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IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.


It consists of a thin immersion silver plating over the copper traces.

Advantages of IAg[edit]

  • Excellent surface planarity (compared to e.g. HASL)
  • Low High Frequency Signal loss due to skin effect

Disadvantages of IAg[edit]

  • Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
  • Silver "whiskers" form across electrical potentials and short out components [1]


IPC Standard: IPC-4553