Flying probe test systems are often used for only testing basic production, prototypes, and boards that present accessibility problems. Flying probe testing uses electro-mechanically controlled probes to access components on printed circuit assemblies (PCAs). Commonly used for test of analog components, analog signature analysis, and short/open circuits. They can be classified as in-circuit test (ICT) systems or as Manufacturing Defects Analyzers (MDAs). They provide an alternative to the bed-of-nails technique for contacting the components on printed circuit boards. The precision movement can probe points on PLCCs, SOICs, PGAs, SSOPs, QFPs and others, without any expensive fixturing or programming required.
- 4-wire Kelvin measurements
- Analog component testing
- Analog signature analysis
- ATE diagnostics
- Boundary scan testing
- Open/short detection
- Power-off testing
- Lower cost than Bed Of Nails, because no fixturing required
- Fast time to first test, because of fast development cycle
Accuracy of a Robotic Mechanism and considerations 
Whenever you consider contacting small test points, unfilled via copper, and/or SMT device leads, consideration must be made to the accuracy of the robotic system that is deployed in the flying probe tester that is available. Understanding the real specifications can often be misunderstood by new users of such robotic systems.