English: Ultra sonic image of a test patterned Au-Si eutectic bonded wafer.
Date
30 March 2011 (original upload date)
Source
Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bonding (2009)
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2011-03-30 11:27 (UTC) | Enaswiki | 56875 (bytes) | 227×230 | {{Information |Description = Ultra sonic image of a blank wafer. |Source = Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bonding (2009) |Date
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(Original text) : {{Information |Description = Ultra sonic image of a blank wafer. |Source = Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bon