) [edit]

Model sSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release date Part
number(s)
Release
price (USD)
Core 2 Extreme QX9300
  • SLB5J (E0)
4 2.53 GHz 2 × 6 MiB 1066 MT/s 9.5× 1.050–1.175 V
45 W
Socket P August 2008
  • AW80581ZH061003
$1038

Core i (1st gen)[edit]

Clarksfield[edit]

Common features:

  • Socket: G1.
  • All the CPUs support dual-channel DDR3-1333 RAM.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • XM-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
Base Turbo
Core i7 940XM 4 (8) 2.13 3.33 8 MB 55 W June 2010
920XM 2.00 3.20 September 2009
840QM 1.86 45 W June 2010
820QM 1.73 3.06 September 2009
740QM 2.93 6 MB June 2010
720QM 1.60 2.80 September 2009

Arrandale[edit]

Common features:

  • Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 680UM 2 (4) 1.46 2.53 HD Graphics 166–500 4 MB 18 W September 2010
660LM 2.26 3.06 266–566 25 W
660UM 1.33 2.40 166–500 18 W May 2010
640M 2.80 3.46 500–766 35 W September 2010
640LM 2.13 2.93 266–566 25 W January 2010
640UM 1.20 2.27 166–500 18 W
620M 2.66 3.33 500–766 35 W
620LM 2.00 2.80 266–566 25 W
620UM 1.06 2.13 166–500 18 W
Core i5 580M 2.66 3.33 500–766 3 MB 35 W September 2010
560M 3.20
560UM 1.33 2.13 166–500 18 W
540M 2.53 3.07 500–766 35 W January 2010
540UM 1.20 2.00 166–500 18 W May 2010
520M 2.40 2.93 500–766 35 W January 2010
520UM 1.07 1.87 166–500 18 W
480M 2.66 2.93 500–766 35 W January 2011
470UM 1.33 1.86 166–500 18 W October 2010
460M 2.53 2.80 500–766 35 W September 2010
450M 2.40 2.66 June 2010
430M 2.26 2.53 January 2010
430UM 1.20 1.73 166–500 18 W May 2010
Core i3 390M 2.66 500–667 35 W January 2011
380M 2.53 September 2010
380UM 1.33 166–500 18 W October 2010
370M 2.40 500–667 35 W June 2010
350M 2.26 January 2010
330M 2.13
330UM 1.20 166–500 18 W May 2010

Core i (2nd gen)[edit]

Sandy Bridge-M[edit]

Common features:

  • Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • XM-suffix models have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 2960XM 4 (8) 2.7 3.7 HD 3000 650–1300 8 MB 55 W September 2011
2920XM 2.5 3.5 January 2011
2860QM 3.6 45 W September 2011
2820QM 2.3 3.4 January 2011
2760QM 2.4 3.5 6 MB September 2011
2720QM 2.2 3.3 January 2011
2675QM 3.1 650–1200 October 2011
2670QM 650–1100
2635QM 2.0 2.9 650–1200 January 2011
2630QM 650–1100
2677M 2 (4) 1.8 2.9 350–1200 4 MB 17 W June 2011
2657M 1.6 2.7 350–1000 February 2011
2640M 2.8 3.5 650–1300 35 W September 2011
2649M 2.3 3.2 500–1100 25 W February 2011
2637M 1.7 2.8 350–1200 17 W June 2011
2620M 2.7 3.4 650–1300 35 W February 2011
2629M 2.1 3.0 500–1100 25 W
2617M 1.5 2.6 350–950 17 W
Core i5 2557M 1.7 2.7 350–1200 3 MB June 2011
2540M 2.6 3.3 650–1300 35 W February 2011
2537M 1.4 2.3 350–900 17 W
2520M 2.5 3.2 650–1300 35 W
2467M 1.6 2.3 350–1150 17 W June 2011
2450M 2.5 3.1 650–1300 35 W January 2012
2435M 2.4 3.0 September 2011
2430M 650–1200 October 2011
2415M 2.3 2.9 650–1300 Q1 2011
2410M 650–1200 February 2011
Core i3 2370M 2.4 650–1150 January 2012
2377M 1.5 350–1000 17 W September 2012
2375M Q1 2013
2367M 1.4 October 2011
2365M September 2012
2350M 2.3 650–1150 35 W October 2011
2357M 1.3 350–950 17 W June 2011
2348M 2.3 650–1150 35 W January 2013
2332M[36] 2.2 650–1100 September 2011
2330M June 2011
2328M September 2012
2312M 2.1 Q2 2011
2310M February 2011
2308M[37] Q3 2012

Core i (3rd gen)[edit]

Ivy Bridge[edit]

Common features:

  • Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
  • All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • XM-suffix models have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 3940XM 4 (8) 3.0 3.9 HD 4000 650–1350 8 MB 55 W September 2012
3920XM 2.9 3.8 650–1300 April 2012
3840QM 2.8 45 W September 2012
3820QM 2.7 3.7 650–1250 April 2012
3740QM 650–1300 6 MB September 2012
3720QM 2.6 3.6 650–1250 April 2012
3635QM 2.4 3.4 650–1200 September 2012
3630QM 650–1150
3632QM 2.2 3.2 35 W October 2012
3615QM 2.3 3.3 650–1200 45 W April 2012
3610QM 650–1100
3612QM 2.1 3.1 35 W
3687U 2 (4) 2.1 3.3 350–1200 4 MB 17 W January 2013
3689Y 1.5 2.6 350–850 13 W
3667U 2.0 3.2 350–1150 17 W June 2012
3540M 3.0 3.7 650–1300 35 W January 2013
3537U 2.0 3.1 350–1200 17 W
3520M 2.9 3.6 650–1250 35 W June 2012
3517U 1.9 3.0 350–1150 17 W
Core i5 3437U 2.9 650–1200 3 MB January 2013
3439Y 1.5 2.3 350–850 13 W
3427U 1.8 2.8 350–1150 17 W June 2012
3380M 2.9 3.6 650–1250 35 W January 2013
3360M 2.8 3.5 650–1200 June 2012
3340M 2.7 3.4 650–1250 January 2013
3337U 1.8 2.7 350–1100 17 W
3339Y 1.5 2.0 350–850 13 W
3320M 2.6 3.3 650–1200 35 W June 2012
3317U 1.7 2.6 350–1050 17 W
3230M 2.6 3.2 650–1100 35 W January 2013
3210M 2.5 3.1 June 2012
Core i3 3227U 1.9 350–1100 17 W January 2013
3229Y 1.4 350–850 13 W
3217U 1.8 350–1050 17 W June 2012
3130M 2.6 650–1100 35 W January 2013
3120M 2.5 September 2012
3110M 2.4 650–1000 June 2012

