Semiconductor Manufacturing International Corporation

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Semiconductor Manufacturing International Corporation
Native name
中芯国际集成电路制造有限公司
Public
Traded asNYSESMI
SEHK981
IndustrySemiconductor
Founded2000; 19 years ago (2000)
Cayman Islands
FounderRichard Chang Ru-gin
HeadquartersShanghai, China
Key people
Haijun Zhao (CEO)
RevenueIncreaseUS$2.9 billion (2016)
IncreaseUS$339.2 million (2016)
IncreaseUS$316.4 million (2016)
Number of employees
17,967 (2016)
Websitesmics.com

Semiconductor Manufacturing International Corporation (SMIC) is a semiconductor foundry company headquartered in Shanghai, China and incorporated in the Cayman Islands providing integrated circuit (IC) manufacturing services on 350 nm to 14 nm process technologies. SMIC has wafer fabrication sites throughout mainland China, offices in the United States, Italy, Japan, and Taiwan, and a representative office in Hong Kong. Notable customers include Qualcomm, Broadcom, and Texas Instruments.[1][2][3]

History[edit]

In 2013, SMIC established a joint venture in Beijing to fabricate using 40 nm and below technologies.

On December 22, 2014, SilTech Shanghai, one of SMIC's indirectly wholly owned subsidiaries; JCET; and China IC Fund entered into a co-investment agreement to form an investment consortium in connection with the proposed acquisition of STATS ChipPAC, a leading provider of advanced semiconductor packaging and test services in the world and a company incorporated in the Republic of Singapore, shares of which were listed on the Singapore Exchange Securities Trading Limited before the acquisition. On June 18, 2015, according to the co-investment agreement, SilTech Shanghai invested US$102 million as a capital contribution for 19.6% ownership interest in Changjiang Xinke, a company incorporated in Jiangsu province, China, which is accounted as an associate of the Group.

On June 23, 2015, Huawei, Qualcomm Global Trading Pte. Ltd., IMEC International, and SMIC jointly issued a press release in relation to the formation of the SMIC Advanced Technology Research & Development (Shanghai) Corporation, an equity joint venture company. The joint venture company's focus was to be the R&D for the next generation CMOS logic technology and was designed to build China’s most advanced integrated circuit (IC) development R&D platform. SMIC Advanced Technology R&D (Shanghai) Corporation is majority owned by SMIC, while Huawei, IMEC, and Qualcomm are minority shareholders. The current focus of the joint venture company is on developing 14 nm logic technology.

On June 24, 2016, SMIC. LFoundry Europe and Marsica entered into a sale and purchase agreement pursuant to which LFoundry Europe and Marsica agreed to sell and SMIC agreed to purchase 70% of the corporate capital of LFoundry S.r.l. for an aggregate cash consideration of EUR49 million subject to adjustment. The acquisition was completed as of July 29, 2016.

On October 14, 2016, Ningbo Semiconductor International Corporation was jointly established by China IC Capital (the wholly owned investment fund of SMIC), Ningbo Senson Electronics Technology Co., Ltd, and Beijing Integrated Circuit Design and Testing Fund with a registered capital of RMB355 million, equal to US$52.8 million. SMIC holds 66.76% of the ownership interest. NSI will develop analog and specialty semiconductor process technology platforms in the areas of high-voltage analog, radio frequency, and optoelectronics. These developments will support customers in IC design and product development for applications in smart home, industrial, and automotive electronics, new generations of radio communications, augmented reality, virtual reality, mixed reality, and other specialty systems.[4]

SMIC is expected to start mass production of 14 nm FinFET in the first half of 2019. Analysts report that SMIC 14 nm capacity will be relatively small when compared to the industry leaders, all of whom run multiple leading-edge fabs. SMIC currently has two fabs that can process 300 mm wafers using 28 nm and larger fabrication processes. The same fabs will be used for 14 nm projects too, but given their capacities and SMIC’s very high fab utilization rate (94.1% in Q2 2018), do not expect them to make loads of 14 nm SoCs. And for these reasons, along with prepping 14nm for its current fabs, the company is building a $10 billion fab that will be used for 14 nm, and is aimed at better serving local players.

Litigation with TSMC[edit]

The company was the target of a lawsuit brought by TSMC, accusing SMIC of misappropriating TSMC intellectual property.[5] The first round of litigation ended in 2005 with a $175 million settlement. A second round was opened in 2006. The liability phase of the lawsuit began on September 9, 2009 in Oakland, California,[6] and the jury found SMIC liable on 61 out of 65 claims.[7]

SMIC entered into a settlement agreement with TSMC to resolve all pending lawsuits between the parties, including the legal action filed by TSMC in California for which a verdict was returned by the jury against SMIC on November 4, 2009 and the legal action filed by SMIC in Beijing. SMIC and TSMC have entered into a settlement agreement on November 9, 2009 to settle and dismiss the CalifoCase, including all claims and defenses of SMIC yet to be decided in that case and SMIC's appeal in the Beijing Case, thus concluding all pending court litigation between the parties.

Key provisions of the settlement include a mutual release of all claims that were or could have been brought in the pending lawsuits; termination of SMIC's obligation to make remaining payments under the prior settlement agreement between the parties (approximately US$40 million); payment to TSMC of an aggregate of US$200 million; and a grant to TSMC of approximately 8% of SMIC's issued share capital and a warrant which would allow TSMC to obtain total ownership of approximately 10% of SMIC's issued share capital.[8]

Locations[edit]

SMIC has customer service and marketing offices in the U.S., Europe, Japan and Taiwan, and a representative office in Hong Kong.[9] It has wafer fabs at the following locations:

  • Shanghai: One 300mm wafer fabrication facility (fab) and one 200mm wafer fab
  • Beijing: Two 300mm wafer fabs
  • Tianjin: 200mm wafer fab
  • Shenzhen: 200mm wafer fab
  • Italy: 200mm wafer fab

See also[edit]

References[edit]

  1. ^ "SMIC Receives Supplier Award from Qualcomm". SMIC press release. 14 December 2011. Archived from the original on 9 February 2012. Retrieved 6 January 2012.
  2. ^ "Broadcom 2010 Annual Report". p. 20. Retrieved 6 January 2012.
  3. ^ "SMIC Earns Texas Instruments' Supplier Excellence Award for 2010". SMIC press release. 14 April 2011. Archived from the original on 29 October 2011. Retrieved 6 January 2012.
  4. ^ http://www.smics.com/attachment/20170428182324285728854_en.pdf
  5. ^ "TSMC v. SMIC, 161 Cal.App. 4th 581, 74 Cal.Rptr.3d 328 (March 27, 2008)" (PDF). Retrieved 2009-10-09.[dead link]
  6. ^ Lammers, David (2009-09-10). "TSMC vs. SMIC Trial Commences in Oakland". semiconductor.net. Semiconductor International. Archived from the original on 2009-09-16. Retrieved 2009-10-09.
  7. ^ Longstreth, Andrew (2009-11-05). "Jeffrey Chanin of Keker & Van Nest". AmLaw Litigation Daily. Press Release. Retrieved 2009-11-05.
  8. ^ "SMIC Settles All Pending Lawsuits with TSMC: Anticipates No Disruption to Customers". SMIC press release. 2009-11-10. Retrieved 2012-01-06.[permanent dead link]
  9. ^ "SMIC - Contact Us". SMIC website. Retrieved 6 January 2012.

External links[edit]