Talk:Die singulation

How can you cut a brittle material such as silicon in fine pieces without damaging the fine IC structures? --Abdull 14:14, 17 February 2007 (UTC)[reply]

I dunno how they do it in industry but the way we did it in our undergraduate labs was to use a special device to accurately score the surface and then break the chips apart. I imagine whatever cutting method they use quite a wide margin is allowed between the edge of the functional area of the chip and the cutting line. 86.1.116.158 (talk) 01:44, 18 December 2009 (UTC)[reply]