Cerrolow 136: Difference between revisions
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Made a separate page based on the information in the Fusible Alloys page. Added Young's modulus. There is a lot of key material properties that need to be added in; redirecting to "Wood's Metal" is deceptive as they are different alloys. Tags: Removed redirect Visual edit |
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Cerrolow 136, is a fusible alloy that becomes liquid at approximately 58 °C (136 °F). It is a eutectic alloy of bismuth, lead, indium, and tin, with the following percentages by weight: 49% Bi, 18% Pb, 21% In, 12% Sn. |
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#REDIRECT [[Wood's metal#Related alloys]] {{R to section}} |
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It is also known as '''ChipQuik desoldering alloy'''.<ref name="ChipQuik">Johnson Manufacturing Co, [http://www.chipquik.com/msds/SMD1.pdf MSDS for Chip Quik Alloy w/Lead]. Retrieved on February 6, 2015.</ref> and '''Lens Alloy 136''', used for mounting lenses and other optical components for grinding.<ref>http://www.zilt.co.uk/LowMelting/LensAlloy136.html</ref> Used for mounting small delicate oddly-shaped components for machining. It slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.<ref name="lowtemp" /> |
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The Young's Modulus is approximately 2.5×10<sup>6</sup> psi (17.24 GPa) <ref name="Similarity Methods">{{cite book |title=Similarity methods in engineering dynamics : theory and practice of scale modeling |publisher=Elsevier |isbn=0444598138 |page=134 |pages=397 |edition=Rev. |accessdate=5 December 2019}}</ref> |
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Revision as of 20:11, 5 December 2019
Cerrolow 136, is a fusible alloy that becomes liquid at approximately 58 °C (136 °F). It is a eutectic alloy of bismuth, lead, indium, and tin, with the following percentages by weight: 49% Bi, 18% Pb, 21% In, 12% Sn.
It is also known as ChipQuik desoldering alloy.[1] and Lens Alloy 136, used for mounting lenses and other optical components for grinding.[2] Used for mounting small delicate oddly-shaped components for machining. It slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.[3]
The Young's Modulus is approximately 2.5×106 psi (17.24 GPa) [4]
- ^ Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead. Retrieved on February 6, 2015.
- ^ http://www.zilt.co.uk/LowMelting/LensAlloy136.html
- ^ Cite error: The named reference
lowtempwas invoked but never defined (see the help page). - ^ Similarity methods in engineering dynamics : theory and practice of scale modeling (Rev. ed.). Elsevier. p. 134. ISBN 0444598138.
{{cite book}}:|access-date=requires|url=(help); More than one of|pages=and|page=specified (help)