Jump to content

File:B-ad-schematicbondingprocess.svg

Page contents not supported in other languages.
This is a file from the Wikimedia Commons
From Wikipedia, the free encyclopedia

Original file (SVG file, nominally 476 × 616 pixels, file size: 9 KB)

Description
English: Schematic SU-8 wafer bond process.
Source M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)
Author Fraunhofer ENAS, D. Neumann
Permission
(Reusing this file)
w:en:Creative Commons
attribution share alike
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license.
Attribution: Fraunhofer ENAS
You are free:
  • to share – to copy, distribute and transmit the work
  • to remix – to adapt the work
Under the following conditions:
  • attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
  • share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.

Captions

Add a one-line explanation of what this file represents

Items portrayed in this file

depicts

media type

image/svg+xml

checksum

856da1bb2aae169706409ec168d09be1a3d0ef0e

determination method or standard: SHA-1

data size

9,091 byte

height

616 pixel

width

476 pixel

File history

Click on a date/time to view the file as it appeared at that time.

Date/TimeThumbnailDimensionsUserComment
current11:01, 30 March 2011Thumbnail for version as of 11:01, 30 March 2011476 × 616 (9 KB)Enaswiki{{Information |Description ={{en|1=Schematic SU-8 wafer bond process.}} |Source =M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |Author =Fraunhofer ENAS, [[U

The following page uses this file:

Retrieved from "https://en.wikipedia.org/wiki/File:B-ad-schematicbondingprocess.svg"