Core i (4th gen)[edit]

Haswell-MB[edit]

Common features:

  • Socket: G3.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • MX-suffix models have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4940MX 4 (8) 3.1 4.0 HD 4600 400–1350 8 MB 57 W February 2014
4930MX 3.0 3.9 June 2013
4910MQ 2.9 400–1300 47 W February 2014
4900MQ 2.8 3.8 June 2013
4810MQ 6 MB February 2014
4800MQ 2.7 3.7 June 2013
4710MQ 2.5 3.5 400–1150 April 2014
4712MQ 2.3 3.3 37 W
4700MQ 2.4 3.4 47 W June 2013
4702MQ 2.2 3.2 37 W
4610M 2 (4) 3.0 3.7 400–1300 4 MB February 2014
4600M 2.9 3.6 September 2013
Core i5 4340M 400–1250 3 MB February 2014
4330M 2.8 3.5 September 2013
4310M 2.7 3.4 February 2014
4300M 2.6 3.3 September 2013
4210M 3.2 400–1150 April 2014
4200M 2.5 3.1 September 2013
Core i3 4110M 2.6 400–1100 April 2014
4100M 2.5 September 2013
4010M[38] Q3 2014
4000M 2.4 September 2013

Haswell-ULT[edit]

Common features:

  • Socket: BGA 1168.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4650U 2 (4) 1.7 3.3 HD 5000 200–1100 4 MB 15 W June 2013
4600U 2.1 HD 4400 September 2013
4578U 3.0 3.5 Iris 5100 200–1200 28 W July 2014
4558U 2.8 3.3 June 2013
4550U 1.5 3.0 HD 5000 200–1100 15 W
4510U 2.0 3.1 HD 4400 April 2014
4500U 1.8 3.0 June 2013
Core i5 4360U 1.5 HD 5000 3 MB February 2014
4350U 1.4 2.9 June 2013
4310U 2.0 3.0 HD 4400 February 2014
4308U 2.8 3.3 Iris 5100 200–1200 28 W July 2014
4300U 1.9 2.9 HD 4400 200–1100 15 W September 2013
4288U 2.6 3.1 Iris 5100 200–1200 28 W June 2013
4278U 200–1100 July 2014
4260U 1.4 2.7 HD 5000 200–1000 15 W April 2014
4258U 2.4 2.9 Iris 5100 200–1100 28 W June 2013
4250U 1.3 2.6 HD 5000 200–1000 15 W
4210U 1.7 2.7 HD 4400 April 2014
4200U 1.6 2.6 June 2013
Core i3 4158U 2.0 Iris 5100 200–1100 28 W
4120U HD 4400 200–1000 15 W April 2014
4100U 1.8 June 2013
4030U 1.9 April 2014
4025U 200–950
4010U 1.7 200–1000 June 2013
4005U 200–950 September 2013

Haswell-ULX[edit]

Common features:

  • Socket: BGA 1168.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4610Y 2 (4) 1.7 2.9 HD 4200 200–850 4 MB 11.5 W September 2013
Core i5 4302Y 1.6 2.3 3 MB
4300Y
4220Y 2.0 April 2014
4210Y 1.5 1.9 September 2013
4202Y 1.6 2.0
4200Y 1.4 1.9 June 2013
Core i3 4030Y 1.6 April 2014
4020Y 1.5 September 2013
4012Y
4010Y 1.3 June 2013

Haswell-H[edit]

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 22 nm.
  • i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4980HQ 4 (8) 2.8 4.0 Iris Pro 5200 200–1300 6 MB 47 W July 2014
4960HQ 2.6 3.8 September 2013
4950HQ 2.4 3.6 June 2013
4870HQ 2.5 3.7 200–1200 July 2014
4860HQ 2.4 3.6 February 2014
4850HQ 2.3 3.5 June 2013
4770HQ 2.2 3.4 July 2014
4760HQ 2.1 3.3 April 2014
4750HQ 2.0 3.2 June 2013
4720HQ 2.6 3.6 HD 4600 400–1200 January 2015
4722HQ 2.4 3.4 400–1150 37 W
4710HQ 2.5 3.5 400–1200 47 W April 2014
4712HQ 2.3 3.3 400–1150 37 W
4700HQ 2.4 3.4 400–1200 47 W June 2013
4702HQ 2.2 3.2 400–1150 37 W
Core i5 4210H 2 (4) 2.9 3.5 3 MB 47 W July 2014
4200H 2.8 3.4 September 2013

Core i (5th gen)[edit]

Broadwell-U[edit]

Common features:

