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'''Photonic curing''' is the high-temperature thermal processing of a [[thin film]] using pulsed light from a [[flashlamp]].<ref name="Schroder 2011">K. A. Schroder, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Trade Show, 2, 220-223, 2011.</ref> When this transient processing is done on a low-temperature substrate such as plastic or paper, it is possible to attain a significantly higher temperature than the substrate can ordinarily withstand under an equilibrium heating source such as an [[oven]].<ref name="Schroder 2011" /><ref name="Schroder 2006" /> Since the rate of most thermal curing processes (drying, [[sintering]], reacting, annealing, etc.) generally increase exponentially with temperature (i.e. they obey the [[Arrhenius equation]]), this process allows materials to be cured much more rapidly than with an oven.<ref name="Schroder 2006">K. A. Schroder, S. C. McCool, W. R. Furlan, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, 3, 198-201, 2006.</ref><ref name="R&DMag">{{cite web|url=http://www.rdmag.com/RD100-Awards-Flexible-Electronics-Process/|title=In flexible electronics, it’s all about protecting the paper|work=Research & Development|accessdate=24 December 2014}}</ref> |
'''Photonic curing''' is the high-temperature thermal processing of a [[thin film]] using pulsed light from a [[flashlamp]].<ref name="Schroder 2011">K. A. Schroder, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Trade Show, 2, 220-223, 2011.</ref> When this transient processing is done on a low-temperature substrate such as plastic or paper, it is possible to attain a significantly higher temperature than the substrate can ordinarily withstand under an equilibrium heating source such as an [[oven]].<ref name="Schroder 2011" /><ref name="Schroder 2006" /> Since the rate of most thermal curing processes (drying, [[sintering]], reacting, annealing, etc.) generally increase exponentially with temperature (i.e. they obey the [[Arrhenius equation]]), this process allows materials to be cured much more rapidly than with an oven.<ref name="Schroder 2006">K. A. Schroder, S. C. McCool, W. R. Furlan, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, 3, 198-201, 2006.</ref><ref name="R&DMag">{{cite web|url=http://www.rdmag.com/RD100-Awards-Flexible-Electronics-Process/|title=In flexible electronics, it’s all about protecting the paper|work=Research & Development|accessdate=24 December 2014}}</ref> |
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It has become a transformative process used in the manufacture of printed electronics as it allows inexpensive and flexible substrates to be substituted for traditional glass or ceramic substrates. Additionally, the higher temperature processing afforded by [http://www.novacentrix.com/tech/photonic_curing photonic curing] reduces the processing time exponentially, often from minutes down to milliseconds, which increases throughput all while maintaining a small machine footprint. |
It has become a transformative process used in the manufacture of printed electronics as it allows inexpensive and flexible substrates to be substituted for traditional glass or ceramic substrates. Additionally, the [http://www.novacentrix.com/products/pulseforge/product_comparison higher temperature] processing afforded by [http://www.novacentrix.com/tech/photonic_curing photonic curing] reduces the processing time exponentially, often from minutes down to milliseconds, which increases throughput all while maintaining a small machine footprint. |
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==Uses== |
==Uses== |
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Photonic curing is used as a thermal processing technique in the manufacturing of [[printed electronics]] as it allows the substitution of glass or ceramic substrate materials with inexpensive and flexible substrate materials such as polymers or paper. The effect can be demonstrated with an ordinary camera flash.<ref name="Patent">US Pat. #7,820,097.</ref> Industrial photonic curing systems are typically water cooled and have controls and features similar to industrial [[lasers]]. The pulse rate can be fast enough to allow curing on the fly at speeds beyond 100 m/min making it suitable as a curing process for [[roll-to-roll processing]]. Material processing rates can exceed 1 m<sup>2</sup>/s.<ref name="Schroder 2006" /><ref name="ORNL poster">{{cite web|url=http://www.ms.ornl.gov/mpg/pdf/researchthrusts/AP_PTPposterv2.pdf|title=NovaCentrix R&D 100 Award Winner, 2009|accessdate=July 18, 2011|deadurl=yes|archiveurl=https://web.archive.org/20111001171054/http://www.ms.ornl.gov/mpg/pdf/researchthrusts/AP_PTPposterv2.pdf|archivedate=October 1, 2011}}</ref> |
