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Immersion silver plating

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This is an old revision of this page, as edited by Altenmann (talk | contribs) at 04:50, 28 July 2015 (removed Category:Electronics manufacturing; added Category:Printed circuit board manufacturing using HotCat). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

IAg or Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards.

Description

It consists of a thin immersion silver plating over the copper traces.

Advantages of IAg

  • Excellent surface planarity (compared to e.g. HASL)
  • Low High Frequency Signal loss due to skin effect

Disadvantages of IAg

  • Rapid degradation of surface due to oxidation or contamination (with e.g. sulfur or chlorine)
  • Silver "whiskers" form across electrical potentials and short out components [1]

Specifications

IPC Standard: IPC-4553

References

  1. ^ http://dcchapters.ipc.org/assets/pnw/presentations/20030925_Finishes.pdf
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