  • Socket: BGA 1168.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 5650U 2 (4) 2.2 3.2 HD 6000 300–1000 4 MB 15 W January 2015
5600U 2.6 HD 5500 300–950
5557U 3.1 3.4 Iris 6100 300–1100 28 W
5550U 2.0 3.0 HD 6000 300–1000 15 W
5500U 2.4 HD 5500 300–950
Core i5 5350U 1.8 2.9 HD 6000 300–1000 3 MB
5300U 2.3 HD 5500 300–900
5287U 2.9 3.3 Iris 6100 300–1100 28 W
5257U 2.7 3.1 300–1050
5250U 1.6 2.7 HD 6000 300–1000 15 W
5200U 2.2 HD 5500 300–900
Core i3 5157U 2.5 Iris 6100 300–1000 28 W
5020U 2.2 HD 5500 300–900 15 W March 2015
5015U 2.1 300–850
5010U 300–900 January 2015
5005U 2.0 300–850

Broadwell-H[edit]

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 5950HQ 4 (8) 2.9 3.7 Iris Pro 6200 300–1150 6 MB 47 W June 2015
5850HQ 2.7 3.6 300–1100
5750HQ 2.5 3.4 300–1050
5700HQ 2.7 3.5 HD 5600
Core i5 5350H 2 (4) 3.1 Iris Pro 6200 4 MB

Core M (5th gen)[edit]

Broadwell-Y[edit]

Common features:

  • Socket: BGA 1234.
  • All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core M 5Y71 2 (4) 1.2 2.9 HD 5300 300–900 4 MB 4.5 W October 2014
5Y70 1.1 2.6 100–850 September 2014
5Y51 300–900 October 2014
5Y31 0.9 2.4 300–850
5Y10c 0.8 2.0 300–800
5Y10a 100–800 September 2014
5Y10

Core i (6th gen)[edit]

Skylake-U[edit]

Common features:

  • Socket: BGA 1356.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6660U 2 (4) 2.4 3.4 Iris 540 300–1050 4 MB 15 W March 2016
6650U 2.2 September 2015
6600U 2.6 HD 520
6567U 3.3 3.6 Iris 550 300–1100 28 W
6560U 2.2 3.2 Iris 540 300–1050 15 W
6500U 2.5 3.1 HD 520
6498DU HD 510 December 2015
Core i5 6360U 2.0 Iris 540 300–1000 3 MB September 2015
6300U 2.4 3.0 HD 520
6287U 3.1 3.5 Iris 550 300–1100 4 MB 28 W
6267U 2.9 3.3 300–1050
6260U 1.8 2.9 Iris 540 300–950 15 W
6200U 2.3 2.8 HD 520 300–1000 3 MB
6198DU HD 510 December 2015
Core i3 6167U 2.7 Iris 550 28 W
6157U 2.4 September 2016
6100U 2.3 HD 520 15 W September 2015
6006U 2.0 300–900 November 2016

Skylake-H[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6970HQ 4 (8) 2.8 3.7 Iris Pro 580 350–1050 8 MB 45 W January 2016
6920HQ 2.9 3.8 HD 530 September 2015
6870HQ 2.7 3.6 Iris Pro 580 350–1000 January 2016
6820HQ HD 530 350–1050 September 2015
6820HK
6770HQ 2.6 3.5 Iris Pro 580 350–950 6 MB January 2016
6700HQ HD 530 350–1050 September 2015
Core i5 6440HQ 4 (4) 350–950
6350HQ 2.3 3.2 Iris Pro 580 350–900 February 2016
6300HQ HD 530 350–950 September 2015
Core i3 6100H 2 (4) 2.7 350–900 3 MB 35 W

Core M (6th gen)[edit]

Skylake-Y[edit]

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core m7 6Y75 2 (4) 1.2 3.1 HD 515 300–1000 4 MB 4.5 W September 2015
Core m5 6Y57 1.1 2.8 300–900
6Y54 2.7
Core m3 6Y30 0.9 2.2 300–850

Core i (7th gen)[edit]

Kaby Lake-U[edit]

Common features:

  • Socket: BGA 1356.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 7660U 2 (4) 2.5 4.0 Iris Plus 640 300–1100 4 MB 15 W January 2017
7600U 2.8 3.9 HD 620 300–1150
7567U 3.5 4.0 Iris Plus 650 28 W
7560U 2.4 3.8 Iris Plus 640 300–1050 15 W
7500U 2.7 3.5 HD 620 September 2016
Core i5 7360U 2.3 3.6 Iris Plus 640 300–1000 January 2017
7300U 2.6 3.5 HD 620 300–1100 3 MB
7287U 3.3 3.7 Iris Plus 650 4 MB 28 W
7267U 3.1 3.5 300–1050
7260U 2.2 3.4 Iris Plus 640 300–950 15 W
7200U 2.5 3.1 HD 620 300–1000 3 MB September 2016
Core i3 7167U 2.8 Iris Plus 650 28 W January 2017
7130U 2.7 HD 620 15 W June 2017
7100U 2.4 September 2016
7020U 2.3 Q2 2018

Kaby Lake-H[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 7920HQ 4 (8) 3.1 4.1 HD 630 350–1100 8 MB 45 W January 2017
7820HK 2.9 3.9
7820HQ
7700HQ 2.8 3.8 6 MB
Core i5 7440HQ 4 (4) 300–1000
7300HQ 2.5 3.5
Core i3 7100H 2 (4) 3.0 300–950 3 MB 35 W

Kaby Lake-Y[edit]

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 7Y75 2 (4) 1.3 3.6 HD 615 300–1050 4 MB 4.5 W September 2016
Core i5 7Y57 1.2 3.3 300–950 January 2017
7Y54 3.2 September 2016

Core M (7th gen)[edit]

Kaby Lake-Y[edit]

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core m3 7Y32 2 (4) 1.1 3.0 HD 615 300–900 4 MB 4.5 W April 2017
7Y30 1.0 2.6 September 2016

Core i (8th gen)[edit]

Coffee Lake-U[edit]