Photonic curing is used as a thermal processing technique in the manufacturing of [[printed electronics]] as it allows the substitution of glass or ceramic substrate materials with inexpensive and flexible substrate materials such as polymers or paper. The effect can be demonstrated with an ordinary camera flash.<ref name="Patent">US Pat. #7,820,097.</ref> Industrial photonic curing systems are typically water cooled and have controls and features similar to industrial [[lasers]]. The pulse rate can be fast enough to allow curing on the fly at speeds beyond 100 m/min making it suitable as a curing process for [[roll-to-roll processing]]. Material processing rates can exceed 1 m<sup>2</sup>/s.<ref name="Schroder 2006" /><ref name="ORNL poster">{{cite web|url=http://www.ms.ornl.gov/mpg/pdf/researchthrusts/AP_PTPposterv2.pdf|title=NovaCentrix R&D 100 Award Winner, 2009|accessdate=July 18, 2011|deadurl=yes|archiveurl=https://web.archive.org/20111001171054/http://www.ms.ornl.gov/mpg/pdf/researchthrusts/AP_PTPposterv2.pdf|archivedate=October 1, 2011}}</ref> |
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The maturing complexity of modern printed electronics for customer applications demands high throughput manufacturing and improved device function. The functionality of the printed electronics is critically important as customers demand more out of each device. Multiple layers are designed into each device, requiring ever more versatile processing techniques. Photonic curing is uniquely suited to complement the processing needs in the manufacture of modern printed electronics. The photonic curing process can provide a fast, reliable and transformative processing step to meet the most demanding production designs. Photonic curing enables lower thermal processing budget with current materials, and it can provide a path to incorporate more advanced materials and functionality into future printed electronics. |
The maturing complexity of modern printed electronics for customer applications demands high throughput manufacturing and improved device function. The functionality of the printed electronics is critically important as customers demand more out of each device. Multiple layers are designed into each device, requiring ever more versatile processing techniques. Photonic curing is uniquely suited to complement the processing needs in the manufacture of modern printed electronics. The photonic curing process can provide a fast, reliable and transformative processing step to meet the most demanding production designs. Photonic curing enables lower thermal processing budget with current materials, and it can provide a path to incorporate more [http://www.novacentrix.com/products/metalon-inks advanced materials and functionality] into future printed electronics. |
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==Development== |
==Development== |
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Photonic curing is similar to Pulse Thermal Processing, developed at [[Oak Ridge National Laboratory]], in which a plasma arc lamp is used. In the case of photonic curing, the radiant power is higher and the pulse length is shorter. The total radiant exposure per pulse is less with photonic curing, but the pulse rate is much faster.<ref name="ORNL">{{cite web|url=http://www.ms.ornl.gov/mpg/AP_ptp.shtml|title=Materials Process Group, OakRidge|accessdate=July 19, 2011|deadurl=yes|archiveurl=https://web.archive.org/20111001171107/http://www.ms.ornl.gov/mpg/AP_ptp.shtml|archivedate=October 1, 2011}}</ref> |
Photonic curing is similar to Pulse Thermal Processing, developed at [[Oak Ridge National Laboratory]], in which a plasma arc lamp is used. In the case of photonic curing, the radiant power is higher and the pulse length is shorter. The total radiant exposure per pulse is less with photonic curing, but the pulse rate is much faster.<ref name="ORNL">{{cite web|url=http://www.ms.ornl.gov/mpg/AP_ptp.shtml|title=Materials Process Group, OakRidge|accessdate=July 19, 2011|deadurl=yes|archiveurl=https://web.archive.org/20111001171107/http://www.ms.ornl.gov/mpg/AP_ptp.shtml|archivedate=October 1, 2011}}</ref> |
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Photonic Curing was developed by [http://www.novacentrix.com/about_us#OurHistory Nanotechnologies, Inc]. (now NovaCentrix) and is incorporated into their PulseForge tools.<ref name="Novacentrix site">{{cite web|url=http://www.novacentrix.com/products/overview|title=Photonic Curing Equipment|last=|first=|date=|website=|publisher=|access-date=|accessdate=July 11, 2016|deadurl=yes|archiveurl=http://www.novacentrix.com/products/overview|archivedate=July 11, 2016}}</ref> Xenon Corporation markets photonic curing machines under the brand name Sinteron.<ref name="Xenon site">{{cite web|url=http://www.xenoncorp.com/print_mkt.html|title=Thank You for registering with Xenon Corporation|publisher=Xenoncorp.com|accessdate=24 December 2014}}</ref> Dresden Thin Film also markets capabilities based on the same physics.<ref name="DTF site">{{cite web|url=http://www.thin-film.de/fileadmin/medien/Website/Dokumente/Download_Center/Technische_Informationen/No2_FLA.pdf|title=Dresden Thin Film Technology|accessdate=July 18, 2011|deadurl=yes|archiveurl=https://web.archive.org/20120327205636/http://www.thin-film.de/fileadmin/medien/Website/Dokumente/Download_Center/Technische_Informationen/No2_FLA.pdf|archivedate=March 27, 2012}}</ref> Photonic curing was introduced at the 2006 NSTI conference and is sometimes referred to as “photonic sintering” since the first application was the sintering of nanosilver and nanocopper inks to form conductive traces on plastic and paper.<ref name="Schroder 2006" /> In addition to sintering metals and ceramics, photonic curing is also used to dry thin films, modulate chemical reactions, and anneal semiconductors such as amorphous silicon.<ref name="Schroder 2006" /> |
