The Thermal Head is a component of a metrological device created to aid in development of new CPUs and chipsets. The first Thermal Head was constructed in 1996 by James Kerner. It was initially designed to control a slot 1Intel processor's temperature while making computations in a test platform. A Thermal Head attached to a CPU may also increase a CPU's performance during computation. Today it is used for test/validation of a processor in conjunction with a Thermal Management System consisting of a temperature controller attached to the Thermal Head by way of an electrical umbilical.
A Thermal Head is always used in conjunction with a Thermal Tool System. "Among the USTC Thermal Tool System products are the Integrated Thermal Management System (ITMS), Hybrid Air Thermal Management System (HATMS), Rack Integrated Thermal Management System (RITMS), Temperature Control System (TCS), and Thermal Heads (TH). Integrating cooling modules and the TCS in one enclosure with liquid as working fluid, combined with TH, the ITMS executes temperature control tasks without other components. Using air as cooling media, the HATMS executes the tasks like ITMS. The RITMS includes a smart TCS unit which automatically adjusts parameters for temperature control, with an ultra-low noise level and low power consumption. The TCS is a standard temperature control unit, and the TH dissipate heat from a heat-generated device, like a computer. The RITMS or TCS, combined with a chiller (or a heat exchanger) and TH, provide a standard way to control the temperature and dissipate heat on electronic components for production validation tests."