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8569U 4 (8) 2.8 4.7 Iris Plus 655 300–1200 8 MB 28 W May 2019
8559U 2.7 4.5 April 2019
8557U 1.7 Iris Plus 645 300–1150 15 W July 2019
Core i5 8279U 2.4 4.1 Iris Plus 655 6 MB 28 W May 2019
8269U 2.6 4.2 300–1100 April 2018
8260U 1.6 3.9 UHD 620 15 W Q4 2019
8259U 2.3 3.8 Iris Plus 655 300–1050 28 W April 2018
8257U 1.4 3.9 Iris Plus 645 15 W July 2019
Core i3 8140U 2 (4) 2.1 UHD 620 300–1000 4 MB 15 W Q4 2019
8109U 3.0 3.6 Iris Plus 655 300–1050 28 W April 2018

Coffee Lake-H[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i9 8950HK 6 (12) 2.9 4.8 UHD 630 350–1200 12 MB 45 W April 2018
Core i7 8850H 2.6 4.3 350–1150 9 MB
8750H 2.2 4.1 350–1100
Core i5 8400H 4 (8) 2.5 4.2 8 MB
8300H 2.3 4.0 350–1000
Core i3 8100H 4 (4) 3.0 6 MB July 2018

Coffee Lake-B[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8700B 6 (12) 3.2 4.6 UHD 630 350–1200 12 MB 65 W April 2018
Core i5 8500B 6 (6) 3.0 4.1 350–1100 9 MB
8400B 2.8 4.0 350–1050
Core i3 8100B 4 (4) 3.6 6 MB Q3 2018

Kaby Lake Refresh[edit]

Common features:

  • Socket: BGA 1356.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8650U 4 (8) 1.9 4.2 UHD 620 300–1150 8 MB 15 W August 2017
8550U 1.8 4.0
Core i5 8350U 1.7 3.6 300–1100 6 MB
8250U 1.6 3.4
Core i3 8130U 2 (4) 2.2 300–1000 4 MB February 2018

Kaby Lake-G[edit]

Common features:

  • Socket: BGA 2270.
  • All the CPUs support dual-channel DDR4-2400 RAM.
  • All CPU models provide 8 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Embedded dGPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz) Model Clock (MHz)
Core i7 8809G 4 (8) 3.1 4.2 HD 630 350–1100 RX Vega M GH 1063–1190 8 MB 100 W February 2018
8709G 4.1
8706G RX Vega M GL 931–1011 65 W
8705G
Core i5 8305G 2.8 3.2 350–1000 6 MB

Amber Lake-Y[edit]

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8500Y 2 (4) 1.5 4.2 UHD 615 300–1050 4 MB 5 W August 2018
Core i5 8310Y 1.6 3.9 UHD 617 7 W Q1 2019
8210Y 3.6 October 2018
8200Y 1.3 3.9 UHD 615 300–950 5 W August 2018

Whiskey Lake-U[edit]

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8665U 4 (8) 1.9 4.8 UHD 620 300–1150 8 MB 15 W April 2019
8565U 1.8 4.6 August 2018
Core i5 8365U 1.6 4.1 300–1100 6 MB April 2019
8265U 3.9 August 2018
Core i3 8145U 2 (4) 2.1 300–1000 4 MB

Cannon Lake-U[edit]

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 10 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i3 8121U 2 (4) 2.2 3.2 4 MB 15 W May 2018

Core M (8th gen)[edit]

Amber Lake-Y[edit]

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core m3 8100Y 2 (4) 1.1 3.4 UHD 615 300–900 4 MB 5 W August 2018

Core i (9th gen)[edit]

Coffee Lake-H (refresh)[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i9 9980HK 8 (16) 2.4 5.0 UHD 630 350–1250 16 MB 45 W April 2019
9880H 2.3 4.8 350–1200
Core i7 9850H 6 (12) 2.6 4.6 350–1150 12 MB
9750H 4.5
9750HF
Core i5 9400H 4 (8) 2.5 4.3 UHD 630 350–1100 8 MB
9300H 2.4 4.1 350–1050
9300HF

Core i (10th gen)[edit]

Comet Lake-U[edit]

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 10810U 6 (12) 1.1 4.7 UHD 620 300–1150 12 MB 15 W May 2020
10710U August 2019
10610U 4 (8) 1.8 4.9 8 MB May 2020
10510U August 2019
Core i5 10310U 1.7 4.4 6 MB May 2020
10210U 1.6 4.2 300–1100 August 2019
Core i3 10110U 2 (4) 2.1 4.1 300–1000 4 MB

Comet Lake-H[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo TVB Model Clock (MHz)
Core i9 10980HK 8 (16) 2.4 5.1 5.3 UHD 630 350–1250 16 MB 45 W April 2020
10885H May 2020
Core i7 10875H 2.3 4.9 5.1 350–1200 April 2020
10870H 2.2 4.8 5.0 September 2020
10850H 6 (12) 2.7 4.9 5.1 350–1150 12 MB April 2020
10750H 2.6 4.8 5.0
Core i5 10500H 2.5 4.5 350–1050 December 2020
10400H 4 (8) 2.6 4.6 350–1100 8 MB April 2020
10300H 2.5 4.5 350–1050
10200H 2.4 4.1 August 2020

Ice Lake-U[edit]

Common features:

  • Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
  • PCIe 3.0 support.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: 10 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 1068NG7 4 (8) 2.3 4.1 Iris Plus (G7) 300–1100 8 MB 28 W May 2020
1068G7[39] August 2019
1065G7 1.3 3.9 15 W
Core i5 1038NG7 2.0 3.8 300–1050 6 MB 28 W May 2020
1035G7 1.2 3.7 15 W August 2019
1035G4 1.1 Iris Plus (G4)
1035G1 1.0 2.6 UHD Graphics (G1)
Core i3 1005G1 2 (4) 1.2 3.4 300–900 4 MB

Ice Lake-Y[edit]

