MicroLeadFrame: Difference between revisions
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==Sources== |
==Sources== |
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*[http://www.amkor.com/go/packaging/all-packages/microleadframeandreg-/microleadframeandreg--mlf Amkor MicroLeadFrame (MLF)Information] |
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*[http://www.amkor.com/index.cfm?objectid=42EDA4C7-5056-AA0A-E2A372F025BF8729 Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Packages] |
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*[http://www.amkor.com/products/all_products/mlf.cfm Amkor Product Information] |
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*[http://www.amkor.com/index.cfm?objectid=E1A382DF-DE6E-0406-67A2C29846561710 Application Notes for Surface Mount Assembly of Amkor’s Dual Row MicroLeadFrame (MLF) Packages] |
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[[Category:Chip carriers]] |
[[Category:Chip carriers]] |
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Revision as of 21:32, 9 June 2009
A MicroLeadFrame (MLF) is a type of chip scale microchip package. Amkor Technology introduced the MicroLeadFrame package in late 1999. This type of package provides contacts around the periphery of all four edges. The leads (or lands) are flush with the package body, and the leadframe's metal die-attach paddle is exposed on the bottom of the package, enabling the use of down-bonds or conductive die-attach material, which in turn allows for a stable, low-impedance ground, as well as heat transfer to a substrate such as a PCB.
A more recent design variation which allows for higher density connections is the Dual Row MicroLeadFrame (DRMLF) package.
Sources
- Amkor MicroLeadFrame (MLF)Information
- Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Packages
- Application Notes for Surface Mount Assembly of Amkor’s Dual Row MicroLeadFrame (MLF) Packages
- ChipScale Review magazine, July - August 2000.]
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