Talk:Wire bonding

From Wikipedia, the free encyclopedia
Jump to: navigation, search

Please add new technologies of wire bonding using glass coated wires G.Kashian (talk) 09:31, 2 January 2017 (UTC) [1] and [2] and [3] this will solve the problems of oxidation of Cu.G.Kashian (talk) 09:31, 2 January 2017 (UTC) [4]G.Kashian (talk) 09:34, 2 January 2017 (UTC)

I came here to discover how they get the little wires to attach to the little chips at high rates, and came away without learning anything. —Preceding unsigned comment added by (talk) 17:30, 22 November 2009 (UTC)

Is Cu used for wire bonding? I do not think that is possible. Cu suffers from fast oxidation which in practice leads to the use of NiAu or Au for wire bonding...

I haven't heard about the use much, but according to this web page: Kulicke & Soffa it is possible. They just seal it for storage. --KingCarrot 15:34, 2 February 2006 (UTC)

Does anyone know if you can wire bond 80/20 Nichrome wire to pads on a PCB? If so, a competent source to do this would be greatly appreciated. 18:26, 6 September 2007 (UTC)

Huh? I thought soldering is still the "primary method" of putting ICs on boards. I was wondering if it's sometimes also used to connect ICs to PCB's in the case where the IC appears under a black epoxy blob, rather than packaged with conventional pins... but this article doesn't inspire confidence, starting off with an exaggeration like that.

Ecloud (talk) 07:54, 8 August 2010 (UTC)

I was thinking the same thing. I'm fairly convinced that the primary method of connecting ICs to PCBs is through solder. It would probably be better to talk about wire bonding being the primary method of connecting a die to its package which seems more of an afterthought the way its currently worded.
Potatoj316 (talk) 19:43, 28 April 2011 (UTC)