Common features:

  • Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
  • All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
  • PCIe 3.0 support.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: 10 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 1060G7 4 (8) 1.0 3.8 Iris Plus (G7) 300–1100 8 MB 9 W Q3 2019
Core i5 1030NG7 1.1 3.5 300–1050 6 MB 10 W Q2 2020
1030G7 0.8 9 W Q3 2019
1030G4 0.7 Iris Plus (G4)
Core i3 1000NG4 2 (4) 1.1 3.2 300–900 4 MB Q2 2020
1000G4 Q3 2019
1000G1 UHD Graphics (G1)

Amber Lake-Y (10xxx)[edit]

Common features:

  • Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 10510Y 4 (8) 1.2 4.5 UHD 620 300–1150 8 MB 7 W August 2019
Core i5 10310Y 1.1 4.1 300–1050 6 MB
10210Y 1.0 4.0
Core i3 10110Y 2 (4) 300–1000 4 MB
10100Y 1.3 3.9 UHD 615 5 W January 2021

Core i (11th gen)[edit]

Tiger Lake-UP3[edit]

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 1195G7 4 (8) 1.3–2.9 5.0 Iris Xe
(96 EU)
?–1400 12 MB 12–28 W June 2021
1185G7 1.2–3.0 4.8 ?–1350 September 2020
1165G7 1.2–2.8 4.7 ?–1300
Core i5 1155G7 1.0–2.5 4.5 Iris Xe
(80 EU)
?–1350 8 MB June 2021
1145G7 1.1–2.6 4.4 ?–1300 January 2021
1135G7 0.9–2.4 4.2 September 2020
Core i3 1125G4 0.9–2.0 3.7 UHD Graphics
(48 EU)
?–1250 Q1 2021
1115G4 2 (4) 1.7–3.0 4.1 6 MB September 2020

Tiger Lake-UP4[edit]

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel LPDDR4X-4266 RAM.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 1180G7 4 (8) 0.9–2.2 4.6 Iris Xe
(96 EU)
?–1100 12 MB 7–15 W January 2021
1160G7 0.9–2.1 4.4 September 2020
Core i5 1140G7 0.8–1.8 4.2 Iris Xe
(80 EU)
8 MB January 2021
1130G7 4.0 September 2020
Core i3 1120G4 0.8–1.5 3.5 UHD Graphics
(48 EU)
Q1 2021
1110G4 2 (4) 1.8 3.9 6 MB September 2020

Tiger Lake-H[edit]

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i9 11980HK 8 (16) 2.6–3.3 5.0 UHD Graphics
(32 EU)
350–1450 24 MB 45–65 W May 2021
11950H 2.1–2.6 35–45 W
11900H 2.1–2.5 4.9
Core i7 11850H 4.8
11800H 1.9–2.3 4.6
11600H 6 (12) 2.5–2.9 18 MB July 2021
Core i5 11500H 2.4–2.9 12 MB May 2021
11400H 2.2–2.7 4.5 UHD Graphics
(16 EU)
11260H 2.1–2.6 4.4 350–1400

Tiger Lake-H35[edit]

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
  • PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 11390H 4 (8) 2.9–3.4 5.0 Iris Xe
(96 EU)
?–1400 12 MB 28–35 W June 2021
11375H 3.0–3.3 ?–1350 January 2021
11370H 4.8
Core i5 11320H 2.5–3.2 4.5 8 MB June 2021
11300H 2.6–3.1 4.4 Iris Xe
(80 EU)
?–1300 January 2021

Core i (12th gen)[edit]

Alder Lake-U[edit]

Common features:

  • Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
  • All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
  • ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1265U 2 (4) 1.8 4.8 8 (8) 1.3 3.6 Iris Xe
(96 EU)
?–1250 12 MB 15 W 55 W February 2022
1260U 1.1 4.7 0.8 3.5 ?–950 9 W 29 W
1255U 1.7 1.2 ?–1250 15 W 55 W
1250U 1.1 0.8 ?–950 9 W 29 W
Core i5 1245U 1.6 4.4 1.2 3.3 Iris Xe
(80 EU)
?–1200 15 W 55 W
1240U 1.1 0.8 ?–900 9 W 29 W
1235U 1.3 0.9 ?–1200 15 W 55 W
1230U 1.0 0.7 ?–850 9 W 29 W
Core i3 1215U 1.2 4 (4) 0.9 UHD Graphics
(64 EU)
?–1100 10 MB 15 W 55 W
1210U 1.0 0.7 ?–850 9 W 29 W

Alder Lake-P[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The following models are available with IPU (infrastructure processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1280P 6 (12) 1.8 4.8 8 (8) 1.3 3.6 Iris Xe
(96 EU)
?–1450 24 MB 28 W 64 W February 2022
1270P 4 (8) 2.2 1.6 3.5 ?–1400 18 MB
1260P 2.1 4.7 1.5 3.4
Core i5 1250P 1.7 4.4 1.2 3.3 Iris Xe
(80 EU)
12 MB
1240P ?–1300
Core i3 1220P 2 (4) 1.5 1.1 UHD Graphics
(64 EU)
?–1100

Alder Lake-H[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i9 12900HK 6 (12) 2.5 5.0 8 (8) 1.8 3.8 Iris Xe
(96 EU)
?–1450 24 MB 45 W 115 W January 2022
12900H
Core i7 12800H 2.4 4.8 3.7 ?–1400
12700H 2.3 4.7 1.7 3.5
12650H 4 (4) UHD Graphics
(64 EU)
Core i5 12600H 4 (8) 2.7 4.5 8 (8) 2.0 3.3 Iris Xe
(80 EU)
18 MB 95 W
12500H 2.5 1.8 ?–1300
12450H 2.0 4.4 4 (4) 1.5 UHD Graphics
(48 EU)
?–1200 12 MB

