Omni-Path Architecture (OPA) was a high-performance communication architecture owned by Intel. It aims for low communication latency, low power consumption and a high throughput. Intel planned to develop technology based on this architecture for exascale computing.
Production of Omni-Path products started in 2015 and delivery of these products started in the first quarter of 2016. In November 2015, adapters based on the 2-port "Wolf River" ASIC were announced, using QSFP28 connectors with channel speeds up to 100 Gbit/s. Simultaneously, switches based on the 48-port "Prairie River" ASIC were announced. First models of that series were available starting in 2015.
In April 2016, implementation of the InfiniBand "verbs" interface for the Omni-Path fabric was discussed.
In October 2016, IBM, Hewlett Packard Enterprise, Dell, Lenovo, Samsung, Seagate Technology, Micron Technology, Western Digital and SK Hynix announced a joint consortium called Gen-Z to develop an open specification and architecture for non-volatile storage and memory products—including Intel's 3D Xpoint technology—which might in part compete against Omni-Path. Intel offered their Omni-Path products and components via other (hardware) vendors. For example, Dell EMC offered Intel Omni-Path as Dell Networking H-series, following the naming-standard of Dell Networking in 2017.
In July 2019, Intel announced it would not continue development of Omni-Path networks and canceled OPA 200 series (200-Gbps variant of Omni-Path).
In September 2020, Intel announced that the Omni-Path network products and technology would be spun out into a new venture with Cornelis Networks. Intel would continue to maintain support for legacy Omni-Path products, while Cornelis Networks continues the product line, leveraging existing Intel intellectual property related to Omni-Path architecture.
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- ^ Intel OMNI-PATH EDGE SWITCH PRODUCTS: Intel Fabric Products
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- ^ "Intel Omni-Path Business Spun Out as Cornelis Networks". HPCwire. 30 September 2020. Retrieved 6 November 2020.
- ^ "Omni-Path HPC Interconnect Reemerges as Intel Spin-out with $20M Investment Round from Intel Capital, Others". HPCwire. 30 September 2020. Retrieved 6 November 2020.
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