Solder ball

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A grid array of solder balls under an integrated circuit chip, with the chip removed; the balls were left attached to the printed circuit board.
A MCM schematic for a stacked DRAM dice showing solder balls

In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.[1] The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.[2]

A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability.[3]

Usage in flip chip method[edit]

See also[edit]