Alder Lake-HX[edit]

Common features:

  • Socket: BGA 1964.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
  • All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The i9 models have unlocked multipliers, allowing them to be overclocked.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i9 12950HX 8 (16) 2.3 5.0 8 (8) 1.7 3.6 UHD Graphics
(32 EU)
?–1550 30 MB 55 W 157 W May 2022
12900HX
Core i7 12850HX 2.1 4.8 1.5 3.4 ?–1450 25 MB
12800HX 2.0
12650HX 6 (12) 4.7 3.3 24 MB
Core i5 12600HX 4 (8) 2.5 4.6 1.8 ?–1350 18 MB
12450HX 2.4 4.4 4 (4) 3.1 UHD Graphics
(16 EU)
?–1300 12 MB

Alder Lake-N[edit]

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

  • Socket: BGA 1264.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
  • All CPU models provide 9 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache: 2 MB per cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz) Base Max.
Turbo
Core i3 N305 8 (8) 1.8 3.8 UHD Graphics
(32 EU)
?–1250 6 MB 15 W 35 W January 2023
N300 0.8 7 W 25 W

Core i (13th gen)[edit]

Raptor Lake-U[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The i3-1315U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1365U 2 (4) 1.8 5.2 8 (8) 1.3 3.9 Iris Xe
(96 EU)
?–1300 12 MB 15 W 55 W January 2023
1355U 1.7 5.0 1.2 3.7
Core i5 1345U 1.6 4.7 3.5 Iris Xe
(80 EU)
?–1250
1335U 1.3 4.6 0.9 3.4
1334U
Core i3 1315U 1.2 4.5 4 (4) 3.3 UHD Graphics
(64 EU)
10 MB
1305U 1 (2) 1.6 1.2

Raptor Lake-P[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1370P 6 (12) 1.9 5.2 8 (8) 1.4 3.9 Iris Xe
(96 EU)
?–1500 24 MB 28 W 64 W January 2023
1360P 4 (8) 2.2 5.0 1.6 3.7 18 MB
Core i5 1350P 1.9 4.7 1.4 3.5 Iris Xe
(80 EU)
12 MB
1340P 4.6 3.4 ?–1450

Raptor Lake-H[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
  • The i5-13500H is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i9 13900HK 6 (12) 2.6 5.4 8 (8) 1.9 4.1 Iris Xe
(96 EU)
?–1500 24 MB 45 W 115 W January 2023
13900H
Core i7 13800H 2.5 5.2 1.8 4.0
13700H 2.4 5.0 3.7
13620H 4.9 4 (4) 3.6 UHD Graphics
(64 EU)
Core i5 13600H 4 (8) 2.8 4.8 8 (8) 2.1 Iris Xe
(80 EU)
18 MB 95 W
13500H 2.6 4.7 1.9 3.5 ?–1450
13420H 2.1 4.6 4 (4) 1.5 3.4 UHD Graphics
(48 EU)
?–1400 12 MB

Raptor Lake-PX[edit]

Common features:

  • Socket: BGA 1792.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i9 13905H 6 (12) 2.6 5.4 8 (8) 1.9 4.1 Iris Xe
(96 EU)
?–1500 24 MB 45 W 115 W January 2023
Core i7 13705H 2.4 5.0 1.8 3.7
Core i5 13505H 4 (8) 2.6 4.7 1.9 3.5 Iris Xe
(80 EU)
?–1450 18 MB

Raptor Lake-HX[edit]

Common features:

  • Socket: BGA 1964.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • All models support CPU, iGPU, and memory overclocking.[40]
  • i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i9 13980HX 8 (16) 2.2 5.6 16 (16) 1.6 4.0 UHD Graphics
(32 EU)
?–1650 36 MB 55 W 157 W January 2023
13950HX 5.5
13900HX 5.4 3.9
Core i7 13850HX 2.1 5.1 12 (12) 1.5 3.8 ?–1600 30 MB
13700HX 5.0 8 (8) 3.6 ?–1550
13650HX 6 (12) 2.6 4.9 1.9 UHD Graphics
(16 EU)
24 MB
Core i5 13600HX 4.7 UHD Graphics
(32 EU)
?–1500
13500HX 2.5 4.6 1.8 3.5
13450HX 2.4 4 (4) 3.4 UHD Graphics
(16 EU)
?–1450 20 MB

Core i (14th gen)[edit]

Raptor Lake-HX Refresh[edit]

Common features:

  • Socket: BGA 1964.
  • All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
  • All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • All models support CPU, iGPU, and memory overclocking.
  • i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i9 14900HX 8 (16) 2.2 5.8 16 (16) 1.6 4.1 UHD Graphics
(32 EU)
?–1650 36 MB 55 W 157 W January 2024
Core i7 14700HX 2.1 5.5 12 (12) 1.5 3.9 ?–1600 33 MB
14650HX 2.2 5.2 8 (8) 1.6 3.7 UHD Graphics
(16 EU)
30 MB
Core i5 14500HX 6 (12) 2.6 4.9 1.9 3.5 UHD Graphics
(32 EU)
?–1550 24 MB
14450HX 2.4 4.8 4 (4) 1.8 UHD Graphics
(16 EU)
?–1500 20 MB

Core / Core Ultra 3/5/7/9 (Series 1)[edit]

Raptor Lake-U Refresh[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Xe-LP architecture.
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The Core 3 100U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core 7 150U 2 (4) 1.8 5.4 8 (8) 1.2 4.0 Intel Graphics
(96 EU)
?–1300 12 MB 15 W 55 W January 2024
Core 5 120U 1.4 5.0 0.9 3.8 Intel Graphics
(80 EU)
?–1250
Core 3 100U 1.2 4.7 4 (4) 3.3 Intel Graphics
(64 EU)
10 MB

Meteor Lake-U[edit]