Photonic Curing was developed<ref>{{Cite web|url=http://www.novacentrix.com/sites/default/files/pdf/Schroder-NSTI-2006.pdf|title=Broadcast Photonic Curing of Metallic Nanoparticle Films|last=|first=|date=|website=|publisher=|access-date=}}</ref> by [http://www.novacentrix.com/about_us#OurHistory Nanotechnologies, Inc]. (now NovaCentrix) and is incorporated into their PulseForge tools.<ref name="Novacentrix site">{{cite web|url=http://www.novacentrix.com/products/overview|title=Photonic Curing Equipment|last=|first=|date=|website=|publisher=|access-date=|accessdate=July 11, 2016|deadurl=yes|archiveurl=http://www.novacentrix.com/products/overview|archivedate=July 11, 2016}}</ref> Xenon Corporation markets photonic curing machines under the brand name Sinteron.<ref name="Xenon site">{{cite web|url=http://www.xenoncorp.com/print_mkt.html|title=Thank You for registering with Xenon Corporation|publisher=Xenoncorp.com|accessdate=24 December 2014}}</ref> Dresden Thin Film also markets capabilities based on the same physics.<ref name="DTF site">{{cite web|url=http://www.thin-film.de/fileadmin/medien/Website/Dokumente/Download_Center/Technische_Informationen/No2_FLA.pdf|title=Dresden Thin Film Technology|accessdate=July 18, 2011|deadurl=yes|archiveurl=https://web.archive.org/20120327205636/http://www.thin-film.de/fileadmin/medien/Website/Dokumente/Download_Center/Technische_Informationen/No2_FLA.pdf|archivedate=March 27, 2012}}</ref> Photonic curing was introduced at the 2006 NSTI conference and is sometimes referred to as “photonic sintering” since the first application was the sintering of nanosilver and nanocopper inks to form conductive traces on plastic and paper.<ref name="Schroder 2006" /> In addition to sintering metals and ceramics, photonic curing is also used to dry thin films, modulate chemical reactions, and anneal semiconductors such as amorphous silicon.<ref name="Schroder 2006" /> |
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<ref name="West 2010">J. West, M. Carter, S. Smith, and J. Sears, Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, 2, 210-213, 2010.</ref><ref name="PF3300">{{cite web|url=http://www.novacentrix.com/images/downloads/3300_Brochure_Web.pdf|format=PDF|title=Plus Forge 3300 : Manufacturing Development and Production Semiconductor and Photovoltaic Materials|publisher=Novacentrix.com|accessdate=23 December 2014}}</ref> Beside semiconductor applications also large area substrates are being post treated by flash lamp annealing systems, like in the architectural glass coating or display manufacturing industry. Therefore large flash lamp annealing systems with a single tube length up to 3.8 m can be used instead of furnace annealing. The 3.8 m tubes (with arc length of 3.72 m) are the longest flash lamps ever manufactured. <ref>http://www.vonardenne.biz/fileadmin/user_upload/druckschriften/Flash_Lamp_Annealing_english.pdf</ref> |
<ref name="West 2010">J. West, M. Carter, S. Smith, and J. Sears, Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, 2, 210-213, 2010.</ref><ref name="PF3300">{{cite web|url=http://www.novacentrix.com/images/downloads/3300_Brochure_Web.pdf|format=PDF|title=Plus Forge 3300 : Manufacturing Development and Production Semiconductor and Photovoltaic Materials|publisher=Novacentrix.com|accessdate=23 December 2014}}</ref> Beside semiconductor applications also large area substrates are being post treated by flash lamp annealing systems, like in the architectural glass coating or display manufacturing industry. Therefore large flash lamp annealing systems with a single tube length up to 3.8 m can be used instead of furnace annealing. The 3.8 m tubes (with arc length of 3.72 m) are the longest flash lamps ever manufactured. <ref>http://www.vonardenne.biz/fileadmin/user_upload/druckschriften/Flash_Lamp_Annealing_english.pdf</ref> |
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Revision as of 18:57, 14 July 2016
Photonic curing is the high-temperature thermal processing of a thin film using pulsed light from a flashlamp.[1] When this transient processing is done on a low-temperature substrate such as plastic or paper, it is possible to attain a significantly higher temperature than the substrate can ordinarily withstand under an equilibrium heating source such as an oven.[1][2] Since the rate of most thermal curing processes (drying, sintering, reacting, annealing, etc.) generally increase exponentially with temperature (i.e. they obey the Arrhenius equation), this process allows materials to be cured much more rapidly than with an oven.[2][3]
It has become a transformative process used in the manufacture of printed electronics as it allows inexpensive and flexible substrates to be substituted for traditional glass or ceramic substrates. Additionally, the higher temperature processing afforded by photonic curing reduces the processing time exponentially, often from minutes down to milliseconds, which increases throughput all while maintaining a small machine footprint.
