Omni-Path (also Omni-Path Architecture, abbr. OPA) is a high-performance communication architecture owned by Intel. It aims for low communication latency, low power consumption and a high throughput. Intel plans to develop technology based on this architecture for exascale computing. In 2017 Intel is offering at least 7 variations of multi-port Ethernet switches using this term in the form "Intel® Omni-Path Edge Switch 100 Series" all "supporting 100 Gb/s for all ports". First models of that series were already available starting Q4/2015
Production of Omni-Path products started in 2015 and mass delivery of these products started in the first quarter of 2016. In November 2015, adapters were announced using QSFP28 connectors with channel speeds up to 100 Gbit/s. Simultaneously, switches based on the 48-port "Prairie River" ASIC were announced.
In October 2016, IBM, Hewlett Packard Enterprise, Dell, Lenovo, Samsung, Seagate Technology, Micron, Western Digital and SK Hynix announced a joint consortium called Gen-Z to develop an open specification and architecture for non-volatile storage and memory products—including Intel's 3D Xpoint technology—which might in part compete against Omni-Path.
Intel also offers their Omni-Path systems via other (hardware) vendors so customers can get all support for their environment from a single vendor. For example, Dell EMC offers the Intel Omni-Path solution as Dell Networking H-series, following the familiar naming-standard of Dell Networking.
- "Intel Architects High Performance Computing System Designs to Bring Power of Supercomputing Mainstream". Intel. 16 November 2015. Retrieved 28 March 2016.
- "Intel Reveals Details for Future High-Performance Computing System Building Blocks as Momentum Builds for Intel® Xeon Phi™ Product". Intel. 17 November 2015. Retrieved 28 March 2016.
- Richard Chirgwin (17 November 2015). "Intel's Omni-Path InfiniBand-killer debuts at sizzling 100 Gb/sec". The Register. Retrieved 3 April 2016.
- INTEL® OMNI-PATH EDGE SWITCH PRODUCTS: Intel Fabric Products
- "Intel Announces New Details for Future HPC Products and Extended Industry Collaborations at ISC 2015" (PDF). Intel. 13 July 2015. Retrieved 28 March 2016.
- Weiny, Ira (5 April 2016). "Extending RDMA for Alternative Fabrics" (PDF). 12th Annual OpenFabrics Workshop.
- Shah, Agam (11 October 2016). "Hardware makers unite to challenge Intel with Gen-Z spec". cio.com. CIO. Retrieved 11 October 2016.
- Dell website on Dell Networking H-series, visited 17 April 2017