Common features:

  • Socket: BGA 2049.
  • All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Alchemist architecture.
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
  • Fabrication process: Intel 4 (compute tile).
  • Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core Ultra 7 165U 2 (4) 1.7 4.9 8 (8) 1.2 3.8 Intel Graphics
(4 Xe-cores)
?–2000 12 MB 15 W 57 W December 2023
164U 1.1 4.8 0.7 ?–1800 9 W 30 W
155U 1.7 1.2 ?–1950 15 W 57 W
Core Ultra 5 135U 1.6 4.4 1.1 3.6 ?–1900
134U 0.7 0.5 ?–1750 9 W 30 W
125U 1.3 4.3 0.8 ?–1850 15 W 57 W
115U 1.5 4.2 4 (4) 1.0 3.5 Intel Graphics
(3 Xe-cores)
?–1800 10 MB

Meteor Lake-H[edit]

Common features:

  • Socket: BGA 2049.
  • All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Alchemist architecture.
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
  • Fabrication process: Intel 4 (compute tile).
  • Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core Ultra 9 185H 6 (12) 2.3 5.1 8 (8) 1.8 3.8 Intel Arc
(8 Xe-cores)
?–2350 24 MB 45 W 115 W December 2023
Core Ultra 7 165H 1.4 5.0 0.9 ?–2300 28 W
155H 4.8 ?–2250
Core Ultra 5 135H 4 (8) 1.7 4.6 1.2 3.6 ?–2200 18 MB
125H 1.2 4.5 0.7 Intel Arc
(7 Xe-cores)

Embedded processors[edit]

Core i (1st gen)[edit]

Arrandale[edit]

Common features:

  • Socket: BGA 1288.
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 660UE 2 (4) 1.33 2.40 HD Graphics 166–500 4 MB 18 W August 2010
620LE 2.00 2.80 266–566 25 W January 2010
620UE 1.06 2.13 166–500 18 W
610E 2.53 3.20 500–766 35 W
Core i5 520E 2.40 2.93 3 MB
Core i3 330E 2.13 500–666

Core i (2nd gen)[edit]

Sandy Bridge-DT[edit]

The following models from the Sandy Bridge desktop range are available as embedded processors:

  • Core i7-2600
  • Core i5-2400
  • Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M[edit]

Common features:

  • Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 2715QE 4 (8) 2.1 3.0 HD 3000 650–1200 6 MB 45 W January 2011
2710QE
2655LE 2 (4) 2.2 2.9 650–1000 4 MB 25 W February 2011
2610UE 1.5 2.4 350–850 17 W
Core i5 2515E 2.5 3.1 650–1100 3 MB 35 W
2510E
Core i3 2340UE 1.3 350–800 17 W June 2011
2330E 2.2 650–1050 35 W
2310E 2.1 February 2011

Gladden[edit]

Common features:

  • Socket: BGA 1284.
  • All the CPUs support dual-channel DDR3-1333 RAM.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
Base Turbo
Core i3 2115C 2 (4) 2.0 3 MB 25 W Q2 2012

Core i (3rd gen)[edit]

Ivy Bridge-DT[edit]

The following models from the Ivy Bridge desktop range are available as embedded processors:

  • Core i7-3770
  • Core i5-3550S
  • Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M[edit]

Common features:

  • Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
  • All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
  • i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 3615QE 4 (8) 2.3 3.3 HD 4000 650–1000 6 MB 45 W April 2012
3610QE
3612QE 2.1 3.1 35 W
3555LE 2 (4) 2.5 3.2 550–1000 4 MB 25 W June 2012
3517UE 1.7 2.8 350–1000 17 W
Core i5 3610ME 2.7 3.3 650–950 3 MB 35 W
Core i3 3217UE 1.6 350–900 17 W August 2012
3120ME 2.4 650–900 35 W

Gladden[edit]

Common features:

  • Socket: BGA 1284.
  • All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
  • All CPU models provide 20 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
Base Turbo
Core i3 3115C 2 (4) 2.5 4 MB 25 W Q3 2013

Core i (4th gen)[edit]

Haswell-DT[edit]

Common features:

  • Socket: LGA 1150.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4770TE 4 (8) 2.3 3.3 HD 4600 350–1000 8 MB 45 W June 2013
Core i5 4570TE 2 (4) 2.7 4 MB 35 W
Core i3 4340TE 2.6 May 2014
4330TE 2.4 September 2013

The following models from the Haswell-DT desktop range are also available as embedded processors:

  • Core i7-4790S
  • Core i7-4770S
  • Core i5-4590S
  • Core i5-4590T
  • Core i5-4570S
  • Core i3-4360
  • Core i3-4350T
  • Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H[edit]

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4860EQ 4 (8) 1.8 3.2 Iris Pro 5200 750–1000 6 MB 47 W August 2013
4850EQ 1.6 3.2 650–1000
4701EQ 2.4 3.4 HD 4600 400–1000 Q3 2013
4700EQ June 2013
4700EC 2.7 8 MB 43 W March 2014
4702EC 2.0 27 W
Core i5 4422E 2 (4) 1.8 2.9 HD 4600 400–900 3 MB 25 W April 2014
4410E 2.9 400–1000 37 W
4400E 2.7 3.3 400–1000 September 2013
4402E 1.6 2.7 400–900 25 W
4402EC 2.5 4 MB 27 W March 2014
Core i3 4110E 2.6 HD 4600 400–900 3 MB 37 W April 2014
4112E 1.8 25 W
4100E 2.4 37 W September 2013
4102E 1.6 25 W

Core i (5th gen)[edit]

Broadwell-H[edit]

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 5850EQ 4 (8) 2.7 3.4 Iris Pro 6200 300–1000 6 MB 47 W June 2015
5700EQ 2.6 HD 5600

Core i (6th gen)[edit]