Uses
Photonic curing is used as a thermal processing technique in the manufacturing of printed electronics as it allows the substitution of glass or ceramic substrate materials with inexpensive and flexible substrate materials such as polymers or paper. The effect can be demonstrated with an ordinary camera flash.[4] Industrial photonic curing systems are typically water cooled and have controls and features similar to industrial lasers. The pulse rate can be fast enough to allow curing on the fly at speeds beyond 100 m/min making it suitable as a curing process for roll-to-roll processing. Material processing rates can exceed 1 m2/s.[2][5]
The maturing complexity of modern printed electronics for customer applications demands high throughput manufacturing and improved device function. The functionality of the printed electronics is critically important as customers demand more out of each device. Multiple layers are designed into each device, requiring ever more versatile processing techniques. Photonic curing is uniquely suited to complement the processing needs in the manufacture of modern printed electronics. The photonic curing process can provide a fast, reliable and transformative processing step to meet the most demanding production designs. Photonic curing enables lower thermal processing budget with current materials, and it can provide a path to incorporate more advanced materials and functionality into future printed electronics.
Development
Photonic curing is similar to Pulse Thermal Processing, developed at Oak Ridge National Laboratory, in which a plasma arc lamp is used. In the case of photonic curing, the radiant power is higher and the pulse length is shorter. The total radiant exposure per pulse is less with photonic curing, but the pulse rate is much faster.[6]
Photonic Curing was developed[7] by Nanotechnologies, Inc. (now NovaCentrix) and is incorporated into their PulseForge tools.[8] Xenon Corporation markets photonic curing machines under the brand name Sinteron.[9] Dresden Thin Film also markets capabilities based on the same physics.[10] Photonic curing was introduced at the 2006 NSTI conference and is sometimes referred to as “photonic sintering” since the first application was the sintering of nanosilver and nanocopper inks to form conductive traces on plastic and paper.[2] In addition to sintering metals and ceramics, photonic curing is also used to dry thin films, modulate chemical reactions, and anneal semiconductors such as amorphous silicon.[2] [11][12] Beside semiconductor applications also large area substrates are being post treated by flash lamp annealing systems, like in the architectural glass coating or display manufacturing industry. Therefore large flash lamp annealing systems with a single tube length up to 3.8 m can be used instead of furnace annealing. The 3.8 m tubes (with arc length of 3.72 m) are the longest flash lamps ever manufactured. [13]
References
- ^ a b K. A. Schroder, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Trade Show, 2, 220-223, 2011.
- ^ a b c d e K. A. Schroder, S. C. McCool, W. R. Furlan, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, 3, 198-201, 2006.
- ^ "In flexible electronics, it's all about protecting the paper". Research & Development. Retrieved 24 December 2014.
- ^ US Pat. #7,820,097.
- ^ "NovaCentrix R&D 100 Award Winner, 2009" (PDF). Archived from the original (PDF) on October 1, 2011. Retrieved July 18, 2011.
{{cite web}}: Unknown parameter|deadurl=ignored (|url-status=suggested) (help) - ^ "Materials Process Group, OakRidge". Archived from the original on October 1, 2011. Retrieved July 19, 2011.
{{cite web}}: Unknown parameter|deadurl=ignored (|url-status=suggested) (help) - ^ "Broadcast Photonic Curing of Metallic Nanoparticle Films" (PDF).
- ^ "Photonic Curing Equipment". Retrieved July 11, 2016.
{{cite web}}: Check|archiveurl=value (help); Unknown parameter|deadurl=ignored (|url-status=suggested) (help) - ^ "Thank You for registering with Xenon Corporation". Xenoncorp.com. Retrieved 24 December 2014.
- ^ "Dresden Thin Film Technology" (PDF). Archived from the original (PDF) on March 27, 2012. Retrieved July 18, 2011.
{{cite web}}: Unknown parameter|deadurl=ignored (|url-status=suggested) (help) - ^ J. West, M. Carter, S. Smith, and J. Sears, Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, 2, 210-213, 2010.
- ^ "Plus Forge 3300 : Manufacturing Development and Production Semiconductor and Photovoltaic Materials" (PDF). Novacentrix.com. Retrieved 23 December 2014.
- ^ http://www.vonardenne.biz/fileadmin/user_upload/druckschriften/Flash_Lamp_Annealing_english.pdf