Wei Hu Koh

From Wikipedia, the free encyclopedia

This is an old revision of this page, as edited by InternetArchiveBot (talk | contribs) at 06:11, 24 July 2022 (Rescuing 1 sources and tagging 0 as dead.) #IABot (v2.0.8.8) (Ost316 - 10433). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

Wei Hu Koh is an electrical engineer from Pacrim Technology in Irvine, California. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013[1] for his development of three-dimensional multichip modules and flip chip interconnects.

References

  1. ^ "2013 elevated fellow" (PDF). IEEE Fellows Directory. Archived from the original (PDF) on 2017-08-29. Retrieved 2017-04-14.