File:Pad Cratering 03.jpg
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Summary
| Description |
English: Crater left on printed circuit board after copper pad from BGA connection has been pulled away. |
| Date | |
| Source | Integral Technology, Lake Forest, CA |
| Author | Chris Hunrath |
Licensing
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The copyright holder of this file allows anyone to use it for any purpose, provided that the copyright holder is properly attributed. Redistribution, derivative work, commercial use, and all other use is permitted. |
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File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 00:39, 9 November 2010 | | 381 × 281 (20 KB) | Rockyh2 | {{Information |Description={{en|1=Crater left on printed circuit board after copper pad from BGA connection has been pulled away.}} |Source=Integral Technology, Lake Forest, CA |Author=Chris Hunrath |Date=2010-08-01 |Permission= |other_versions= }} |
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