Ceva (semiconductor company)
 | |
| Company type | Public |
|---|---|
| Nasdaq: CEVA | |
| Industry | Semiconductor IP |
| Founded | 2002 |
| Headquarters | Mountain View, California, United States |
| Products | Digital signal processors |
| Revenue |  US$ 60.24 million (2011) |
| $ 18.56 million (2011) | |
| $ 18.56 million (2011) | |
Number of employees | 193 (December 2011) |
| Website | www.ceva-dsp.com |
CEVA is a publicly listed semiconductor intellectual property (IP) company, headquartered in Mountain View, California and specializes in DSP processor technology. The company's main R&D facility is located in Herzliya, Israel. Research Firm The Linley Group reported that CEVA's market share in 2011 in DSP IP market was 90%, making CEVA's the world's #1 licensor of DSP technology.[1]
History
CEVA was created in November 2002 through the combination of the DSP IP licensing division of DSP Group (Nasdaq: DSPG) and Parthus Technologies plc (an Irish company that was founded in 1993).[2]
The company develops advanced technologies for multimedia and wireless communications chips. CEVA is the world's #1 DSP architecture deployed in cellular baseband processors[3] In 2011, CEVA reported revenues of $60.2 million and its technology was used in more than 1 billion cellular and electronic entertainment devices. [citation needed]
Processor cores
The CEVA-XC4000 is a fully programmable low-power DSP architecture framework supporting the most demanding communication standards including LTE-Advanced, LTE and HSPA+, alongside WiMAX, 3G, 3.5G, Wi-Fi 802.11ac, GPS and DVB-H. The CEVA-XC4000 architecture offers modem developers a wide spectrum of performance capabilities while complying with the most stringent power constraints.
The CEVA-XC is a high-performance, low-power communication processor family designed and optimized for advanced wireless communications processing in mobile handsets as well as wireless infrastructure applications. A single CEVA-XC core is capable of handling complete transceiver paths for multiple air interfaces in software, including LTE and HSPA+, alongside WiMAX, 3G, 3.5G, Wi-Fi 802.11ac, GPS and DVB-H.
The CEVA-X family of DSP cores from CEVA is based on the company's latest DSP architecture. The CEVA-X offers a mix of Very Long Instruction Word (VLIW) and Single Instruction Multiple Data (SIMD) architectures. The VLIW architecture allows a high level of concurrent instructions processing thus providing extended parallelism, as well as low power consumption. Target markets include LTE, cellular handsets and Software radio, smart phones / PDAs, Video & Audio processing for mobile devices, VoIP gateways & broadband modems, and home entertainment (Digital TV, HDTV, PVR, Blu-ray).
CEVA-TeakLite-4 is the fourth-generation DSP architecture framework based on the broadly adopted TeakLite family of DSP cores. Fully compatible with CEVA-TeakLite, CEVA-Teaklite-II and CEVA-TeakLite-III DSPs, The CEVA-TeakLite-4 is a low-power, native 32-bit, variable 10-stage pipeline, Fixed-point arithmetic architecture specifically targeted for advanced audio and voice applications, making the DSP architecture framework ideal for deployment in High Definition (HD) audio DSP and voice DSP applications requiring advanced standards such as Dolby Digital Plus 7.1, Dolby TrueHD, Dolby Mobile, DTS-HD, SILK and other wideband voice codecs.
See also
References
- ^ CEVA Continues to Dominate DSP IP Market with 90% Market Share, May 14, 2012
- ^ "DSP Group, Parthus to merge IP licensing businesses in new company", Electronic Engineering Times, 4/5/2002
{{citation}}: Check date values in:|year=(help) - ^ "CEVA claims top spot for cell phone DSP", Electronic Engineering Times, 2011-01-31