Skylake-S[edit]

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6700TE 4 (8) 2.4 3.4 HD 530 350–1000 8 MB 35 W September 2015
Core i5 6500TE 4 (4) 2.3 3.3 6 MB
Core i3 6100TE 2 (4) 2.7 4 MB Q4 2015

Skylake-H[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6820EQ 4 (8) 2.8 3.5 HD 530 350–1000 8 MB 45 W October 2015
6822EQ 2.0 2.8 25 W
Core i5 6440EQ 4 (4) 2.7 3.4 6 MB 45 W
6442EQ 1.9 2.7 25 W
Core i3 6100E 2 (4) 2.7 350–950 3 MB 35 W
6102E 1.9 25 W

Core i (7th gen)[edit]

Kaby Lake-S[edit]

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i3 7101E 2 (4) 3.9 HD 610 350–1100 3 MB 54 W January 2017
7101TE 3.4 35 W

Kaby Lake-H[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2400 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 7820EQ 4 (8) 3.0 3.7 HD 630 350–1000 8 MB 45 W January 2017
Core i5 7440EQ 4 (4) 2.9 3.6 6 MB
7442EQ 2.1 2.9 25 W
Core i3 7100E 2 (4) 2.9 350–950 3 MB 35 W
7102E 2.1 25 W

Core i (8th gen)[edit]

Whiskey Lake-U[edit]

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8665UE 4 (8) 1.7 4.4 UHD 620 300–1150 8 MB 15 W April 2019
Core i5 8365UE 1.6 4.1 300–1050 6 MB June 2019
Core i3 8145UE 2 (4) 2.2 3.9 300–1000 4 MB

Core i (9th gen)[edit]

Coffee Lake-R[edit]

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 9700E 8 (8) 2.6 4.4 UHD 630 350–1150 12 MB 65 W June 2019
9700TE 1.8 3.8 35 W
Core i5 9500E 6 (6) 3.0 4.2 350–1100 9 MB 65 W
9500TE 2.2 3.6 35 W
Core i3 9100E 4 (4) 3.1 3.7 350–1050 6 MB 65 W
9100TE 2.2 3.2 35 W

Coffee Lake-H (refresh)[edit]

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 9850HE 6 (12) 2.7 4.4 UHD 630 350–1150 9 MB 45 W June 2019
9850HL 1.9 4.1 25 W
Core i3 9100HL 4 (4) 1.6 2.9 350–1100 6 MB

Core i (10th gen)[edit]

Comet Lake-S[edit]

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • i9-10900E features Thermal Velocity Boost.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i9 10900E 10 (20) 2.8 4.7 UHD 630 350–1200 20 MB 65 W April 2020
10900TE 1.8 4.5 35 W
Core i7 10700E 8 (16) 2.9 350–1150 16 MB 65 W May 2020
10700TE 2.0 4.4 35 W
Core i5 10500E 6 (12) 3.1 4.2 12 MB 65 W April 2020
10500TE 2.3 3.7 35 W
Core i3 10100E 4 (8) 3.2 3.8 350–1100 6 MB 65 W
10100TE 2.3 3.6 35 W

Core i (11th gen)[edit]

Tiger Lake-UP3[edit]

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
  • -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 1185GRE 4 (8) 1.8 4.4 Iris Xe
(96 EU)
?–1350 12 MB 15 W September 2020
1185G7E
Core i5 1145GRE 1.5 4.1 Iris Xe
(80 EU)
?–1300 8 MB
1145G7E
Core i3 1115GRE 2 (4) 2.2 3.9 UHD Graphics
(48 EU)
?–1250 6 MB
1115G4E

Tiger Lake-H[edit]

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
  • Minimum operating temperature: 0°C.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Integrated GPU Smart
Cache
TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 11850HE 8 (16) 2.1–2.6 4.7 UHD Graphics
(32 EU)
350–1350 24 MB 35–45 W August 2021
Core i5 11500HE 6 (12) 4.5 12 MB
Core i3 11100HE 4 (8) 1.9–2.4 4.4 UHD Graphics
(16 EU)
350–1250 8 MB

Core i (12th gen)[edit]

Alder Lake-S[edit]

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • Turbo Boost version is 2.0.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz)
Base Turbo Base Turbo
Core i9 12900E 8 (16) 2.3 5.0 8 (8) 1.7 3.8 UHD 770 300–1550 30 MB 65 W January 2022
12900TE 1.1 4.8 1.0 3.6 35 W
Core i7 12700E 2.1 4 (4) 1.6 300–1500 25 MB 65 W
12700TE 1.4 4.6 1.0 3.4 35 W
Core i5 12500E 6 (12) 2.9 4.5 300–1450 18 MB 65 W
12500TE 1.9 4.3 35 W
Core i3 12100E 4 (8) 3.2 4.2 UHD 730 300–1400 12 MB 60 W
12100TE 2.1 4.0 35 W

Alder Lake-U[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1265UE 2 (4) ? 4.7 8 (8) ? 3.5 Iris Xe
(96 EU)
?–1250 12 MB 15 W 55 W February 2022
Core i5 1245UE ? 4.4 ? 3.3 Iris Xe
(80 EU)
?–1200
Core i3 1215UE ? 4 (4) ? UHD Graphics
(64 EU)
?–1100 10 MB

Alder Lake-P[edit]

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz) Cores
(Threads)
Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1270PE 4 (8) ? 4.5 8 (8) ? 3.3 Iris Xe
(96 EU)
?–1350 18 MB 28 W 64 W February 2022
Core i5 1250PE ? 4.4 ? 3.2 Iris Xe
(80 EU)
?–1300 12 MB
Core i3 1220PE ? 4.2 4 (4) ? 3.1 UHD Graphics
(48 EU)
?–1250 Q1 2022

Alder Lake-PS[edit]

Common features:

  • Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model